Cutting instrument having integrated sensors

• US 6,494,882 B1
• Filed: 07/25/2000
• Issued: 12/17/2002
• Est. Priority Date: 07/25/2000
• Status: Expired due to Fees

• Current Assignee: Verimetra, Inc.
• Original Assignee: Verimetra, Inc.
• Inventors: Migliuolo, Michele, Lebouitz, Kyle S.
• Primary Examiner(s): Jastrzab, Jeffrey R.
• Assistant Examiner(s): Oropeza, Frances P.
• Application Number:
  US09/626,273
• Time in Patent Office: 875 Days
• Field of Search: 606/1, 606/166, 606/167, 606/32, 606/34, 606/35, 606/29, 606/45, 606/172, 606/181, 606/190, 600/547, 600/554, 600/564, 600/587, 600/555, 303/42, 303/465, 83/72--74, 83/767, 833/64, 835/221.1, 835/221.4, 835/221.5, 835/222.1, 294/907, 340/407.1, 340/407.2
• US Class Current: 606/45
• CPC Class Codes: A61B 17/32 Surgical cutting instruments A61B18/042 takes precedence; suture cutters A61B17/0467; instruments for ligaturing or cutting A61B17/128; instruments for rupturing the amniotic membrane A61B17/4208; specially adapted knives for eye surgery A61F9/0133
• CPC Class Codes: A61B 17/3211 Surgical scalpels, knives; Accessories therefor
• CPC Class Codes: A61B 18/1402 Probes for open surgery
• CPC Class Codes: A61B 2017/00022 Sensing or detecting at the treatment site
• CPC Class Codes: A61B 2017/00084 Temperature
• CPC Class Codes: A61B 2017/00128 related to intensity or progress of surgical action
• CPC Class Codes: A61B 2090/064 for measuring force, pressure or mechanical tension
• CPC Class Codes: A61B 2090/0814 Preventing re-use

Abstract

A cutting instrument including a metal blade has a recess formed therein and a semiconductor substrate affixed to the blade in the recess. The semiconductor substrate includes at least one sensor formed thereon. The sensor formed on the semiconductor substrate may comprise at least one or an array of a strain sensors, pressure sensors, nerve sensors, temperature sensors, density sensors, accelerometers, and gyroscopes. The cutting instrument may also further include a handle wherein the blade is affixed to the handle and the semiconductor substrate is electrically coupled to the handle. The handle may then be coupled, either physically or by wireless transmission, to a computer that is adapted to display information to a person using the cutting instrument based on signals generated by one or more of the sensors formed on the semiconductor substrate. The computer or handle may also be adapted to store data based on the signals generated by one or more of the sensors. A method of making said cutting instrument includes the steps of at least one sensor being formed on a semiconductor wafer and a layer of photoresist being applied on a top side of the semiconductor wafer according to a pattern that matches the defined shape of the semiconductor substrate. The portion of the semiconductor wafer not covered by the photoresist is removed and thereafter the photoresist is removed from the semiconductor wafer, thereby leaving the semiconductor substrate having a defined shape and at least one sensor formed thereon. The semiconductor substrate having a defined shape and at least one sensor formed thereon is then affixed to a metal blade in a recess formed in the blade.

Claims

1. A cutting instrument, comprising:

a metal blade having a cutting edge and a recess formed in a first side thereof, and

a semiconductor substrate affixed to said blade in said recess, said semiconductor substrate having at least one sensor formed thereon to detect at least one characteristic of material adjacent said cutting edge.

2. A cutting instrument according to claim 1, wherein a portion of said recess follows said cutting edge, and said semiconductor substrate is shaped such that when affixed to said blade in said recess, a portion of said semiconductor substrate is mounted adjacent to said cutting edge.

3. A cutting instrument according to claim 2, wherein said semiconductor substrate is shaped to match a shape of said recess.

4. A cutting instrument according to claim 1, wherein said sensor comprises a strain sensor.

5. A cutting instrument according to claim 4, wherein said strain sensor comprises a resistor.

6. A cutting instrument according to claim 1, wherein said sensor comprises a pressure sensor.

7. A cutting instrument according to claim 6, wherein said pressure sensor comprises a strain sensor on top of a diaphragm.

8. A cutting instrument according to claim 1, wherein said sensor comprises a nerve sensor.

9. A cutting instrument according to claim 8, wherein said nerve sensor comprises at least one gold electrode.

10. A cutting instrument according to claim 1, wherein said sensor comprises a temperature sensor.

11. A cutting instrument according to claim 10, wherein said temperature sensor comprises a resistor.

12. A cutting instrument according to claim 1, wherein said sensor comprises a density sensor.

13. A cutting instrument according to claim 12, wherein said density sensor comprises a piezoelectric ultrasonic sensor.

14. A cutting instrument according to claim 1, wherein said sensor senses an aspect of movement of said blade.

15. A cutting instrument according to claim 14, wherein said sensor comprises one or more of an accelerometer and a gyroscope.

16. A cutting instrument according to claim 1, wherein said at least one sensor comprises an array of sensors.

17. A cutting instrument according to claim 1, further comprising a handle, said blade having said semiconductor substrate affixed thereto being affixed to said handle.

18. A cutting instrument according to claim 17, said blade having said semiconductor substrate affixed thereto being electrically coupled to said handle.

19. A cutting instrument according to claim 18, said semiconductor substrate and said handle each having at least one electrical contact, said at least one electrical contact of said semiconductor substrate being coupled to said at least one electrical contact of said handle when said blade is affixed to said handle.

20. A cutting instrument according to claim 19, further comprising means for providing a seal between said handle and said blade, said seal surrounding said electrical contacts.

21. A cutting instrument according to claim 19, wherein said handle includes an electrical connector and said at least one electrical contact of said handle is coupled to said electrical connector.

22. A cutting instrument according to claim 19, wherein said handle includes a wireless transmitter and said at least one electrical contact of said handle is coupled to said wireless transmitter.

23. A cutting instrument according to claim 18, wherein said handle includes an electrical connector.

24. A cutting instrument according to claim 18, wherein said handle includes a wireless transmitter.

25. A cutting instrument according to claim 24, further comprising a computer having a wireless receiver in communication with said wireless transmitter, said computer being adapted to display information to a user based on signals generated by said at least one sensor.

26. A cutting instrument according to claim 24, further comprising a computer having a wireless receiver in communication with said wireless transmitter, said computer being adapted to store data based on signals generated by said at least one sensor.

27. A cutting instrument according to claim 18, further comprising a computer, said handle being coupled to said computer.

28. A cutting instrument according to claim 27, said computer being adapted to display information to a user based on signals generated by said at least one sensor.

29. A cutting instrument according to claim 27, said computer being adapted to store data based on signals generated by said at least one sensor.

30. A cutting instrument according to claim 1, further comprising a handle and means for connecting and electrically coupling said blade having said semiconductor substrate affixed thereto to said handle.

31. A cutting instrument according to claim 30, wherein said handle includes an electrical connector.

32. A cutting instrument according to claim 30, wherein said handle includes a wireless transmitter.

33. A cutting instrument according to claim 1, wherein said blade comprises a half-blade.

34. A cutting instrument according to claim 1, wherein said recess is formed in said cutting edge.

35. A cutting instrument according to claim 1, said semiconductor substrate having circuitry formed thereon coupled to said at least one sensor, said circuitry comprising one or more amplifiers.

36. A cutting instrument according to claim 35, said at least one sensor comprising a plurality of sensors, said circuitry further comprising logic circuitry for multiplexing signals produced by said plurality of sensors.

37. A cutting instrument according to claim 36, said semiconductor substrate having one or more electrical contacts formed thereon, said circuitry being coupled to said one or more electrical contacts.

38. A cutting instrument according to claim 35, said semiconductor substrate having one or more electrical contacts formed thereon, said circuitry being coupled to said one or more electrical contacts.

39. A cutting instrument according to claim 1, said semiconductor substrate further comprising means for delivering a fluid.

40. A cutting instrument, comprising:

a metal blade having a cutting edge and a recess formed in a first side thereof; and

a semiconductor substrate affixed to said blade in said recess, said semiconductor substrate having means for sensing at least one of strain, pressure, the presence of a nerve, density, temperature and movement in relation to a material adjacent said cutting edge.

41. A cutting instrument according to claim 40, further comprising means for electrically coupling said semiconductor substrate to a computer, said computer being adapted to do at least one of display information to a user based on signals generated by said sensing means and store data based on signals generated by said sensing means.

42. A cutting instrument according to claim 40, wherein a portion of said recess follows said cutting edge, and said semiconductor substrate is shaped such that when affixed to said blade in said recess, a portion of said semiconductor substrate is mounted adjacent to said cutting edge.

43. A cutting instrument according to claim 42, wherein said semiconductor substrate is shaped to match a shape of said recess.

44. A cutting instrument according to claim 40, further comprising a handle and means for connecting and electrically coupling said blade having said semiconductor substrate affixed thereto to said handle.

45. A cutting instrument according to claim 44, further comprising means for electrically coupling said handle to a computer, said computer being adapted to do at least one of display information to a user based on signals generated by said sensing means and store data based on signals generated by said sensing means.

46. A cutting instrument according to claim 44, wherein said handle includes an electrical connector.

47. A cutting instrument according to claim 44, wherein said handle includes a wireless transmitter.

48. A cutting instrument according to claim 40, further comprising a handle, said blade having said semiconductor substrate affixed thereto being connected and electrically coupled to said handle.

49. A cutting instrument according to claim 48, further comprising means for electrically coupling said handle to a computer, said computer being adapted to do at least one of display information to a user based on signals generated by said sensing means and store data based on signals generated by said sensing means.

50. A cutting instrument according to claim 48, wherein said handle includes an electrical connector.

51. A cutting instrument according to claim 48, wherein said handle includes a wireless transmitter.

52. A cutting instrument according to claim 40, wherein said blade comprises a half-blade.

53. A cutting instrument according to claim 40, wherein said recess is formed in said cutting edge.

54. A cutting instrument according to claim 40, said semiconductor substrate having means for amplifying signals produced by said sensing means.

55. A cutting instrument according to claim 40, said semiconductor substrate having means for multiplexing signals produced by said sensing means.

56. A cutting instrument according to claim 40, said semiconductor substrate further comprising means for delivering a fluid.