Electrical transmission frequency of SiOB

• US 6,490,379 B2
• Filed: 05/07/2001
• Issued: 12/03/2002
• Est. Priority Date: 05/07/2001
• Status: Active Grant

• Current Assignee: Corning Incorporated
• Original Assignee: Corning Incorporated
• Inventors: Matthews, Karen I., Henning, Christopher L., Tan, Songsheng, Boudreau, Robert A.
• Primary Examiner(s): Healy, Brian
• Assistant Examiner(s): Wood, Kevin S
• Application Number:
  US09/850,359
• Publication Number:
  US 20020164107A1
• Time in Patent Office: 575 Days
• Field of Search: 385/14, 385/88-94, 385/129-132
• US Class Current: 385/14
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/4202 for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
• CPC Class Codes: G02B 6/4243 Mounting of the optical light guide into a groove mounting optical light guides into a groove in general G02B6/3636
• CPC Class Codes: G02B 6/4257 having a supporting carrier or a mounting substrate or a mounting plate G02B6/3648 takes precedence
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches
• CPC Class Codes: H01S 5/02345 Wire-bonding

Abstract

An opto-electronic packaged platform (300) includes a high resistivity substrate (10) having an optical waveguide mounting portion (301), an optical device mounting portion (302), and an electrical waveguide portion (303) having a conductor pattern (312) and an underlying capacitance (330,230, and/or 30) forming a transmission line (340) for propagating high frequency signals.

Claims

1. An opto-electronic platform, comprising:

a high resistivity substrate having an optical waveguide mounting portion,

an optical device mounting portion, and

an electrical waveguide portion having a conductor pattern and an underlying capacitance forming a transmission line for propagating high frequency signals, wherein the electrical waveguide portion comprises the conductor pattern and a dielectric pattern remaining only underneath the conductor pattern, the dielectric pattern disposed on the high resistivity substrate for providing at least a portion of the underlying capacitance.

3. The platform of claim 1, wherein the dielectric pattern has a thickness less than 20 μ

m.

4. The platform of claim 3, wherein the conductor pattern comprises a coplanar waveguide having a center conductor and a surrounding pair of RF ground conductors separated from the center conductor by a gap spacing of less than 20 μ

m.

5. The platform of claim 1, wherein the dielectric pattern has a thickness about 2 μ

m.

6. The platform of claim 5, wherein the conductor pattern comprises a coplanar waveguide having a center conductor and a surrounding pair of RF ground conductors separated from the center conductor by a gap spacing about the width of the center conductor.

7. The platform of claim 1 wherein the optical waveguide mounting portion comprises a “

V”

groove disposed on the high resistivity substrate for supporting an optical fiber.

8. The platform of claim 1, further comprising:

a laser for mounting on the optical device mounting portion.

10. The platform of claim 1 further comprising:

a photodetector for mounting on the optical device mounting portion.

11. The platform of claim 1, further comprising:

a photodetector for mounting on the optical device mounting portion.

12. The platform of claim 1, wherein the high resistivity substrate comprises a silicon wafer.

13. The platform of claim 1, wherein the high resistivity substrate having the underlying capacitance for forming the transmission line for propagating signals at a minimum speed of 40 Gbits/s.

2. An opto-electronic platform, comprising:

a high resistivity substrate having an optical waveguide mounting portion,

an optical device mounting portion, and

an electrical waveguide portion having a conductor pattern and an underlying capacitance forming a transmission line for propagating high frequency signals, wherein the electrical waveguide portion comprises a coplanar waveguide disposed directly on the high resistivity substrate wherein the high resistivity substrate provides at least a portion of the underlying capacitance.

9. The platform of claim 2 further comprising:

a laser for mounting on the optical device mounting portion.

14. A method for making a high-speed propagating platform, comprising the steps of:

providing a high resistivity substrate having an electrical waveguide portion;

thermally oxide coating a dielectric over the high resistivity substrate;

growing a metallized coplanar waveguide pattern having a center conductor and a surrounding pair of RF ground conductors separated from the center conductor by a gap spacing over the dielectric oxide; and

removing the dielectric oxide on top of the high resistivity substrate in the gap spacing.

15. The method of claim 14 wherein the step of removing includes etching.

16. The method of claim 14 wherein the step of removing includes reactive ion etching.

17. The method of claim 14 wherein the step of removing includes reactive ion etching away the dielectric for less than ten minutes.