Thermally conductive electronic device case

• US 6,487,073 B2
• Filed: 11/29/2000
• Issued: 11/26/2002
• Est. Priority Date: 12/01/1999
• Status: Expired due to Term

• Current Assignee: Ticona Polymers, Inc. (Celanese Corporation)
• Original Assignee: Cool Options, Inc.
• Inventors: Sagal, E. Mikhail, McCullough, Kevin A., Miller, James D.
• Primary Examiner(s): Schuberg, Darren
• Assistant Examiner(s): CHANG, YEAN HSI
• Application Number:
  US09/726,141
• Publication Number:
  US 20020064024A1
• Time in Patent Office: 727 Days
• Field of Search: 361/688, 361/704, 361/709-712, 361/714, 361/717-720, 361/722, 361/687
• US Class Current: 361/679.54
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
• CPC Class Codes: H05K 9/0022 of components mounted on printed circuit boards [PCB] shields integrated within component packages H01L23/552; shields integrated within PCB H05K1/0218

Abstract

A case for dissipating heat from an electronic device is provided. The case includes an electronic circuit board with a heat generating electronic component installed thereon. A shield is positioned over the electronic component to protect it from electromagnetic interference. The shield includes an aperture through its top surface. A heat transfer conduit is molded into and through the aperture to contact the top surface of the heat generating electronic component. Outer housing, which is made of a thermally conductive material, is placed into contact with the top surface of the heat transfer conduit which extends outside the shield. As a result, heat is dissipated from the electronic component and through the housing of the electronic device via the heat transfer conduit while shielding the electronic component from electromagnetic interference.

Claims

1. A case for dissipating heat from an electronic device, comprising:

an electronic circuit board;

a heat generating electronic component disposed on said circuit board; and

a housing positioned about said electronic circuit board and said heat generating electronic component;

said housing being made of a net-shaped moldable thermally conductive composite material of a polymer base matrix with thermally conductive filler therein;

said housing being in thermal communication with said electronic component with heat being dissipating from said heat generating electronic component and through said housing.

2. The case of claim 1, wherein said housing is injection molded.

3. The case of claim 1, wherein said heat generating electronic component is a semiconductor device.

8. The case of claim 1, wherein said housing and said heat transfer conduit are injection molded.

9. The case of claim 1, wherein said heat generating electronic component is a semiconductor device.

4. A case for dissipating heat from an electronic device, comprising:

an electronic circuit board;

a heat generating electronic component disposed on said circuit board;

a housing positioned about said electronic circuit board and said heat generating electronic component;

said housing being of a net-shaped moldable thermally conductive composite material of a polymer base matrix with thermally conductive filler therein;

a protrusion emanating from said housing corresponding and aligned with said heat generating electronic component;

said protrusion emanating from said housing; and

said protrusion being in thermal communication with said electronic component with heat being dissipating from said heat generating electronic component and through said housing via said protrusion.

5. The case of claim 4, wherein said housing is injection molded.

6. The case of claim 4, wherein said heat generating electronic component is a semiconductor device.

7. A case for dissipating heat from an electronic device, comprising:

an electronic circuit board;

a heat generating electronic component, having a top surface, disposed on said circuit board;

an electromagnetic interference shield positioned on said electronic circuit board with said heat generating electronic component residing therebetween;

said electromagnetic interference shield including a top surface with an aperture therethrough;

a heat transfer conduit molded into and through said aperture;

said heat transfer conduit being made of a thermally conducive material and having a top surface and a bottom surface;

a housing, being made of a net-shaped moldable thermally conductive composite material of a polymer base matrix with thermally conductive filler therein, being in thermal communication with said top surface of said heat transfer conduit;

said bottom surface of said heat transfer conduit being in thermal communication with said top surface of said heat generating electronic component;

whereby heat is dissipated from said from said heat generating electronic component via said heat transfer conduit through said electromagnetic interference shield and out said housing while said electromagnetic interference shield protects said heat generating electronic component from electromagnetic interference.