SOI pass-gate disturb solution
First Claim
1. A method of fabricating a field effect transistor, comprising fabricating the field effect transistor in a substrate with a source, a drain and a gate, wherein the body of the field effect transistor is electrically floating and the transistor is substantially electrically isolated from the substrate, and providing a high resistance path coupling the electrically floating body of the field effect transistor to the gate of the field effect transistor.
2 Assignments
0 Petitions
Accused Products
Abstract
An SOI pass-gate disturb solution for an N-type MOSFET wherein a resistor is connected between the gate and the body of the FET to eliminate the disturb condition. The FET is fabricated in a substrate having a source, a drain and a gate, wherein the body of the field effect transistor is electrically floating and the transistor is substantially electrically isolated from the substrate. A high resistance path is provided coupling the electrically floating body of the FET to the gate, such that the body discharges to a low state before significant thermal charging can occur when the gate is low, and thus prevents the accumulation of a charge on the body when the transistor is off. The resistance of the high resistance path is preferably approximately 1010 Ohms−um divided by the width of the pass-gate.
-
Citations
7 Claims
- 1. A method of fabricating a field effect transistor, comprising fabricating the field effect transistor in a substrate with a source, a drain and a gate, wherein the body of the field effect transistor is electrically floating and the transistor is substantially electrically isolated from the substrate, and providing a high resistance path coupling the electrically floating body of the field effect transistor to the gate of the field effect transistor.
Specification