Methods and structures for electronic probing arrays
First Claim
1. A method of making a probe card comprising the steps of:
- (a) providing a sacrificial layer, a substrate having electrical circuits thereon and a plurality of elongated leads, each said lead having a first end connected to said sacrificial layer, and a second end attached to said substrate and connected to the circuits thereon, the first ends of at least some of said leads being physically connected to the first ends of others of said leads by said sacrificial layer;
(b) moving said substrate and said sacrificial layer away from one another so as to bend the second ends of said leads away from said sacrificial layer while leaving the first ends of said leads in position on said sacrificial layer; and
(c) injecting a flowable material around said leads and curing said flowable material to form a dielectric encapsulant layer surrounding said leads; and
(d) at least partially removing said sacrificial layer so as to leave terminals at said first ends of said leads movable with respect to said substrate.
1 Assignment
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Accused Products
Abstract
A probe card for testing an electrical element such as a semiconductor wafer or a printed wiring board includes a substrate with circuitry thereon, an encapsulant layer overlying the substrate and a multiplicity of leads extending upwardly from the substrate through the encapsulant layer to terminals, the terminals projecting above the encapsulant layer. The probe card can be engaged with the electronic element so that the tips of the leads bear on the contact pads of the electronic element, and so that the leads and encapsulant layer deform to accommodate irregularities in the electronic element or probe card. The card can be made by providing the substrate, a sacrificial layer and leads extending between the sacrificial layer and substrate, moving the substrate and sacrificial layer away from one another to deform the leads and injecting a curable material around the leads to form the encapsulant layer.
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Citations
11 Claims
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1. A method of making a probe card comprising the steps of:
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(a) providing a sacrificial layer, a substrate having electrical circuits thereon and a plurality of elongated leads, each said lead having a first end connected to said sacrificial layer, and a second end attached to said substrate and connected to the circuits thereon, the first ends of at least some of said leads being physically connected to the first ends of others of said leads by said sacrificial layer;
(b) moving said substrate and said sacrificial layer away from one another so as to bend the second ends of said leads away from said sacrificial layer while leaving the first ends of said leads in position on said sacrificial layer; and
(c) injecting a flowable material around said leads and curing said flowable material to form a dielectric encapsulant layer surrounding said leads; and
(d) at least partially removing said sacrificial layer so as to leave terminals at said first ends of said leads movable with respect to said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification