Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor

• US 6,494,092 B2
• Filed: 09/21/2001
• Issued: 12/17/2002
• Est. Priority Date: 04/24/1997
• Status: Expired due to Fees

• Current Assignee: Fuji Electric Systems Company Limited
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Ueyanagi, Katsumichi, Sasaki, Mitsuo, Nishikawa, Mutsuo
• Primary Examiner(s): MOLLER, RICHARD ALAN
• Application Number:
  US09/957,241
• Publication Number:
  US 20020017137A1
• Time in Patent Office: 452 Days
• Field of Search: 738/62, 733/81, 734/93, 735/140.2, 735/143.1, 735/140.1, 735/143.6, 734/31
• US Class Current: 73/493
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/0888 for indicating angular acceleration
• CPC Class Codes: G01P 15/11 by inductive pick-up
• CPC Class Codes: G01P 15/123 by piezo-resistive elements, e.g. semiconductor strain gauges
• CPC Class Codes: G01P 21/00 Testing or calibrating of apparatus or devices covered by the preceding groups
• CPC Class Codes: H01F 10/126 containing rare earth metals H01F10/133 takes precedence
• CPC Class Codes: H01F 10/265 Magnetic multilayers non exchange-coupled H01F10/32 takes precedence
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence

Abstract

The present invention is a semiconductor sensor having a semiconductor sensor chip for detecting a physical value applied in a direction perpendicular to the chip surface; and a package for incorporating the semiconductor sensor chip. The main surface for mounting the semiconductor sensor chip is formed at a predetermined angle with respect to the surface of a printed circuit board for mounting the package. The main surface is provided with a plurality of terminals along two opposite sides for connecting with input/output terminals of the semiconductor sensor chip. A bottom surface, perpendicular to the main surface, is provided with a plurality of pins formed along the two sides parallel to the main surface, so that the plurality of pins are inserted into mounting holes formed in the printed circuit board. The plurality of terminals and the plurality of pins are electrically connected, and input/output terminals of the semiconductor sensor chip mounted on the main surface are electrically connected with the plurality of terminals of the package.

Claims

1. A semiconductor sensor comprising:

a semiconductor sensor chip for detecting a physical value applied in a direction perpendicular to a surface of said chip; and

a package for incorporating said semiconductor sensor chip,

wherein a main surface for mounting said semiconductor sensor chip is formed to have a predetermined angle with respect to a surface of a printed circuit board for mounting said package, said main surface is provided with a plurality of terminals along two opposite parallel sides thereof for connecting with input/output terminals of said semiconductor sensor chip, a bottom surface perpendicular to said main surface is provided with a plurality of pins respectively formed along two sides of said bottom surface parallel to said main surface, so that said plurality of pins are inserted into mounting holes formed in said printed circuit board, said plurality of terminals and said plurality of pins are electrically connected, and

said input/output terminals of said semiconductor sensor chip mounted on said main surface are electrically connected with said plurality of terminals of said package.

2. The semiconsuctor sensor as claimed in claim 1, wherein said main surface for mounting said semiconductor sensor chip is formed substantially perpendicular to the surface of said printed circuit board for mounting said package.

3. The semiconductor sensor as claimed in claim 1, wherein said semiconductor sensor chip comprises a support frame part, and a sensor structure including a displaceable weight part, said displaceable weight part having a magnetic thin film formed on a surface thereof, and at least one beam part for connecting said weight part to said support frame part, and said sensor structure being formed on a silicon substrate through an insulating layer,

wherein said insulating layer between said sensor structure and said silicon substrate is removed, and on said support frame part on the periphery of said weight part, a coil is formed to surround said weight part.

4. The semiconductor sensor claimed in claim 1, wherein said semoconductor sensor chip is an angular acceleration sensor chip comprising a first sensor group including a first support frame part, and a plurality of first sensor structures, at least one of said sensor structures comprising a displaceable firts weight part, said displaceable first weight part having a magnetic thin film formed on a surface thereof, and first beam parts for connecting said first weight part to said first support frame part, said first support frame part and said first sensor structures being formed on a silicon substrate through an insulating layer, wherein said insulating layer between said plurality of first sensor structures and said silicon substrate is removed, first detection coils are respectively formed surrounding said first weight part on said first support frame part at the respective periphery of said first weight part, and said plurality of first detection coils are connected in series;

a second sensor group including a second support frame part, and a plurality of second sensor structures, at least one of said sensor structures comprising a displaceable second weight part, said displaceable second weight part having a magnetic thin film formed on a surface thereof, and second beam parts for connecting said second weight part to said second support frame part, said second support frame part and said second sensor structures being formed on said silicon substrate through an insulating layer, wherein said insulating layer between said plurality of second sensor structures and said silicon substrate is removed, second detection coils are respectively formed surrounding said second weight part on said second support frame part at the respective periphery of said second weight part and said plurality of second detection coils are connected in series, said first and second sensor groups being formed into a chip,

wherein said first sensor group and said second sensor group are equal in number of sensor structures, and said first sensor group and said second group are disposed symmetrically about a detection axis as an axis of symmetry;

said first and second detection coils of said first and second sensor groups form closed loops so the currents flowing thorough said plurality of first and second detection coils of said first and second sensor groups are same in direction when angular acceleration generates about said detection axis; and

Means for amplifying signals from said plurality of first and second detection coils and means for integrating outputs from said plurality of detection coils to output an angular accelaration signal.

5. The semiconductor sensor as claimed in claim 1, wherein said semiconductor sensor chip comprises a third layer formed on a first layer of a support substrate through an insulating second layer, said third layer having a sensor structure,

said second layer between a detection surface of said sensor structure and said first layer is removed, and

a beam part having a detection device, and a weight part having a plurality of cutouts of a same width formed over the entire detection surface are provided on said sensor structure with said second layer removed.