Method of manufacturing a taped semiconductor device
First Claim
Patent Images
1. A method of making semiconductor devices, said method comprising the steps of:
- providing a semiconductor product having integrated circuits;
providing a tape having an adhesive layer, a dielectric layer, and electrically conductive leads;
adhering said tape to said semiconductor product; and
electrically connecting said integrated circuits to said electrically conductive leads, said step of adhering the tape comprising curing the adhesive layer to ninety percent of its maximum strength within twenty-four to thirty-six hours at room temperature.
7 Assignments
0 Petitions
Accused Products
Abstract
Printed tape is used to form a leads on chip (LOC) ball grid array (BGA) semiconductor device. Leads for a plurality of devices may be applied simultaneously. Bond wires, glob top encapsulant, and the ball grid arrays for the devices may be formed in single process steps. A low temperature curing adhesive material may be used to reduce the effects of differential thermal expansion between the tape and surface of the wafer. In another embodiment of the invention, anisotropically conductive adhesive material is used to connect bond pads on a wafer to leads printed on a tape.
-
Citations
12 Claims
-
1. A method of making semiconductor devices, said method comprising the steps of:
-
providing a semiconductor product having integrated circuits;
providing a tape having an adhesive layer, a dielectric layer, and electrically conductive leads;
adhering said tape to said semiconductor product; and
electrically connecting said integrated circuits to said electrically conductive leads, said step of adhering the tape comprising curing the adhesive layer to ninety percent of its maximum strength within twenty-four to thirty-six hours at room temperature. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A method of making taped products, said method comprising the steps of:
-
providing a sheet having electrically conductive leads and an epoxy adhesive layer;
aligning said sheet with respect to integrated circuits; and
curing said adhesive layer to ninety percent of its maximum strength within twenty-four to thirty-six hours at room temperature. - View Dependent Claims (8, 9, 10, 11, 12)
-
Specification