Electronic devices including micromechanical switches

• US 6,495,387 B2
• Filed: 12/11/2000
• Issued: 12/17/2002
• Est. Priority Date: 12/10/1999
• Status: Expired due to Fees

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: French, Ian D.
• Primary Examiner(s): Picardat, Kevin M.
• Application Number:
  US09/734,077
• Publication Number:
  US 20010004548A1
• Time in Patent Office: 736 Days
• Field of Search: 438/50, 438/51, 438/52, 438/53
• US Class Current: 438/52
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01H 59/0009 making use of micromechanics
• CPC Class Codes: H01H 67/22 Switches without multi-position wipers
• CPC Class Codes: H01L 27/14609 Pixel-elements with integrated switching, control, storage or amplification elements scanning details of imagers (circuitry of solid-state image sensors H04N25/00); circuitry of imagers H04N25/70
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14689 MOS based technologies
• CPC Class Codes: H01L 27/14692 Thin film technologies, e.g. amorphous, poly, micro- or nanocrystalline silicon

Abstract

A method of manufacturing an electronic device comprising an integrated circuit device having micromechanical switches (10) and thin film circuit components (20) provided on a common substrate (2). The micromechanical switches (10) have contact beams (12) extending over a respective sacrificial region. Component layers (5) for forming the thin film circuit components are used as the sacrificial region in the area of the substrate allocated to the micromechanical switches. This enables various layers to be shared between the switches and the components. A supplementary support layer (50) may be provided for the contact beams to protect them against damage during subsequent processing and fabrication stages. A portion of this support layer can be left attached to the beam in the completed device for increased strength.

Claims

1. A method of manufacturing an integrated circuit device, the device comprising a plurality of micromechanical switches and a plurality of thin film circuit components provided on a common substrate, the method comprising:

depositing and patterning a lower electrode pattern which defines bottom contacts for the thin film circuit components and for the micromechanical switches;

depositing and patterning component layers for forming the thin film circuit components over the lower electrode pattern, the component layers defining sacrificial regions over regions of the substrate allocated to the micromechanical switches and defining the thin film circuit components over regions of the substrate allocated to the thin film circuit components;

depositing and patterning a conductive layer to provide an upper electrode pattern, the upper electrode pattern defining top contacts for the thin film circuit components and defining contact beams for the micromechanical switches, the contact beams each extending over a respective sacrificial region;

removing the sacrificial regions of the component layers to define a space between the contact beam and the lower electrode pattern of each micromechanical switch.

2. A method as claimed in claim 1, wherein the thin film circuit components comprise diodes.

3. A method as claimed in claim 1, wherein the component layers define a PIN or NIP diode structure and an upper electrode layer.

4. A method as claimed in claim 3, wherein amorphous silicon layers are deposited to define the diode structure.

5. A method as claimed in claim 3, wherein the upper electrode layer is patterned to define a well in the sacrificial region, so that after removal of the sacrificial region, a contact projection is defined on the underside of the contact beam.

6. A method as claimed in claim 1, further comprising depositing a passivation layer around the patterned component layers constituting the thin film circuit components.

7. A method as claimed in claim 1, wherein the upper electrode pattern is patterned to define a cantilevered beam structure for each micromechanical switch.

8. A method as claimed in claim 1, wherein a support layer is deposited and patterned over the component layers in the regions of the substrate allocated to the micromechanical switches to provide mechanical support of the contact beam.

9. A method as claimed in claim 8, wherein the removal of the sacrificial regions is carried out using an etchant which leaves the support layer.

10. A method as claimed in claim 9, wherein following removal of the sacrificial regions, the support layer is further etched using the contact beam as a mask, so as to leave a portion forming a strengthening layer extending directly over the underside of the contact beam.

11. An image sensor comprising an array of pixels, each pixel comprising a photodiode and a micromechanical switch, the image sensor device being manufactured using a method as claimed in claim 1.

12. An image sensor device as claimed in claim 11 for detecting incident X-ray radiation, and including a conversion layer for converting incident X-ray radiation to optical radiation for detection by the photodiodes of the image sensor device.