Base current reversal SRAM memory cell and method
First Claim
1. A method of forming a memory cell comprising:
- forming a series of epitaxial layers on a substrate;
etching trenches through the series of epitaxial layers to form a series of bars;
forming an oxide under the bars to electrically isolate the bars from the substrate;
forming a NPN bipolar transistor on top of the oxide; and
forming a PMOS FET having a source, the PMOS FET formed on top of the NPN bipolar transistor and within one of the trenches, the NPN bipolar transistor formed in the source of the PMOS FET.
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Abstract
A SRAM memory cell including an access device formed on a storage device is described. The storage device has at least two stable states that may be used to store information. In operation, the access device is switched ON to allow a signal representing data to be coupled to the storage device. The storage device switches to a state representative of the signal and maintains this state after the access device is switched OFF. When the access device is switched ON, the state of the storage device may be sensed to read the data stored in the storage device. The memory cell may be formed to be unusually compact and has a reduced power supply requirements compared to conventional SRAM memory cells. As a result, a compact and robust SRAM having reduced standby power requirements is realized.
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Citations
12 Claims
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1. A method of forming a memory cell comprising:
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forming a series of epitaxial layers on a substrate;
etching trenches through the series of epitaxial layers to form a series of bars;
forming an oxide under the bars to electrically isolate the bars from the substrate;
forming a NPN bipolar transistor on top of the oxide; and
forming a PMOS FET having a source, the PMOS FET formed on top of the NPN bipolar transistor and within one of the trenches, the NPN bipolar transistor formed in the source of the PMOS FET. - View Dependent Claims (2)
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3. A method of forming an array of memory cells, comprising:
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forming a plurality of epitaxial layers on a substrate;
etching trenches through the plurality of epitaxial layers to form columns of epitaxial layers;
forming an oxide under the columns of epitaxial layers;
forming storage devices in a lower layer of the epitaxial layers of the columns; and
forming access elements within the trenches and on a surface of the columns. - View Dependent Claims (4, 5, 6, 7)
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8. A method of forming a memory cell comprising:
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forming a stack of epitaxial layers on a substrate, the stack having a sidewall surface;
forming an oxide under the stack of epitaxial layers;
forming a storage device in a first layer of the epitaxial layers of the stack; and
forming an access element on the sidewall surface of the stack. - View Dependent Claims (9, 10, 11, 12)
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Specification