Method and apparatus for mounting printed circuit board components
First Claim
Patent Images
1. A printed circuit board assembly, which comprises:
- a) a mounting board, said mounting board having a top surface and a bottom surface;
b) said mounting board having at least two mounting points for receiving an electrical component; and
c) said mounting board having a slot between said at least two mounting points, said slot extending from the top surface of said mounting board to the bottom surface of said mounting board and having a length greater than a width of said electrical component and a width less than a length of said electrical component, said slot preventing current from passing through said mounting board between each of said at least two mounting points due to a heat-induced change of the properties of the mounting board.
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Abstract
A method and apparatus for mounting heat generating components on a printed circuit board. Components mounted on the printed circuit board that generate heat may alter the properties of the printed circuit board and allow the printed circuit board to conduct current. To stop the flow of current in the printed circuit board, a slot may be used between the mounting points of the component. The slot prevents current from flowing within the printed circuit board.
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Citations
26 Claims
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1. A printed circuit board assembly, which comprises:
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a) a mounting board, said mounting board having a top surface and a bottom surface;
b) said mounting board having at least two mounting points for receiving an electrical component; and
c) said mounting board having a slot between said at least two mounting points, said slot extending from the top surface of said mounting board to the bottom surface of said mounting board and having a length greater than a width of said electrical component and a width less than a length of said electrical component, said slot preventing current from passing through said mounting board between each of said at least two mounting points due to a heat-induced change of the properties of the mounting board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A printed circuit board assembly, which comprises:
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a) a mounting board, said mounting board having a top surface and a bottom surface;
b) an electrical component that radiates heat to the top surface of said mounting board;
c) a means for attaching said electrical component to said mounting board at least two mounting points; and
d) a means for preventing current from passing through said mounting board between each of said mounting points due to a heat-induced change of the electrical properties of the mounting board. - View Dependent Claims (11, 12, 13)
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14. A printed circuit board comprising:
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at least two mounting points for connecting an electrical component to the circuit board; and
a slot between the mounting points having a length greater than the width of the electrical component and a width less than the length of the electrical component, the slot preventing current from passing between the mounting points through the printed circuit board due to a heat-induced change of the electrical properties of the printed circuit board. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21)
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- 22. A method of preventing current flow between two mounting points on a printed circuit board due to heating of a printed circuit board, the method comprising providing a slot between the mounting points, the slot having a length greater than a width of an electrical component to be attached to the mounting points and a width less than the length of the electrical component.
Specification