Vapor chamber with integrated pin array

• US 6,490,160 B2
• Filed: 08/02/2001
• Issued: 12/03/2002
• Est. Priority Date: 07/15/1999
• Status: Expired due to Term

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: INCEP Technologies, Inc. (KOCH Industries Incorporated)
• Inventors: Dibene, Joseph T. II, Raiszadeh, Farhad
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/921,153
• Publication Number:
  US 20020021556A1
• Time in Patent Office: 488 Days
• Field of Search: 361/699, 361/700, 361/704, 361/717, 361/718, 257/714, 257/715, 174/15.1, 174/15.2, 165/80.4, 165/104.26, 165/104.32
• US Class Current: 361/700
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: G06F 1/18 Packaging or power distribution
• CPC Class Codes: G06F 1/182 with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI]
• CPC Class Codes: G06F 1/189 Power distribution
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/15192 Resurf arrangement of the internal vias
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H01R 12/7088 Arrangements for power supply
• CPC Class Codes: H01R 4/64 Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/10318 Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10325 Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
• CPC Class Codes: H05K 2201/10598 Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
• CPC Class Codes: H05K 2201/10704 Pin grid array [PGA]
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/2018 : Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 2201/2036 : Permanent spacer or stand-off in a printed circuit or printed circuit assembly pattern for applying drops or paste H05K2203/0545
• CPC Class Codes: H05K 3/301 : by means of a mounting structure H05K3/325 takes precedence
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 7/1092 : with built-in components, e.g. intelligent sockets

Abstract

A heat transfer device wherein a vapor chamber is combined with a pin structure that allows the highly conductive cooling vapors to flow within the pins of a pin array maximizing the efficiency of both components of the heat sink into one unit is disclosed. In one embodiment the heat transfer device comprises a thermally conductive chamber having a first thermally conductive chamber portion having a base thermally coupleable to a heat dissipating device; a second thermally conductive chamber portion having a plurality of hollow protrusions extending away from and in fluid communication with the first thermally conductive chamber portion wherein the thermally conductive chamber comprises a fluid vaporizable when in thermal communication with the heat dissipating device and condensable when in thermal communication with the hollow protrusions.

Claims

1. A heat transfer device, comprising:

a thermally conductive chamber having;

a first thermally conductive chamber portion having a base thermally coupleable to a heat dissipating device; and

a second thermally conductive chamber portion having a plurality of tapered hollow pins extending away from and in fluid communication with the first thermally conductive chamber portion, the pins configured to transfer thermal energy by convection, wherein at least one of the tapered hollow pins comprises a fluted wicking structure integral with an interior wall of the tapered hollow pin;

wherein the thermally conductive chamber is configured to contain a fluid vaporizable when in thermal communication with the heat dissipating device and condensable when in thermal communication with the hollow pins.

2. The apparatus of claim 1, wherein the first thermally conductive chamber portion includes a wicking structure for transferring condensed fluid to the base.

3. The apparatus of claim 1, wherein the hollow pins comprise a conical shape.

4. The apparatus of claim 1, wherein the hollow pins are curvilinear.

5. The apparatus of claim 1, wherein at least a first number of the hollow pins differ dimensionally from a second number of the hollow pins.

6. The apparatus of claim 1, wherein the thermally conductive chamber is drawn from a thermally conductive metal.

7. The apparatus of claim 1, wherein the thermally conductive chamber is molded from a thermally conductive malleable material.

8. The apparatus of claim 1, wherein the thermally conductive chamber is sealed with a non-fluid-permeable material.

9. The apparatus of claim 1, wherein the base is metallurgically bonded to the first thermally conductive chamber portion.

10. The apparatus of claim 1, wherein the base is non-planar.

11. The apparatus of claim 1, wherein at least one of the hollow pins comprises an aperture for inserting the fluid.

12. The heat transfer device of claim 1, further comprising:

an intermediate wicking structure for transferring condensed working fluid from the fluted wicking structure to a second wicking structure disposed in the first thermally conductive chamber portion.

13. A method of assembling a heat transfer device, comprising the steps of:

forming a first portion defining a thermally conductive chamber having a first thermally conductive chamber portion and a second thermally conductive chamber portion having a plurality of hollow tapered pins extending away from and in fluid communication with the first thermally conductive chamber portion, the pins configured to transfer thermal energy by convection, wherein at least one of the tapered hollow pins comprises a fluted wicking structure integral with an interior wall of the tapered hollow pin;

coupling a base to the first portion; and

inserting a working fluid into the thermally conductive chamber.

14. The method of claim 13, wherein the first portion is deep drawn.

15. The method of claim 14, wherein the first portion comprises copper.

16. The method of claim 13, wherein the wick structure is pre-formed.

17. The method of claim 13, wherein the step of inserting a working fluid into the thermally conductive chamber comprises the steps of:

evacuating air from the thermally conductive chamber via an opening in the first portion;

sealingly inserting an insertion device in the opening;

inserting the working fluid through the opening with the insertion device; and

sealing the opening.

18. The method of claim 17, wherein the opening is in one of the hollow pins.

19. A heat transfer device, comprising:

a thermally conductive chamber thermally coupleable to a heat dissipating device, the thermally conductive chamber configured to contain a working fluid vaporizable when in thermal communication with the heat dissipating device, the thermally conductive chamber comprising;

a first thermally conductive chamber portion having a base thermally coupleable to the heat dissipating device;

an array of hollow tapered pins extending away from and in fluid communication with the first thermally conductive chamber portion, the hollow pins for condensing the vaporized working fluid and for transferring thermal energy from the condensed working fluid to air; and

wherein at least one of the tapered hollow pins comprises a fluted wicking structure integral with an interior wall of the tapered hollow pin.

20. The heat transfer device of claim 19, further comprising:

an intermediate wicking structure for transferring condensed working fluid from the fluted wicking structure to a second wicking structure disposed in the first thermally conductive chamber portion.