Sealed symmetric multilayered microelectronic device package with integral windows

• US 6,489,670 B1
• Filed: 02/01/2002
• Issued: 12/03/2002
• Est. Priority Date: 05/16/2000
• Status: Expired due to Term

• Current Assignee: National Technology & Engineering Solutions Of Sandia LLC (Honeywell International Inc.)
• Original Assignee: Sandia Corporation (Martin Marietta Corporation)
• Inventors: Peterson, Kenneth A., Watson, Robert D.
• Primary Examiner(s): Talbott, David L.
• Assistant Examiner(s): Thai, Luan
• Application Number:
  US10/061,422
• Time in Patent Office: 305 Days
• Field of Search: 257/686, 257/680, 257/685, 257/704, 257/711, 257/678, 257/684, 257/737, 257/774, 257/780, 257/434, 257/433, 257/432
• US Class Current: 257/686
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 27/14618 : Containers
• CPC Class Codes: H01L 27/14636 : Interconnect structures
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/16235 : Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/16788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H05K 1/02 : Details
• CPC Class Codes: H05K 1/181 : associated with surface mounted components

Abstract

A sealed symmetric multilayered package with integral windows for housing one or more microelectronic devices. The devices can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the windows being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic devices can be flip-chip bonded and oriented so that the light-sensitive sides are optically accessible through the windows. The result is a compact, low-profile, sealed symmetric package, having integral windows that can be hermetically-sealed.

Claims

1. A sealed symmetric package having at least two integral windows for packaging at least two microelectronic devices, comprising a first package and a second package joined together;

wherein the first package comprises;

a first electrically insulating plate comprising a multilayered material having a first surface, an opposing second surface, and a first aperture disposed through said first plate;

an electrically conductive metallized trace disposed on the second surface of said first plate;

an integral window disposed across the first aperture and bonded to said first plate, for providing optical access to a microelectronic device disposed within said assembly; and

a second electrically insulating plate having a third surface, an opposing fourth surface, and a second aperture disposed through said second plate;

an electrically conductive metallized trace disposed on the fourth surface of the second plate;

wherein the first plate is attached to the second plate by joining the second surface to the third surface; and

wherein the second aperture is larger than the first aperture; and

wherein the second package comprises a package substantially identical to the first package; and

wherein the first package is inverted and bonded to the second package to form a sealed symmetric package.

2. The sealed symmetric package of claim 1, wherein, in the first package, the window substantially fills the first aperture.

3. The sealed symmetric package of claim 2, wherein, in the first package, the aperture-filling window is formed by casting a castable window material directly into the first aperture.

4. The sealed symmetric package of claim 3, wherein, in the first package, the castable window material comprises molten glass that solidifies after casting.

5. The sealed symmetric package of claim 3, wherein, in the first package, the castable window material comprises a liquid polymer that solidifies after casting.

6. The sealed symmetric package of claim 1, wherein, in the first package, said window is bonded to the first surface.

7. The sealed symmetric package of claim 1, wherein, in the first package, the geometry of the joint between the window and the first plate comprises an encased joint geometry.

8. The sealed symmetric package of claim 1, wherein, in the first package, said window is bonded to a lip recessed inside of the first plate.

9. The sealed symmetric package of claim 8, wherein, in the first package, said window is mounted flush with the first surface of the first plate.

10. The sealed symmetric package of claim 1, wherein, in the first package, said window comprises an optically transparent material selected from the group consisting of glass, sapphire, fused silica, plastic, and polymer.

11. The sealed symmetric package of claim 1, wherein, in the first package, further comprising a surface treatment to improve wettability and adhesion of mating surfaces.

12. The sealed symmetric package of claim 1, wherein, in the first package, said window comprises an anti-reflection coating.

13. The sealed symmetric package of claim 1, wherein, in the first package, said window comprises means for filtering selected wavelengths of light.

14. The sealed symmetric package of claim 1, wherein, in the first package, the second plate comprises the same multilayered material as the first plate.

15. The sealed symmetric package of claim 14, wherein said multilayered material comprises a high-temperature cofired ceramic multilayered material fired at a temperature in the range of 1300°

C. to 1800°

C.

16. The sealed symmetric package of claim 14, wherein said multilayered material comprises a low-temperature cofired ceramic multilayered material fired at a temperature in the range of 600°

C. to 1000°

C.

17. The sealed symmetric package of claim 14;

wherein said multilayered material comprises a laminated multilayered printed wiring board composition.

18. The sealed symmetric package of claim 1, further comprising a bonding material consisting of a material selected from the group consisting of a hermetic sealant and an adhesive.

19. The sealed symmetric package of claim 1, further comprising a hermetic sealant selected from the group consisting of a braze alloy, a frit glass compound, a glass-ceramic composite a glass-polymer compound, a ceramic-polymer compound, and a solder alloy.

20. The sealed symmetric package of claim 1, further comprising an adhesive selected from the group consisting of an epoxy resin, a polyimide adhesive, a silicone adhesive, and a urethane adhesive.

21. The sealed symmetric package of claim 1, wherein, in the first package, said window further comprises a lens for optically transforming the light that passes through the window.

22. The sealed symmetric package of claim 21, wherein, in the first package, said lens is attached to said window.

23. The sealed symmetric package of claim 21, wherein, in the first package, said lens is integrally formed with said window.

24. The sealed symmetric package of claim 21, wherein, in the first package, further comprising an array of binary optic lenslets made integral with said window.

25. The sealed symmetric package of claim 1, wherein, in the first package, further comprising an electrically-switched optical modulator attached to said first package, for modulating light passing through an aperture.

26. The sealed symmetric package of claim 25, wherein, in the first package, wherein said electrically-switched optical modulator comprises a lithium niobate window.

27. The sealed symmetric package of claim 1, further comprising electrically conductive vias disposed within said electrically insulating plates, for conducting electrical signals in a direction generally perpendicular to the plane of said plates.

28. The sealed symmetric package of claim 1, further comprising at least one microelectronic device mounted within said symmetric package.

29. The sealed symmetric package of claim 28, wherein said microelectronic device is a device selected from the group consisting of a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, and a IMEMS device.

30. The sealed symmetric package of claim 28, wherein said microelectronic device is mounted to the second surface of the first package.

31. The sealed symmetric package of claim 28 wherein said microelectronic device is flip-chip mounted to the second surface of the first package.

32. The sealed symmetric package of claim 28, wherein said microelectronic device comprises a light-sensitive side.

33. The sealed symmetric package of claim 27, wherein said light-sensitive side is mounted facing said window of the first package.

34. The sealed symmetric package of claim 28, further comprising a seal disposed in-between said microelectronic device and the second surface of the first package.

35. The sealed symmetric package of claim 1, wherein the ambient air inside said sealed symmetric package has been substantially removed and replaced with at least one gas other than air.

36. The sealed symmetric package of claim 1, further comprising a first microelectronic device, flip-chip mounted to the second surface of the first package;

and a second microelectronic device, flip-chip mounted to the second surface of the second package.