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Method of manufacturing a taped semiconductor device

  • US 6,489,183 B1
  • Filed: 07/20/2000
  • Issued: 12/03/2002
  • Est. Priority Date: 07/17/1998
  • Status: Expired due to Term
First Claim
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1. A method of making semiconductor devices, said method comprising the steps of:

  • providing a semiconductor product having integrated circuits;

    providing a tape having an adhesive layer, a dielectric layer, and electrically conductive leads;

    adhering said tape to said semiconductor product; and

    electrically connecting said integrated circuits to said electrically conductive leads, said step of adhering the tape comprising curing the adhesive layer to ninety percent of its maximum strength within twenty-four to thirty-six hours at room temperature.

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