Bi-level multilayered microelectronic device package with an integral window

• US 6,495,895 B1
• Filed: 02/01/2002
• Issued: 12/17/2002
• Est. Priority Date: 05/16/2000
• Status: Expired due to Term

• Current Assignee: National Technology & Engineering Solutions Of Sandia LLC (Honeywell International Inc.)
• Original Assignee: Sandia Corporation (Martin Marietta Corporation)
• Inventors: Peterson, Kenneth A., Watson, Robert D.
• Primary Examiner(s): Talbott, David L.
• Assistant Examiner(s): Thai, Luan
• Application Number:
  US10/062,220
• Time in Patent Office: 319 Days
• Field of Search: 257/434, 257/686, 257/778, 257/433, 257/432, 257/680, 257/685, 257/777, 257/780, 257/779, 257/784, 257/704, 257/738
• US Class Current: 257/434
• CPC Class Codes: B81B 7/0067 for controlling the passage of optical signals through the package
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 23/053 the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 27/14618 : Containers
• CPC Class Codes: H01L 27/14636 : Interconnect structures
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/0102 : Calcium [Ca]
• CPC Class Codes: H01L 2924/01025 : Manganese [Mn]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/16235 : Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/16788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H05K 1/02 : Details
• CPC Class Codes: H05K 1/181 : associated with surface mounted components

Abstract

A bi-level, multilayered package with an integral window for housing a microelectronic device. The device can be a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, or a IMEMS device. The multilayered package can be formed of a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC) multilayer processes with the window being simultaneously joined (e.g. cofired) to the package body during LTCC or HTCC processing. The microelectronic device can be flip-chip bonded and oriented so that the light-sensitive side is optically accessible through the window. A second chip can be bonded to the backside of the first chip, with the second chip being wirebonded to the second level of the bi-level package. The result is a compact, low-profile package, having an integral window that can be hermetically-sealed.

Claims

1. A package having an integral window for packaging at least one microelectronic device, comprising:

a first electrically insulating plate comprising a multilayered material, having a first surface, an opposing second surface, and a first aperture disposed through said first plate;

an electrically conductive metallized trace disposed on the second surface of said first plate;

an integral window disposed across the first aperture and bonded to said first plate, for providing optical access to a microelectronic device disposed within said assembly; and

a second electrically insulating plate having a third surface, an opposing fourth surface, and a second aperture disposed through said second plate;

an electrically conductive metallized trace disposed on the fourth surface of the second plate; and

a third electrically insulating plate, attached to the fourth surface;

wherein the third plate includes a third aperture disposed through said third plate;

wherein the third aperture is larger than the second aperture;

wherein the first plate is attached to the second plate by joining the second surface to the third surface; and

wherein the second aperture is larger than the first aperture.

2. The package of claim 1, wherein the window substantially fills the first aperture.

3. The package of claim 2, wherein the aperture-filling window is formed by casting a castable window material directly into the first aperture.

4. The package of claim 3, wherein the castable window material comprises molten glass that solidifies after casting.

5. The package of claim 3, wherein the castable window material comprises a liquid polymer that solidifies after casting.

6. The package of claim 1, wherein said window is bonded to the first surface.

7. The package of claim 1, wherein the geometry of the joint between the window and the first plate comprises an encased joint geometry.

8. The package of claim 1, wherein said window is bonded to a lip recessed inside of the first plate.

9. The package of claim 8, wherein said window is mounted flush with the first surface of the first plate.

10. The package of claim 1, wherein said window comprises an optically transparent material selected from the group consisting of glass, sapphire, fused silica, plastic, and polymer.

11. The package of claim 1, further comprising a surface treatment to improve wettability and adhesion of retiring surfaces.

12. The package of claim 1, wherein said window comprises an anti-reflection coating.

13. The package of claim 1, wherein said window comprises means for filtering selected wavelengths of light.

14. The package of claim 1, wherein said plates comprise a dielectric material selected from the group consisting of a ceramic, a polymer, a plastic, a glass, a glass-ceramic composite, a glass-polymer composite, a resin material, a fiber-reinforced composite, a glass-coated metal, a printed wiring board composition, and combinations thereof.

15. The package of claim 1, wherein said plates comprise a bulk ceramic material selected from the group consisting of alumina, beryllium oxide, silicon nitride, aluminum nitride, titanium nitride, titanium carbide, silicon carbide, and combinations thereof.

16. The package of claim 1, wherein the second plate comprises the same multilayered material as the first plate.

17. The package of claim 1, wherein the third plate comprises the same multilayered material as the first plate.

18. The package of claim 1, wherein said multilayered material comprises a high-temperature cofired ceramic multilayered material fired at a Ad temperature in the range of 1300 C. to 1800 C.

19. The package of claim 1, wherein said multilayered material comprises a low-temperature cofired ceramic multilayered material fired at a temperature in the range of 600 C to 1000 C.

20. The package of claim 1, wherein said multilayered material comprises a laminated multilayered printed wiring board composition.

21. The package of claim 1, further comprising a bonding material consisting of a material selected from the group consisting of a hermetic sealant and an adhesive.

22. The package of claim 1, further comprising a hermetic sealant selected from the group consisting of a braze alloy, a frit glass compound, a glass-ceramic composite, a glass-polymer compound, a ceramic-polymer compound, and a solder alloy.

23. The package of claim 1, further comprising an adhesive selected from the the group consisting of an epoxy resin, a polyimide adhesive, a silicone adhesive, and a urethane adhesive.

24. A sealed symmetric package having an integral window, comprising;

the package of claim 1; and

a second package substantially identical to the package of claim 1;

wherein the package of claim 1;

is inverted and bonded to the second package to form a sealed symmetric package.

25. A double-stacked package having an integral window, comprising;

the package of claim 1; and

a second package substantially identical to the package of claim 1;

wherein the package of claim 1 is stacked on top of, and is bonded to, the second package to form a double-stacked package.

26. The package of claim 1, wherein said window further comprises a lens for optically transforming the light that passes through the window.

27. The package of claim 26, wherein said lens is attached to said window.

28. The package of claim 26, wherein said lens is integrally formed with said window.

29. The package of claim 26, further comprising an array of binary optic lenslets made integral with said window.

30. The package of claim 1, further comprising an electrically-switched optical modulator attached to said package, for modulating light passing through an aperture.

31. The package of claim 30, wherein said electrically-switched optical modulator comprises a lithium niobate window.

32. The package of claim 1, further comprising electrically conductive vias disposed within said electrically insulating plates, for conducting electrical signals in a direction generally perpendicular to the plane of said plates.

33. The package of claim 1, further comprising a microelectronic device mounted within said package.

34. The package of claim 33, wherein said microelectronic device is a device selected from the group consisting of a semiconductor chip, a CCD chip, a CMOS chip, a VCSEL chip, a laser diode, a MEMS device, and a IMEMS device.

35. The package of claim 34, wherein said microelectronic device is mounted to the second surface.

36. The package of claim 33, wherein said microelectronic device is flip-chip mounted to the second surface.

37. The package of claim 33, wherein said microelectronic device comprises a light-sensitive side.

38. The package of claim 37, wherein said light-sensitive side is mounted facing said window.

39. The package of claim 33, further comprising a cover lid bonded to the package, for covering and sealing said package.

40. The package of claim 39, wherein said cover lid comprises a window for providing optical access through the second aperture.

41. The package of claim 39, wherein the ambient air inside said package has been substantially removed and replaced with at least one gas other than air.

42. The package of claim 33, further comprising a seal disposed in-between said microelectronic device and the second surface.

43. The package of claim 1, further comprising a first microelectronic device, flip-chip mounted to the second surface;

and a second microelectronic device, flip-chip mounted to the fourth surface.

44. The package of claim 43, further comprising a cover lid bonded to the package, for covering and sealing said package.

45. The package of claim 1, further comprising a first microelectronic device, flip-chip mounted to the second surface;

and a second microelectronic device, bonded to the backside of said first device;

wherein said second device is wirebonded to the fourth surface.

46. The package of claim 45, further comprising a cover lid bonded to the package;

wherein said second device comprises a light-sensitive side; and

wherein said second device is mounted with said light-sensitive side facing towards said cover lid, and further wherein said cover lid comprises a window for providing optical access to said light-sensitive side of said second device.