Application-specific optoelectronic integrated circuit

• US 6,495,382 B2
• Filed: 05/25/2001
• Issued: 12/17/2002
• Est. Priority Date: 11/01/1999
• Status: Expired due to Fees

• Current Assignee: Curators of the University of Missouri (University of Missouri)
• Original Assignee: Hughes Electronics Corporation (Rtx Corporation)
• Inventors: Yap, Daniel
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Le, Thao P
• Application Number:
  US09/865,959
• Publication Number:
  US 20010038100A1
• Time in Patent Office: 571 Days
• Field of Search: 438/24, 438/25, 257/81
• US Class Current: 438/24
• CPC Class Codes: G02B 6/423 using guiding surfaces for the alignment
• CPC Class Codes: G02B 6/4232 using the surface tension of fluid solder to align the elements, e.g. solder bump techniques flip-chip mounting techniques in assembly of semiconductor devices H01L24/81
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: H01L 27/1446 in a repetitive configuration

Abstract

An application-specific rf optoelectronic integrated circuit having a generic chip member and a defining substrate in communication with at least one generic chip member. The generic chip member contains passive building block components that are independent from each other and being connected by paths external to the generic chip member. The external connection paths are defined by a defining substrate member having passive components for providing optical and electrical interconnection between selected building block components on the generic chip member to define the specific function of the integrated circuit. It is possible to use the same design of the generic chip for several applications merely by altering the interconnect paths on a defining substrate.

Claims

1. A method for integrating an optoelectronic circuit comprising the steps of:

selecting predetermined building blocks from a predetermined pattern of building blocks electrically isolated from each other and monolithically integrated onto a generic chip member;

defining an application-specific pattern of circuit components on a substrate member;

aligning said substrate member with said generic chip member;

connecting said substrate member and said generic chip member thereby defining an application specific optoelectronic integrated circuit.

2. The method as claimed in claim 1 wherein said step of connecting said substrate member further comprises electrically and optically connecting said substrate member and said generic chip member.

3. The method as claimed in claim 1 wherein said step of connecting said substrate member and said generic chip member further comprises the step of soldering external connecting points on said generic chip member to external connecting points on said substrate member.

4. The method as claimed in claim 3 wherein said step of soldering further comprises said external connecting points having solder pads compatible with a solder bump.

5. The method as claimed in claim 4 wherein said step of defining a substrate member further comprises forming said solder bump as part of said substrate member and further comprising the steps of:

aligning said generic chip over said substrate member;

heating to reflow said solder bump, thereby forming a connection between said generic chip and said substrate member.

6. The method as claimed in claim 1 further comprising the step of fabricating a substrate member having microwave transmission members and passive microwave components on the same dielectric layer.

7. The method as claimed in claim 1 further comprising the step of fabricating a generic chip member having optoelectronic devices and electronic devices on the same generic chip.

8. The method as claimed in claim 1 wherein said building blocks are chosen from the group consisting of photodetectors, optoelectronic modulators, light emitters, amplifier stages, buffers, drivers, switches, logic gates and latches.

9. The method as claimed in claim 1 wherein said circuit components are chosen from the group consisting of transmission lines, capacitors, inductors, resistors, resonators, tuning stubs, rf filters, waveguides, reflectors, and means for holding optical fibers.

10. The method as claimed in claim 9 wherein said means for holding optical fibers further comprises at least one groove in said substrate member.