IC card having fingerprint sensor designed to withstand bending

• US 6,494,380 B2
• Filed: 01/11/2001
• Issued: 12/17/2002
• Est. Priority Date: 01/11/2000
• Status: Expired due to Fees

• Current Assignee: Morpho (Advent International Corporation)
• Original Assignee: Sagem SA (Safran SA)
• Inventors: Jarosz, Hervé
• Primary Examiner(s): Lee, Michael G.
• Assistant Examiner(s): Hess, Daniel A.
• Application Number:
  US09/757,835
• Publication Number:
  US 20010008004A1
• Time in Patent Office: 705 Days
• Field of Search: 235/451, 235/380, 235/487, 235/492
• US Class Current: 235/487
• CPC Class Codes: G06K 19/0718 the sensor being of the biometric kind, e.g. fingerprint sensors fingerprint sensors in general G06V40/13; biometric access-control systems in general, see G07C9/00
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G07C 9/257 electronically G07C9/26 takes precedence

Abstract

A chip card comprising a card made from a plastics material (1) capable of elastically withstanding a relative bending and in which a microelectronic data processing chip (4) is encased, a thin microelectronic wafer (5) made from a semiconductor material, such as a finger print sensor, additionally being joined to the card (1). Said wafer (5) is sub-divided into a small number of juxtaposed chips (7) disposed in a given pattern and separated from one another by a predetermined distance (d) which is sufficient for each separating strip (8) of plastics material to be slightly bent without causing adjacent chips (7) to become unstuck and/or rupture; electrical links are established between the chips to provide electrical continuity.

Claims

1. A chip card comprising a card of a plastics material which is capable of elastically withstanding a relative curvature, in which a microelectronic data processing chip is encased and to which a thin microelectronic wafer of a semiconductor material is affixed,

said wafer being sub-divided into a smaller number of juxtaposed chips disposed in a given layout with electrical links joining said juxtaposed chips so as to provide electrical continuity therebetween, and

said juxtaposed chips being separated from one another so that adjacent chips are separated from each other by a separating strip of said plastics material the separating strip separating said adjacent chips from each other being of a predetermined width and said width being such as to permit each said separating strip of plastics material to be subjected to a bending corresponding to the relative curvature which the card of plastics material is capable of elastically withstanding, without causing said adjacent chips to become unstuck and/or break.

2. The chip card according to claim 1, wherein said distance between the facing edges of two juxtaposed chips is substantially equal to 1 mm.

3. The chip card according to claim 1, wherein each chip is of an approximately rectangular shape with four corners, and wherein the juxtaposed chips are disposed with their respective edges substantially parallel.

4. The chip card according to claim 1, wherein the juxtaposed chips are aligned in substantially perpendicular rows and columns.

5. The chip card according to claim 1, wherein the layout includes diagonals and the juxtaposed chips are arranged along said diagonals.

6. The chip card according to claim 1, wherein the juxtaposed chips are arranged in two to four rows.

7. The chip card according to claim 1, wherein the juxtaposed chips are disposed in two to four columns.

8. The chip card according to claim 1, wherein the thin wafer is a finger print sensor which is electrically connected to the microelectronic chip.

9. The chip card according to claim 8, wherein the microelectronic chip, electrically connected to the finger print sensor, has interpolation means capable of reconstructing a full image of finger prints by a process of interpolation, including interpolation of areas corresponding to the strips separating the juxtaposed chips.

10. The chip card according to claim 8, wherein the finger print sensor is of capacitive type incorporating a plurality of elementary micro-capacitors, wherein each juxtaposed chip includes a plurality of said micro-capacitors laid out in a network, and wherein the electrical links between the juxtaposed chips provide electrical continuity between the networks of elementary micro-capacitors belonging to two juxtaposed chips.