Semiconductor clamped-stack assembly

• US 6,495,913 B2
• Filed: 07/24/2001
• Issued: 12/17/2002
• Est. Priority Date: 08/02/2000
• Status: Expired due to Fees

• Current Assignee: ABB Schweiz AG (ABB Limited)
• Original Assignee: ABB Industrie AG (ABB Limited)
• Inventors: Grüning, Horst
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): Erdem, Fazli
• Application Number:
  US09/910,773
• Publication Number:
  US 20020017717A1
• Time in Patent Office: 511 Days
• Field of Search: 257/177, 257/181, 257/685, 257/686, 257/688, 257/706, 257/707, 257/712, 257/713, 257/718, 257/719, 257/720, 257/726, 257/727, 257/723, 257/730, 257/691, 361/690-695, 361/707-711
• US Class Current: 257/718
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

A semiconductor clamped-stack assembly (32) has at least two clamped stacks, each of these clamped stacks having a plurality of power semiconductor components (8) and a plurality of heat sinks (6), which are arranged in series along a horizontally extending axial direction (A). According to the invention, power semiconductor components (8) from different clamped stacks are assigned to one another and are located in a common mounting plane, which is perpendicular to the axial directions (A) of the clamped stacks (31). Mutually associated power semiconductor components (8) can be removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction, which lies in the mounting plane. Mutually associated power semiconductor components (8) are preferably mounted on a common plate (14). As a result, they can be dismantled when the clamped-stack assembly (32) is loosened, without further power semiconductor components or heat sinks having to be dismantled. The plate (14) is hooked into frame rods (1) belonging to the clamped-stack assembly (32) or guided in guide rails (18).

Claims

1. A semiconductor clamped-stack assembly, having at least two clamped stacks, each of the clamped stacks having a plurality of power semiconductor components and a plurality of heat sinks, and the power semiconductor components and heat sinks of a clamped stack being arranged in series along a horizontally extending axial direction of the clamped stack, the clamped stacks being arranged parallel to one another in a common frame, and the power semiconductor components being mounted on carrier elements,

wherein power semiconductor components from different clamped stacks are assigned to one another, these mutually associated power semiconductor components are located in a common mounting plane, which is perpendicular to the axial directions of the clamped stacks, and the mutually associated power semiconductor components are capable of being, together with associated carrier elements, removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction which lies in the mounting plane, without further power semiconductor components having to be dismantled.

2. The semiconductor clamped-stack assembly as claimed in claim 1, wherein the mutually associated power semiconductor components have common fixing means for fixing to the frame.

3. The semiconductor clamped-stack assembly as claimed in claim 1, wherein the mutually associated power semiconductor components are mounted on a common carrier element.

4. The semiconductor clamped-stack assembly as claimed in claim 1, wherein the mutually associated power semiconductor components are mounted on individual carrier elements and can be removed or inserted, respectively, one after another.

5. The semiconductor clamped-stack assembly as claimed in claim 1, wherein the carrier elements are guided in guide rails.

6. The semiconductor clamped-stack assembly as claimed in claim 1, wherein the carrier elements are hooked in to the frame or to connecting elements by means of guide means.

7. The semiconductor clamped-stack assembly as claimed in claim 1, wherein heat sinks are connected electrically via a busbar system, and this busbar system at least partly comprises sheet metal plates.

8. The semiconductor clamped-stack assembly as claimed in claim 1, wherein heat sinks from different clamped stacks are assigned to one another, these mutually associated heat sinks are located in a common plane, which is perpendicular to the axial directions A of the clamped stacks, and the mutually associated heat sinks have a common heat-sink holder, which connects the heat sinks to the frame.

9. The semiconductor clamped-stack assembly as claimed in claim 1, wherein the power semiconductor components can be replaced by access from only one side of the clamped-stack assembly.

10. The semiconductor clamped-stack assembly as claimed in claim 1, wherein when the clamped stacks a re loosened, the power semiconductor components can be removed and inserted without mechanical aids.

11. A semiconductor clamped-stack assembly, having at least two clamped stacks, each of the clamped stacks having a plurality of power semiconductor components and a plurality of heat sinks, and the power semiconductor components and heat sinks of a clamped stack being arranged in series along a horizontally extending axial direction of the clamped stack, the clamped stacks being arranged parallel to one another in a common frame, and the power semiconductor components being mounted on carrier elements, wherein power semiconductor components from different clamped stacks are assigned to one another, these mutually associated power semiconductor components are located in a common mounting plane, which is perpendicular to the axial directions of the clamped stacks, and mutually associated power semiconductor components being capable of being removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction which lies in the mounting plane, wherein the carrier elements are guided in guide rails.

12. A semiconductor clamped-stack assembly, having at least two clamped stacks, each of the clamped stacks having a plurality of power semiconductor components and a plurality of heat sinks, and the power semiconductor components and heat sinks of a clamped stack being arranged in series along a horizontally extending axial direction of the clamped stack, the clamped stacks being arranged parallel to one another in a common frame, and the power semiconductor components being mounted on carrier elements, wherein power semiconductor components from different clamped stacks are assigned to one another, these mutually associated power semiconductor components are located in a common mounting plane, which is perpendicular to the axial directions of the clamped stacks, and mutually associated power semiconductor components being capable of being removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction which lies in the mounting plane, wherein the carrier elements are hooked in to the frame or to connecting elements by means of guide means.

13. A semiconductor clamped-stack assembly, having at least two clamped stacks, each of the clamped stacks having a plurality of power semiconductor components and a plurality of heat sinks, and the power semiconductor components and heat sinks of a clamped stack being arranged in series along a horizontally extending axial direction of the clamped stack, the clamped stacks being arranged parallel to one another in a common frame, and the power semiconductor components being mounted on carrier elements, wherein power semiconductor components from different clamped stacks are assigned to one another, these mutually associated power semiconductor components are located in a common mounting plane, which is perpendicular to the axial directions of the clamped stacks, and mutually associated power semiconductor components being capable of being removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction which lies in the mounting plane, wherein heat sinks are connected electrically via a busbar system, and this busbar system at least partly comprises sheet metal plates.

14. A semiconductor clamped-stack assembly, having at least two clamped stacks, each of the clamped stacks having a plurality of power semiconductor components and a plurality of heat sinks, and the power semiconductor components and heat sinks of a clamped stack being arranged in series along a horizontally extending axial direction of the clamped stack, the clamped stacks being arranged parallel to one another in a common frame, and the power semiconductor components being mounted on carrier elements, wherein power semiconductor components from different clamped stacks are assigned to one another, these mutually associated power semiconductor components are located in a common mounting plane, which is perpendicular to the axial directions of the clamped stacks, and mutually associated power semiconductor components being capable of being removed from the clamped-stack assembly or, respectively, inserted into the clamped-stack assembly in a common mounting direction which lies in the mounting plane, wherein when the clamped stacks are loosened, the power semiconductor components can be removed and inserted without mechanical aids.