Method of forming an electronic component using ink
First Claim
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1. A manufacturing method of an electronic component comprising the steps of:
- (a) repeating a plurality of times a process of forming a specified ink pattern on a ceramic green sheet by an ink jet method by using an ink, wherein the ink includes one of a water solvent and an organic solvent, and a metal powder dispersed in the solvent, the metal powder contained in the ink is in a range of 1 wt. % to 80 wt. %, the metal powder has a particle size in a range of 0.001 μ
m to 10 μ
m, a viscosity of the ink is less than 2 poise, the inkjet method including a step of injecting droplets of the ink on a surface of the ceramic green sheet in accordance with the specified ink pattern, and the specified ink pattern is a pattern of an internal electrode, (b) laminating a plurality of the ceramic green sheets forming the specified ink pattern to form a raw laminated body of ceramic, (c) cutting the raw laminated body of ceramic to a specified shape and baking, and (d) forming an external electrode electrically connected to the internal electrode.
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Abstract
A method of manufacturing an electronic component utilizing an ink jet method using an ink including water or organic solvent, and one of metal powder, ceramic powder, magnetic powder, glass powder, and resistor powder with particle size of 0.001 μm or more to 10 μm or less, dispersed in this water or organic solvent, by 1 wt. % or more to 80 wt. % or less, at viscosity of 2 poise or less.
63 Citations
25 Claims
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1. A manufacturing method of an electronic component comprising the steps of:
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(a) repeating a plurality of times a process of forming a specified ink pattern on a ceramic green sheet by an ink jet method by using an ink, wherein the ink includes one of a water solvent and an organic solvent, and a metal powder dispersed in the solvent, the metal powder contained in the ink is in a range of 1 wt. % to 80 wt. %, the metal powder has a particle size in a range of 0.001 μ
m to 10 μ
m,a viscosity of the ink is less than 2 poise, the inkjet method including a step of injecting droplets of the ink on a surface of the ceramic green sheet in accordance with the specified ink pattern, and the specified ink pattern is a pattern of an internal electrode, (b) laminating a plurality of the ceramic green sheets forming the specified ink pattern to form a raw laminated body of ceramic, (c) cutting the raw laminated body of ceramic to a specified shape and baking, and (d) forming an external electrode electrically connected to the internal electrode.
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2. A manufacturing method of an electronic component comprising the steps of:
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(a) repeating a plurality of times a process of forming a first ink pattern on a ceramic green sheet by an ink jet method by using a first ink, wherein the first ink includes one of a water solvent and an organic solvent, and a metal powder dispersed in the solvent, the metal powder contained in the first ink is in a range of 1 wt. % to 80 wt. %, the metal powder has a particle size in a range of 0.001 μ
m to 10 μ
m,a viscosity of the first ink is less than 2 poise, the ink jet method including a step of injecting droplets of the first ink on a surface of the ceramic green sheet in accordance with the first ink pattern, and the first ink pattern is a pattern of an internal electrode, and forming a second ink pattern by an ink jet method by using a second ink, wherein the second ink includes one of a water solvent and an organic solvent, and a ceramic powder dispersed in the solvent, the ceramic powder contained in the second ink is in a range of 1 wt. % to 80 wt. %, the ceramic powder has a particle size in a range of 0.001 μ
m to 10 μ
m,a viscosity of the second ink is less than 2 poise, the ink jet method including a step of injecting droplets of the second ink on a surface of the ceramic green sheet in accordance with the second ink pattern, (b) laminating a plurality of the ceramic green sheets forming the first ink pattern and the second ink pattern to form a raw laminated body of ceramic, (c) cutting the raw laminated body of ceramic to a specified shape and baking, and (d) forming an external electrode electrically connected to the internal electrode.
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3. A manufacturing method of an electronic component comprising the steps of:
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(a) repeating a plurality of times a process of forming a first ink pattern on a ceramic green sheet by an ink jet method by using a first ink, wherein the first ink includes one of a water solvent and an organic solvent, and a metal powder dispersed in the solvent, the metal powder contained in the first ink is in a range of 1 wt. % to 80 wt. %, the metal powder has a particle size in a range of 0.001 μ
m to 10 μ
m,a viscosity of the first ink is less than 2 poise, the ink jet method including a step of injecting droplets of the first ink on a surface of the ceramic green sheet in accordance with the first ink pattern, and the first ink pattern is a pattern of an internal electrode, forming a second ink pattern by an ink jet method by using a second ink on the upper surface of the ceramic green sheet so as to cover said first ink pattern, and forming a ceramic layer integrated with the ceramic green sheet, wherein the second ink includes at least one solvent of water and organic solvent, and a ceramic powder dispersed in the solvent, the ceramic powder contained in the second ink is in a range of 1 wt. % to 80 wt. %, the ceramic powder has a particle size in a range of 0.001 μ
m to 10 μ
m,a viscosity of the second ink is less than 2 poise, the ink jet method including a step of injecting droplets of the second ink on a surface of the ceramic green sheet in accordance with the second ink pattern, (b) laminating a plurality of the ceramic green sheets having the ceramic layer to form a raw laminated body of ceramic, (c) cutting the raw laminated body of ceramic to a specified shape and baking, and (d) forming an external electrode electrically connected to the internal electrode.
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4. A manufacturing method of an electronic component comprising the steps of:
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(a) forming a pair of upper electrode layers on a confronting upper side of a substrate by a first ink jet method, the first ink jet method including a step of injecting droplets of a first ink, said first ink including an electronic conductive powder, (b) forming a resistance layer so as to straddle over the pair of upper electrode layers by a second ink jet method by using a second ink, wherein the second ink includes one of a water solvent and an organic solvent, and a resistance powder dispersed in the solvent, the resistance powder contained in the second ink is in a range of 1 wt. % to 80 wt. %, the resistance powder has a particle size in a range of 0.001 μ
m to 10 μ
m,a viscosity of the second ink is less than 2 poise, the second ink jet method including a step of injecting droplets of the second ink, (c) forming a glass projective layer to cover said resistance layer by a third ink jet method by using a third ink prepared by dispersing glass powder, said third ink jet method including a step of injecting droplets of the third ink.
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5. A manufacturing method of electronic component comprising the steps of:
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(a) forming a pair of upper electrode layers on a confronting upper side of a substrate by a first ink jet method, the first ink jet method including a step of injecting droplets of a first ink, said first ink including an electronic conductive powder, (b) forming a resistance layer so as to straddle over the pair of upper electrode layers by a second ink jet method by using a second ink, wherein the second ink includes one of a water solvent and an organic solvent, and a resistance powder dispersed in the solvent, the resistance powder contained in the second ink is in a range of 1 wt. % to 80 wt. %, the resistance powder has a particle size in a range of 0.001 μ
m to 10 μ
m,a viscosity of the second ink is less than 2 poise, the second ink jet method including a step of injecting droplets of the second ink, (c) forming a projective layer to cover said resistance layer by a third ink jet method by using a third ink prepared by dispersing a resin, said third ink jet method including a step of injecting droplets of the third ink.
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6. A manufacturing method of an electronic component comprising the steps of:
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injecting a magnetic ink and an electrode ink alternately in a specified pattern by an ink jet method, said magnetic ink prepared by dispersing magnetic powder in at least water or organic solvent, said magnetic powder having a particle size in a range of 0.001 μ
m to 10 μ
m, wt. % in a range of 1 to 80, and a viscosity of 2 poise or less,forming a block body of a three-dimensional structure having the electrode ink printed inside in a coil form so as to cover the electrode ink with the magnetic ink, and cutting this block body into a specified form and baking, wherein said ink jet method includes a step of injecting ink droplets of the ink.
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7. A manufacturing method of an electronic component comprising the steps of:
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forming a plurality of ceramic green sheets having an electrode pattern by repeating a plurality of times a process, said process including the step of injecting an electrode ink by an ink jet method on an upper surface of a ceramic green sheet having a base film with a penetrating via hole while forming an electrode pattern on the upper surface of said ceramic green sheet and in the via hole, and the step of filling at least the via hole with the electrode pattern and peeling off the base film, wherein the electrode ink includes one of a water solvent and an organic solvent, and a metal powder dispersed in the solvent, the metal powder contained in the electrode ink is in a range of 1 wt. % to 80 wt. %, the metal powder has a particle size in a range of 0.001 μ
m to 10 μ
m, and a viscosity of the electrode ink is less than 2 poise,said manufacturing method of electronic component further including the steps of;
laminating a desired number of the ceramic green sheets having the electrode pattern so as to connect between upper and lower electrode patterns electrically to form a raw laminated body of ceramic, cutting into a specified shape and baking, and forming an external electrode, wherein said ink jet method includes a step of injecting ink droplets of the ink.
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8. A manufacturing method of electronic component comprising the steps of:
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(a) preparing an ink by dispersing one powder selected from the group consisting of metal powder, ceramic powder, magnetic powder, glass powder, resistor powder, and resin powder, in a solvent, said ink having a viscosity of 2 poise or less, said powder having a particle size in a range of 0.001 μ
m to 10 μ
m, andsaid powder contained in said ink in a range of 1 wt. % to 80 wt. %, (b) forming an ink pattern by applying said ink on a base material, by an ink jet method, wherein the ink jet method includes a step of injecting droplets of the ink on a surface of the base material, thereby forming said ink pattern, (c) repeating a plurality of times the process of forming said ink pattern. - View Dependent Claims (9, 10, 11, 12, 13)
wherein said base material is a ceramic green sheet to be processed by baking, and further comprising the steps of: (d) forming a raw laminated body by laminating a plurality of said base materials forming an ink pattern, (e) forming a laminated body by cutting said raw laminated body into a specified shape, and baking, and (f) installing an external electrode on said laminated body.
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10. The manufacturing method of electronic component of claim 8,
wherein said solvent contains at least one of water, water-soluble solvent, and organic solvent. -
11. The manufacturing method of electronic component of claim 8, wherein said powder includes the metal powder, and said ink pattern is a pattern of an internal electrode.
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12. The manufacturing method of electronic component of claim 8, wherein:
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at said step (b), said ink is filled in an ink jet device, said ink jet device comprising;
an ink tank filled with said ink, a first tube for sucking the ink in the ink tank through a suction mechanism, an ink injection unit connected to the first tube for injecting a required amount of the ink, and a second tube connected to the ink injection unit for circulating the ink not injected from the ink injection unit into the ink tank.
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13. The manufacturing method of electronic component of claim 12, wherein said ink tank includes a dispersing machine.
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14. A manufacturing method of electronic component comprising the steps of:
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(a) preparing a first ink which includes a first powder, (b) injecting said first ink on a surface of a first ceramic green sheet while forming a first ink pattern on the surface of said first ceramic green sheet, and (c) baking said first ceramic green sheet including said first ink pattern, and forming a baked body, wherein;
said first ink includes one of a water solvent and an organic solvent, said first powder is dispersed in said solvent, said first powder contained in the ink is in a range of 1 wt. % to 80 wt. %, said first powder has a particle size in a range of 0.001 μ
m to 10 μ
m, anda viscosity of said first ink is less than 2 poise. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
(d) preparing a second ink which includes a second powder, (e) injecting said second ink on a surface of a second ceramic green sheet, and forming a second ink pattern on the surface of said second ceramic green sheet, and (f) laminating said first green sheet and said second green sheet, and forming a raw laminated body, wherein said (c) step includes a step of baking said raw laminated body, and forming said baked body.
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16. The manufacturing method of electronic component of claim 15, wherein said step of injecting said second ink at said step (e) includes a step of injecting droplets of said second ink.
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17. The manufacturing method of electronic component of claim 15, wherein:
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said first powder and said second powder include a metal powder, said first ink pattern and said second ink pattern form an internal electrode, said step (b) includes a further step of injecting a third ink on said first ceramic green sheet so as to cover said first ink pattern, said third ink including a ceramic powder, said step (e) includes a further step of injecting a fourth ink on said second ceramic green sheet so as to cover said second ink pattern.
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18. The manufacturing method of electronic component of claim 14, further comprising the step of:
(g) forming an external electrode on said baked body.
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19. The manufacturing method of electronic component of claim 14, wherein said step of injecting said first ink at said step (b) includes a step of injecting droplets of said first ink.
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20. The manufacturing method of electronic component of claim 14, wherein said first powder includes a metal powder, and said first ink pattern including said metal powder forms an internal electrode.
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21. The manufacturing method of electronic component of claim 14, wherein said first powder includes at least one powder selected from the group consisting of metal powder, ceramic powder, magnetic powder, glass powder, resistor powder, and resin powder.
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22. The manufacturing method of electronic component of claim 14, wherein said first powder includes a metal powder, said first ink pattern forms an internal electrode, and
said step (b) includes a further step of injecting a third ink on said first ceramic green sheet so as to cover said first ink pattern, said third ink including a ceramic powder. -
23. The manufacturing method of electronic component of claim 14, wherein:
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at said step (b), said first ink is filled in an ink jet device, said ink jet device comprising;
a first tube for sucking the first ink in the first ink tank through a suction mechanism, an ink injection unit connected to the first tube for injecting a required amount of the ink, and a second tube connected to the ink injection unit for circulating the first ink not injected from the ink injection unit into the first ink tank.
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24. The manufacturing method of electronic component of claim 14, wherein said method includes providing a first ink tank, said first ink tank includes a dispersing machine.
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25. A manufacturing method of electronic component comprising the steps of:
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(a) preparing a first ink which includes a first powder, (b) injecting said first ink on a surface of a first ceramic green sheet while forming a first ink pattern on the surface of said first ceramic green sheet, (c) baking said first ceramic green sheet including said first ink pattern, and forming a baked body, (d) preparing a second ink which includes a second powder, (e) injecting said second ink on a surface of a second ceramic green sheet, and forming a second ink pattern on the surface of said second ceramic green sheet, and (f) laminating said first green sheet and said second green sheet, and forming a raw laminated body, wherein said (c) step includes a step of baking said raw laminated body, and forming said baked body, wherein each ink of said first ink and said second ink includes one of a water solvent and an organic solvent, each powder of said first powder and said second powder is dispersed in said solvent, each powder of said first powder and said second powder contained in the ink is in a range of 1 wt. % to 80 wt. %, said each powder of said first powder and said second powder has a particle size in a range of 0.001 μ
m to 10 μ
m, anda viscosity of said each of said first ink and said second ink is less than 2 poise.
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Specification