High flux LED array

• US 6,498,355 B1
• Filed: 10/09/2001
• Issued: 12/24/2002
• Est. Priority Date: 10/09/2001
• Status: Expired due to Term

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Lumileds Lighting US LLC (Apollo Global Management, Inc.)
• Inventors: Harrah, Shane, Woolverton, Douglas P.
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): MANDALA, VICTOR A
• Application Number:
  US09/974,563
• Time in Patent Office: 441 Days
• Field of Search: 257/79, 257/82, 257/88, 257/117, 257/184, 257/254, 257/99, 257/100, 257/676, 257/706, 257/707, 257/774, 366/236.4, 366/365, 366/368, 366/373, 366/800, 438/22, 438/24, 438/25, 438/26, 438/27, 438/28, 438/29, 438/46, 438/47
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/056 the metal substrate being covered by an organic insulating layer
• CPC Class Codes: H05K 2201/0305 Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 3/4038 Through-connections; Vertical interconnect access [VIA] connections H05K3/403, H05K3/42 take precedence

Abstract

A light emitting diode array in accordance with the present invention includes a metal substrate, a dielectric layer disposed above the metal substrate, and a plurality of electrically conductive traces disposed on the dielectric layer. A plurality of vias pass through the dielectric layer. The light emitting diode array also includes a plurality of light emitting diodes, each of which is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact electrically coupled to separate ones of the electrically conductive traces. Each of the vias contains a thermally conductive material in thermal contact with the metal substrate and in thermal contact with the corresponding light emitting diode.

Claims

1. A light emitting diode array comprising:

a metal substrate;

a dielectric layer through which pass a plurality of vias, said dielectric layer disposed above said metal substrate;

a plurality of electrically conductive traces disposed on said dielectric layer; and

a plurality of light emitting diodes, each having a die within a body, each of which light emitting diodes is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact, said first electrical contact and said second electrical contact electrically coupled to separate ones of said electrically conductive traces;

wherein each of said vias contains a thermally conductive material in thermal contact with said metal substrate and in direct thermal contact with the body of said corresponding one of said light emitting diodes.

2. The light emitting diode array of claim 1, wherein said metal substrate has a thickness greater than about 0.01 inches.

3. The light emitting diode array of claim 1, wherein at least one of said light emitting diodes includes said first electrical contact and said second electrical contact disposed on a same side of said one of said light emitting diodes and said same side is oriented to face said metal substrate.

4. The light emitting diode array of claim 1, wherein said thermally conductive material in at least one of said vias is electrically isolated from said plurality of conductive traces and electrically isolated from said first and said second electrical contacts of said corresponding one of said light emitting diodes.

5. The light emitting diode array of claim 1, wherein said thermally conductive material includes a solder material.

6. The light emitting diode array of claim 1, wherein said thermally conductive material in at least one of said vias is in direct contact with said corresponding one of said light emitting diodes.

7. The light emitting diode array of claim 1, wherein said thermally conductive material in at least one of said vias is in direct contact with said metal substrate.

8. The light emitting diode array of claim 1, further comprising a submount disposed between one of said light emitting diodes and said corresponding one of said vias and in direct contact with said thermally conductive material in said corresponding one of said vias.

9. The light emitting diode array of claim 8, wherein said submount includes silicon.

10. The light emitting diode array of claim 8, wherein said submount includes vias through which said first electrical contact and said second electrical contact of said one of said light emitting diodes are electrically coupled to said electrically conductive traces.

11. A method of forming a light emitting diode array, the method comprising:

disposing above a metal substrate a dielectric layer on which are formed a plurality of electrically conductive traces;

forming a plurality of vias in said dielectric layer, each of said vias exposing said metal substrate;

introducing into each of said vias a thermally conductive material which makes thermal contact with said metal substrate;

disposing each of a plurality of light emitting diodes above a corresponding one of said vias such that each light emitting diode is in thermal contact with said thermally conducting material in said corresponding via; and

for each of said light emitting diodes electrically coupling a first electrical contact and a second electrical contact to separate ones of said electrically conductive traces.

12. The method of claim 11, wherein said metal substrate has a thickness greater than about 0.01 inches.

13. The method of claim 11, further comprising electrically isolating said thermally conductive material in at least one of said vias from said plurality of conductive traces and from said first and said second electrical contacts of said corresponding one of said light emitting diodes.

14. The method of claim 11, further comprising introducing a solder material into at least one of said vias.

15. The method of claim 11, further comprising disposing at least one of said light emitting diodes such that it is in direct contact with said thermally conducting material in said corresponding via.

16. The method of claim 11, wherein said thermally conductive material in at least one of said vias is in direct contact with said metal substrate.

17. The method of claim 11, further comprising disposing a submount between one of said light emitting diodes and said corresponding one of said vias such that said submount is in direct contact with said thermally conductive material in said corresponding one of said vias.

18. The method of claim 17, further comprising forming said submount from silicon.

19. The method of claim 17, further comprising forming vias in said submount through which said first electrical contact and said second electrical contact of said one of said light emitting diodes are electrically coupled to said electrically conductive traces.

20. The method of claim 11, each of the light emitting diodes having a die within a body, wherein the body of each light emitting diode is in direct contact with said thermally conducting material in said corresponding via.

21. A light emitting diode array comprising:

a metal substrate;

a dielectric layer through which pass a plurality of vias, said dielectric layer disposed above said metal substrate;

a plurality of electrically conductive traces disposed on said dielectric layer; and

a plurality of light emitting diodes, each of which light emitting diodes is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact, said first electrical contact and said second electrical contact electrically coupled to separate ones of said electrically conductive traces;

wherein each of said vias contains a thermally conductive material in thermal contact with said metal substrate and in thermal contact with said corresponding one of said light emitting diodes;

wherein said thermally conductive material in at least one of said vias is electrically isolated from said plurality of conductive traces and electrically isolated from said first and said second electrical contacts of said corresponding one of said light emitting diodes.

22. A light emitting diode array comprising:

a metal substrate;

a dielectric layer through which pass a plurality of vias, said dielectric layer disposed above said metal substrate;

a plurality of electrically conductive traces disposed on said dielectric layer; and

a plurality of light emitting diodes, each of which light emitting diodes is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact, said first electrical contact and said second electrical contact electrically coupled to separate ones of said electrically conductive traces;

wherein each of said vias contains a thermally conductive material in thermal contact with said metal substrate and in thermal contact with said corresponding one of said light emitting diodes;

wherein said thermally conducting material includes a solder material.

23. A light emitting diode array comprising:

a metal substrate;

a dielectric layer through which pass a plurality of vias, said dielectric layer disposed above said metal substrate;

a plurality of electrically conductive traces disposed on said dielectric layer; and

a plurality of light emitting diodes, each of which light emitting diodes is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact, said first electrical contact and said second electrical contact electrically coupled to separate ones of said electrically conductive traces;

wherein each of said vias contains a thermally conductive material in thermal contact with said metal substrate and in thermal contact with said corresponding one of said light emitting diodes;

wherein said thermally conducting material in at least one of said vias is in direct contact with said corresponding one of said light emitting diodes.

24. A light emitting diode array comprising:

a metal substrate;

a dielectric layer through which pass a plurality of vias, said dielectric layer disposed above said metal substrate;

a plurality of electrically conductive traces disposed on said dielectric layer; and

a plurality of light emitting diodes, each of which light emitting diodes is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact, said first electrical contact and said second electrical contact electrically coupled to separate ones of said electrically conductive traces;

wherein each of said vias contains a thermally conductive material in thermal contact with said metal substrate and in thermal contact with said corresponding one of said light emitting diodes;

wherein said thermally conductive material in at least one of said vias is in direct contact with said metal substrate.

25. A light emitting diode array comprising:

a metal substrate;

a dielectric layer through which pass a plurality of vias, said dielectric layer disposed above said metal substrate;

a plurality of electrically conductive traces disposed on said dielectric layer; and

a plurality of light emitting diodes, each of which light emitting diodes is disposed above a corresponding one of said vias and each of which includes a first electrical contact and a second electrical contact, said first electrical contact and said second electrical contact electrically coupled to separate ones of said electrically conductive traces;

wherein each of said vias contains a thermally conductive material in thermal contact with said metal substrate and in thermal contact with said corresponding one of said light emitting diodes;

further comprising a submount disposed between one of said light emitting diodes and said corresponding one of said vias and in direct contact with said thermally conductive material in said corresponding one of said vias.