Device under test board and testing method

• US 6,486,690 B1
• Filed: 03/09/2000
• Issued: 11/26/2002
• Est. Priority Date: 11/05/1999
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Takagi, Ryoichi, Hyozo, Masahiko
• Primary Examiner(s): Sherry, Michael
• Assistant Examiner(s): NGUYEN, TRUNG Q
• Application Number:
  US09/522,014
• Time in Patent Office: 992 Days
• Field of Search: 324/754, 324/765, 324/757, 324/755, 324/763, 324/764, 324/347, 324/758, 324/759, 439/70, 439/71, 439/66, 439/82, 361/767, 361/769, 361/771, 361/774, 361/777
• US Class Current: 324/756.07
• CPC Class Codes: G01R 1/07371 using an intermediate card or back card with apertures through which the probes pass

Abstract

A device under test (DUT) board for testing is electrically connected to a solder ball of a package. A contactor of the board is directly attached to the solder ball. Thus, there is little influence by bouncing of a power source and ground, even when an LSI under test is operated at high speed and low voltage, and malfunctions are rare.

Claims

1. A device under test (DUT) board for testing a device having a package including an electrode, by being electrically connected with the electrode of the package, the DUT board comprising:

a contactor for direct contact with an electrode of a package upon mounting of the electrode on the DUT board, wherein said contactor is an elastic metallic plate having a U-shaped slit, a first part defined by the U-shaped slit, and a second part that is planar, the first part being bent with respect to the second part;

a guiding mechanism for maintaining a position of the electrode of the package; and

a pushing mechanism for pressing the electrode of the package against said contactor.

2. The DUT board according to claim 1, wherein said first part is partly curved in cross-section.

3. The DUT board according to claim 1, wherein said first part is partly planar in cross-section.

4. The DUT board according to claim 1, including parallel lines located on a surface of said first part, along the slit.

5. The DUT board according to claim 1, including a dot-like protrusion located on a surface of said first part, along the slit.

6. A testing method using the DUT board according to claim 1, wherein the electrode of the package is freely mountable and dismountable on said contactor to reduce inductance.

7. A device under test (DUT) board for testing a device having a package including an electrode, by being electrically connected with the electrode of the package, the DUT board comprising:

a contactor for direct contact with an electrode of a package upon mounting of the electrode on the DUT board, wherein said contactor is a strip of an elastic metallic plate, the metallic plate having a slit in a longitudinal direction proximate a center of the strip, said metallic plate is bent in opposite directions adjacent the slit to form a V shape, in cross section, for receiving and contacting the electrode; and

a slide movable away from and toward the contactor for opening and closing the V shape of said contactor.

8. The DUT board according to claim 7, further comprising a structure for separating the device from the DUT board and for securing the device to the DUT board.

9. A testing method using the DUT board according to claim 8, wherein the DUT board is freely mountable and dismountable to reduce inductance.

10. A testing method using the DUT board according to claim 7, wherein the electrode of the package is freely mountable and dismountable on said contactor to reduce inductance.

11. A device under test (DUT) board for testing a device having a package including an electrode, by being electrically connected with the electrode of the package, the DUT board comprising:

a contactor for direct contact with an electrode of a package upon mounting of the electrode on the DUT board, wherein said contactor is a strip of an elastic metallic plate, the metallic plate having a slit in a longitudinal direction proximate a center of the strip, said metallic plate is bent in opposite directions adjacent the slit to form a V shape, in cross section, for receiving and contacting the electrode;

a guiding mechanism for maintaining a position of the electrode of the package; and

a pushing mechanism for pressing the electrode of the package against said contactor.

12. A device under test (DUT) board for testing a device having a package including an electrode by being electrically connected with the electrode of the package, the DUT board comprising:

a contactor having a patterned principal surface for connection to the electrode of the package upon mounting of the package on the DUT board;

a guiding mechanism for maintaining a position of the electrode of the package;

a pushing mechanism for pressing the electrode of the package against said contactor; and

an electrically conductive rubber located between the electrode of the package and said contactor.

13. The DUT board according to claim 12, further comprising a structure for separating the device from the DUT board and for securing the device to the DUT board.

14. A testing method using the DUT board according to claim 13, wherein the DUT board is freely mountable and dismountable to reduce inductance.

15. A testing method using the DUT board according to claim 12, wherein the electrode of the package is freely mountable and dismountable on said contactor to reduce inductance.

16. The DUT board according to claim 12, wherein the electrically conductive rubber is electrically isolated from other electrodes of the package.