Smoothing and barrier layers on high Tg substrates

• US 6,492,026 B1
• Filed: 04/20/2000
• Issued: 12/10/2002
• Est. Priority Date: 04/20/2000
• Status: Expired due to Term

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Battelle Memorial Institute
• Inventors: Shi, Ming Kun, Hall, Michael Gene, Gross, Mark Edward, Martin, Peter Maclyn, Graff, Gordon Lee, Mast, Eric Sidney
• Primary Examiner(s): Thibodeau, Paul
• Assistant Examiner(s): ZACHARIA, RAMSEY E
• Application Number:
  US09/553,191
• Publication Number:
  US 20020176993A1
• Time in Patent Office: 964 Days
• Field of Search: 428/1.6, 428/411.1, 428/412, 428/426, 428/446, 428/474.4, 428/457, 428/500, 428/522, 428/681, 428/419, 428/473.5
• US Class Current: 428/411.1
• CPC Class Codes: B05D 1/60 Deposition of organic layers from vapour phase vapour phase deposition in general C23C14/00, C23C16/00
• CPC Class Codes: B32B 2307/41 Opaque
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 2307/7244 Oxygen barrier
• CPC Class Codes: B32B 2307/7246 Water vapor barrier
• CPC Class Codes: B32B 2323/00 Polyalkenes
• CPC Class Codes: B32B 2369/00 Polycarbonates
• CPC Class Codes: B32B 2377/00 Polyamides
• CPC Class Codes: B32B 2457/20 Displays, e.g. liquid crystal displays, plasma displays
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/281 comprising polyimides
• CPC Class Codes: B32B 27/286 comprising polysulphones; polysulfides
• CPC Class Codes: B32B 27/325 comprising polycycloolefins
• CPC Class Codes: B32B 27/34 comprising polyamides
• CPC Class Codes: B32B 27/365 comprising polycarbonates
• CPC Class Codes: B32B 7/04 Interconnection of layers
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/8731 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: Y10T 428/31504 Composite [nonstructural laminate]
• CPC Class Codes: Y10T 428/31507 : Of polycarbonate
• CPC Class Codes: Y10T 428/31533 : Of polythioether
• CPC Class Codes: Y10T 428/31667 : Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
• CPC Class Codes: Y10T 428/31678 : Of metal
• CPC Class Codes: Y10T 428/31721 : Of polyimide
• CPC Class Codes: Y10T 428/31855 : Of addition polymer from unsaturated monomers
• CPC Class Codes: Y10T 428/31935 : Ester, halide or nitrile of addition polymer

Abstract

A high temperature substrate having improved properties. The substrate is a polymer substrate having a glass transition temperature greater than about 120° C., and at least one first barrier stack adjacent to the polymer substrate. The barrier stack includes at least one first barrier layer and at least one first polymer layer. A method for making the high temperature substrate with improved properties is also disclosed.

Claims

1. A high temperature substrate having improved properties consisting essentially of:

a polymer substrate having a glass transition temperature greater than 120°

C.; and

at least one first barrier stack consisting essentially of at least one first barrier layer and at least one first polymer layer, the at least one first barrier stack adjacent to the polymer substrate, wherein the oxygen transmission rate through the at least one first barrier stack is less than 0.005 cc/m²/day at 23°

C. and 0% relative humidity.

2. The high temperature substrate of claim 1 wherein the polymer substrate is selected from the group consisting of polynorbornene, polyimide, polyethersulfone, polyetherimide, polycarbonate, and high glass transition temperature cyclic olefin polymers.

3. The high temperature substrate of claim 1 wherein the at least one first barrier layer is substantially transparent.

4. The high temperature substrate of claim 1 wherein at least one of the at least one first barrier layer comprises a material selected from the group consisting of metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, and combinations thereof.

5. The high temperature substrate of claim 4 wherein the material is selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and combinations thereof.

6. The high temperature substrate of claim 4 wherein the material is selected from the group consisting of aluminum nitride, silicon nitride, boron nitride, and combinations thereof.

7. The high temperature substrate of claim 4 wherein the material is selected from the group consisting of aluminum oxynitride, silicon oxynitride, boron oxynitride, and combinations thereof.

8. The high temperature substrate of claim 1 wherein the at least one first barrier layer is substantially opaque.

9. The high temperature substrate of claim 1 wherein at least one of the at least one first barrier layer is selected from the group consisting of opaque metals, opaque polymers, opaque ceramics, and opaque cermets.

10. The high temperature substrate of claim 1 wherein at least one of the at least one first polymer layers comprises an acrylate-containing polymer.

11. The high temperature substrate of claim 1 further comprising a polymer smoothing layer adjacent to the polymer substrate.

12. The high temperature substrate of claim 1 wherein the at least one first barrier layer comprises two barrier layers.

13. The high temperature substrate of claim 1 wherein the oxygen transmission rate through the at least one first barrier stack is less than 0.005 cc/m²/day at 38°

C. and 90% relative humidity.

14. The high temperature substrate of claim 1 wherein the water vapor transmission rate through the at least one first barrier stack is less than 0.005 g/m²/day at 38°

C. and 100% relative humidity.

15. The high temperature substrate of claim 1 further comprising an environmentally sensitive display device adjacent to the at least one first barrier stack.

16. The high temperature substrate of claim 15 further comprising at least one second barrier stack comprising at least one second barrier layer and at least one second polymer layer, the at least one second barrier stack adjacent to the environmentally sensitive display device, wherein the at least one second barrier stack encapsulates the environmentally sensitive display device.

17. The high temperature substrate of claim 16 further comprising a lid adjacent to the at least one second barrier stack.

18. The high temperature substrate of claim 1 wherein the polymer substrate has a glass transition temperature greater than about 150°

C.

19. The high temperature substrate of claim 1 wherein the polymer substrate has a glass transition temperature greater than about 200°

C.