Interposer device

• US 6,493,056 B2
• Filed: 12/08/2000
• Issued: 12/10/2002
• Est. Priority Date: 12/10/1999
• Status: Expired due to Term

• Current Assignee: Telefonaktiebolaget LM Ericsson
• Original Assignee: Telefonaktiebolaget LM Ericsson
• Inventors: Björkengren, Ulf, Gärdenfors, Torbjörn
• Primary Examiner(s): Dudek, James
• Application Number:
  US09/732,818
• Publication Number:
  US 20010015785A1
• Time in Patent Office: 732 Days
• Field of Search: 349/151
• US Class Current: 349/151
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07811 Extrinsic, i.e. with electrical conductive fillers
• CPC Class Codes: H01L 2924/15173 in a single layer of the multilayer substrate

Abstract

A liquid-crystal display (LCD) comprises an LCD device, including a substrate (107) with substrate pads (106) on the top surface of the substrate (107) and a chip (105) with chip electrodes (104) operatively connected to said substrate pads (106). Additionally, an interposer device (100) is mounted between the chip (105) and the substrate (107), wherein the interposer device (100) inter-connects the substrate pads (106) configured in a first pattern with the electrodes (104) configured in an arbitrary second pattern on the chip area, wherein the electrodes (104) have a reduced electrode pitch essentially smaller than said pad pitch.

Claims

1. A liquid-crystal display (LCD) comprising:

an LCD device comprising;

a substrate with substrate pads on a top surface of said substrate, said substrate pads being configured in a first pattern; and

a chip with chip electrodes, said chip electrodes being configured in a second pattern, said second pattern being other than a circumference pattern; and

an interposer device mounted between said chip and said substrate, wherein said interposer device operatively interconnects said substrate pads with said chip electrodes; and

wherein said chip electrodes have an electrode pitch smaller than a pad pitch.

2. The liquid-crystal display (LCD) according to claim 1, wherein:

said interposer device has interposer electrodes, said interposer electrodes being mounted on said interposer device according to said first pattern;

said interposer electrodes are connected to said chip electrodes and to interposer pads, said interposer electrodes being mounted on said interposer device according to said second pattern; and

said interposer pads are connected to said substrate pads.

3. The liquid-crystal display (LCD) according to claim 1 or 2, wherein said first pattern is a circumference pattern.

4. The liquid-crystal display (LCD) according to claim 1 or 2, wherein said second pattern is a grid pattern.

5. The liquid-crystal display (LCD) according to claim 1 or claim 2, wherein said chip is bonded to said interposer device via an anisotropic adhesive system.

6. The liquid-crystal display (LCD) according to claim 5, wherein said interposer device is bonded to said substrate via an anisotropic adhesive system.

7. The liquid-crystal display (LCD) according to claim 2, wherein said interposer device is a flex film provided with electronically conductive leads interconnecting said interposer pads with said interposer electrodes.

8. The liquid-crystal display (LCD) according to claim 2, wherein said interposer pads are selected from the group consisting of:

metallized holes through an interposer substrate for interconnecting with said interposer electrodes via printed electronically conductive leads provided on said interposer device; and

metallized holes through the interposer substrate for interconnecting with said interposer pads via the printed electronically conductive leads provided on said interposer device.

9. An electronic apparatus, comprising a liquid-crystal display (LCD) according to any of claims 1-2.

10. The electronic apparatus according to claim 9, wherein said electronic apparatus is selected from the group consisting of mobile telephones, pagers, communicators, electronic organizers, and smartphones.

11. An interposer device for mounting a chip with chip electrodes on a substrate with substrate pads in a liquid-crystal display (LCD), the interposer device comprising:

interposer electrodes mounted on said interposer device according to a first pattern, said first pattern corresponding to a configuration of said chip electrodes placed across a chip area, said first pattern being other than a circumference pattern; and

interposer pads mounted on said interposer device according to a second pattern, said second pattern corresponding to a configuration of said substrate pads;

wherein said interposer pads are interconnected with said interposer electrodes; and

wherein said electrodes have an electrode pitch smaller than a pad pitch.

12. The interposer device according to claim 11, wherein said interposer device is a flex film provided with electronically conductive leads interconnecting said interposer pads with said interposer electrodes.

13. The interposer device according to claim 11, wherein said interposer pads are selected from the group consisting of:

metallized holes through an interposer substrate for interconnecting with said interposer electrodes via printed electronically conductive leads provided on the interposer device;

metallized holes through the interposer substrate for interconnecting with said interposer pads via the printed electronically conductive leads provided on said interposer device.

18. The interposer device according to claim 11 or 12, wherein said first pattern is a grid pattern.

14. A method of mounting a chip with chip electrodes on a substrate with substrate pads in a liquid-crystal display (LCD), the method comprising the steps of:

bonding said chip to an interposer device;

bonding said interposer device to said substrate;

wherein said interposer device interconnects said substrate pads with said chip electrodes;

wherein said substrate pads are configured in a first pattern;

wherein said chip electrodes are configured in a second pattern, said second pattern being other than a circumference pattern; and

wherein said electrodes have an electrode pitch smaller than a pad pitch.

15. The method according to claim 14, wherein said chip is bonded to said interposer device via an anisotropic adhesive system.

16. The method according to claim 15, wherein said interposer device is bonded to said substrate via an anisotropic adhesive system.

17. The method of claim 14, wherein the steps are performed in the order listed.

19. The method according to claim 14, wherein said second pattern is a grid pattern.