Hybrid integrated circuit device

• US 6,489,637 B1
• Filed: 03/28/2000
• Issued: 12/03/2002
• Est. Priority Date: 06/09/1999
• Status: Expired due to Term

• Current Assignee: III Holdings 2, LLC (Intellectual Ventures LLC)
• Original Assignee: Sanyo Electric Company Limited (Panasonic Holdings Corporation)
• Inventors: Kobayashi, Yoshiyuki, Sakamoto, Noriaki, Shimizu, Hisashi, Ota, Susumu
• Primary Examiner(s): Lee, Eddie
• Assistant Examiner(s): Brock, II, Paul E
• Application Number:
  US09/536,730
• Time in Patent Office: 980 Days
• Field of Search: 257/79, 257/88, 257/91, 257/98, 257/99, 257/100
• US Class Current: 257/98
• CPC Class Codes: F21V 29/00 Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems lighting fixtures combined with outlets for air-treatment systems F24F13/078
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

In a light irradiation device in which a light emitting element is attached to a printed circuit board, the heat radiation properties are enhanced, and improvement of the light emitting efficiency and reduction of the size and weight are realized. A Cu pattern covered with Ni is formed on a metal substrate 11. Light emitting elements 11 are mounted on the pattern in the form of a series circuit. Metal substrates in each of which the series connection is formed are connected to one another in parallel. Since Ni has excellent corrosion resistance and a high reflection efficiency, the surfaces of the substrates themselves can be used as reflective plates. A lens 37 is formed for each of the light emitting elements, whereby the emission efficiency can be further improved.

Flow-stopping means 36 made of a brazing material is formed around each of the light emitting diodes 10. Also the surface of the brazing material is used as a reflecting surface.

Claims

1. A hybrid integrated circuit device comprising:

first and second electrodes formed on a substrate;

a light emitting element in which a rear face of said element is electrically fixed to said first electrode;

connecting means for electrically connecting said second electrode to an electrode on a surface of said light emitting element;

a flow-stopping means formed to substantially surround said light emitting element; and

a light transmitting resin disposed over the light emitting element and within a region surrounded by said flow-stopping means,

wherein the flow-stopping means comprises a first flow-stopping means made of a brazing material and a second flow-stopping means made of an insulating material is disposed in a portion of said brazing material, said portion overlapping with said first electrode and/or said second electrode.

2. A hybrid integrated circuit device according to claim 1, wherein said flow-stopping means is a ring made of an insulating resin.

3. A hybrid integrated circuit device according to claim 1, wherein the second flow-stopping means is made of epoxy resin, and the light transmitting resin is made of silicone resin.

4. A hybrid integrated circuit device according to claim 1, wherein the first and second electrodes are made of reflective material.

5. A hybrid integrated circuit device according to claim 1, wherein the first and second electrodes are made of nickel.

6. A hybrid integrated circuit device according to claim 1, further comprising a solder resist layer formed so as to cover the first and second electrodes.

7. A hybrid integrated circuit device according to claim 1, wherein said substrate is made of a metal substrate whose surface is insulated.

8. A circuit device comprising:

a substrate;

a first wiring region of a reflective conductive film at one end of the substrate;

a second wiring region at the other end of the substrate; and

a plurality of the hybrid integrated circuit devices of claim 1 connected in series,

wherein the first wiring region, the hybrid integrated circuit devices of claim 1, and the second wiring region are connected in series.

10. A hybrid integrated circuit device according to claim 1, wherein said first electrode is formed in an annular shape to substantially surround said second electrode, and said brazing material is formed on said first electrode in a substantially annular shape.

11. A hybrid integrated circuit device according to claim 1, wherein said first electrode is formed in an annular shape to substantially surround said second electrode, and said region where said brazing material is formed is formed in a substantially island-like shape in said first electrode.

13. A circuit device, comprising:

a plurality of said hybrid integrated circuit devices of claim 1 connected in series.

14. A hybrid integrated circuit device according to claim 1, wherein the light transmitting resin has a two stage structure to introduce a light emitted by the light emitting elements into a front direction.

15. A hybrid integrated circuit device according to claim 1, wherein said flow-stopping means upwardly reflects light emitted from said light emitting element.

9. A hybrid integrated circuit device comprising:

first and second electrodes insulatedly formed on a hybrid integrated circuit substrate made of Cu;

a light emitting element in which a rear face of said element is electrically fixed to said first electrode;

connecting means for electrically connecting said second electrode to an electrode on a surface of said light emitting element;

first flow-stopping means which is formed around said light emitting element; and

a light transmitting resin protrudingly disposed over the light emitting element and within a region surrounded by said first flow-stopping means,

a metal film covers said first electrode and/or said second electrode, said metal film being inferior in wettability with respect to a brazing material and superior in light reflection than the Cu;

a portion of said metal film corresponding to said first electrode and/or said second electrode and in a region where said first flow-stopping means is disposed is removed away, and a brazing material is formed in said region.

12. A hybrid integrated circuit device, comprising:

first and second electrodes insulatedly formed on a hybrid integrated circuit substrate made of Cu;

a light emitting element in which a rear face of said element is electrically fixed to said first electrode;

connecting means for electrically connecting said second electrode to an electrode on a surface of said light emitting element;

first flow-stopping means which is formed around said light emitting element; and

a light transmitting resin protrudingly disposed over the light emitting element and within a region surrounded by said first flow-stopping means,

a metal film covers said first electrode and/or said second electrode, said metal film being inferior in wettability with respect to a brazing material and superior in light reflection than the Cu;

a portion of said metal film corresponding to said first electrode and/or said second electrode and in a region where said first flow-stopping means is disposed is removed away, and a brazing material is formed in said region,

wherein said metal film is made of Ni.