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Multi-link segmentation and reassembly for bonding multiple PVC's in an inverse multiplexing arrangement

DC
  • US 6,490,296 B2
  • Filed: 10/10/2001
  • Issued: 12/03/2002
  • Est. Priority Date: 02/28/2001
  • Status: Expired due to Fees
First Claim
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1. A method, comprising:

  • generating a plurality of multilink segmentation and reassembly sublayer cells at a first location;

    distributing the plurality of multilink segmentation and reassembly sublayer cells across a plurality of virtual circuits;

    transmitting the plurality of multilink segmentation and reassembly sublayer cells to a second location via the plurality of virtual circuits; and

    receiving the plurality of multilink segmentation and reassembly sublayer cells at the second location.

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