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Method of forming an electronic component using ink

  • US 6,487,774 B1
  • Filed: 12/21/1999
  • Issued: 12/03/2002
  • Est. Priority Date: 01/22/1998
  • Status: Expired due to Fees
First Claim
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1. A manufacturing method of an electronic component comprising the steps of:

  • (a) repeating a plurality of times a process of forming a specified ink pattern on a ceramic green sheet by an ink jet method by using an ink, wherein the ink includes one of a water solvent and an organic solvent, and a metal powder dispersed in the solvent, the metal powder contained in the ink is in a range of 1 wt. % to 80 wt. %, the metal powder has a particle size in a range of 0.001 μ

    m to 10 μ

    m, a viscosity of the ink is less than 2 poise, the inkjet method including a step of injecting droplets of the ink on a surface of the ceramic green sheet in accordance with the specified ink pattern, and the specified ink pattern is a pattern of an internal electrode, (b) laminating a plurality of the ceramic green sheets forming the specified ink pattern to form a raw laminated body of ceramic, (c) cutting the raw laminated body of ceramic to a specified shape and baking, and (d) forming an external electrode electrically connected to the internal electrode.

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