Integrated circuit inductor

• US 6,495,903 B2
• Filed: 12/13/2000
• Issued: 12/17/2002
• Est. Priority Date: 05/25/2000
• Status: Expired due to Fees

• Current Assignee: Institute of Microelectronics
• Original Assignee: Institute of Microelectronics
• Inventors: Sridhar, Uppili, Xu, Bai, Feng, Hanhua, Xu, Shuming, Foo, Pang Dow
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Ha, Nathan W.
• Application Number:
  US09/737,439
• Publication Number:
  US 20010045617A1
• Time in Patent Office: 734 Days
• Field of Search: 257/531, 257/533, 257/534, 257/538, 438/957, 438/255, 438/398, 438/665
• US Class Current: 257/531
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 28/10 Inductors

Abstract

An inductor has a spiral aluminum track deposited on an oxide layer over a silicon substrate. The substrate is etched away to form a trench, which extends around beneath the track and provides an air gap having a low dielectric constant. The oxide layer has an inner region within the track, an outer region outside the track and a bridging region extending between the other regions. The bridging region is comprised of intact bridges and gaps therebetween, which are open to the trench and through which an etchant has access to the silicon substrate to form the trench by etching.

Claims

1. An integrated circuit inductor, the integrated circuit having a silicon substrate and an oxide layer on the silicon substrate, the inductor comprising:

an inductive loop deposited on the oxide layer;

a plurality of apertures in the oxide layer beneath the inductive loop;

a plurality of bridges adjacent the apertures and provided by portions of the oxide layer between an inner region and an outer region of the oxide layer, respectively within and without the inductive loop, the loop being supported on the bridges; and

a trench formed in the silicon substrate beneath the bridges, to provide an air gap between the inductive loop and the silicon substrate.

2. The integrated circuit inductor as claimed in claim 1, wherein the apertures and the bridges extend generally radially from the inner region.

3. The integrated circuit inductor as claimed in claim 1, wherein the trench extends circumferentially around the inner region.

4. The integrated circuit inductor as claimed in claim 2, wherein the trench extends circumferentially around the inner region.

5. The integrated circuit inductor as claimed in claim 1, wherein the inductive loop has a plurality of spirally arranged turns.

6. The integrated circuit inductor as claimed in claim 2, wherein the inductive loop has a plurality of spirally arranged turns.

7. The integrated circuit inductor as claimed in claim 3, wherein the inductive loop has a plurality of spirally arranged turns.

8. The integrated circuit inductor as claimed in claim 1, wherein the oxide layer includes an underpass connection in one of the bridges from a peripheral connection to another end of the inductor to its inner end.

9. An integrated circuit inductor, the integrated circuit having a silicon substrate and an oxide layer on the silicon substrate, the inductor comprising:

an inductive loop deposited on the oxide layer;

a plurality of apertures in the oxide layer beneath the inductive loop, each aperture forming an underpass to a plurality of segments of the inductive loop;

a plurality of bridges adjacent the apertures and provided by portions of the oxide layer between an inner region and an outer region of the oxide layer, respectively within and without the inductive loop, the loop being supported on the bridges; and

a trench formed in the silicon substrate beneath the bridges, to provide an air gap between the inductive loop and the silicon substrate.