Cooling disk unit for use in a wafer chucking device

• US 6,499,533 B2
• Filed: 03/01/2001
• Issued: 12/31/2002
• Est. Priority Date: 05/25/2000
• Status: Expired due to Fees

• Current Assignee: Sumitomo Heavy Industries Limited
• Original Assignee: Sumitomo Heavy Industries Limited
• Inventors: Yamada, Shunji
• Primary Examiner(s): Flanigan, Allen
• Application Number:
  US09/795,494
• Publication Number:
  US 20010045269A1
• Time in Patent Office: 670 Days
• Field of Search: 165/80.4, 165/167, 165/168, 165/170, 165/80.1
• US Class Current: 165/80.1
• CPC Class Codes: F28D 9/0012 the apparatus having an annular form
• CPC Class Codes: F28F 2250/102 with change of flow direction
• CPC Class Codes: H01L 21/67103 mainly by conduction

Abstract

A cooling disk unit is used in a wafer chucking device and comprises first and second heat conducting disks one of which is concentrically superposed on the other in a casing. The first heat conducting disk has a first plurality of radial channels while the second heat conducting disk has a second plurality of radial channels. The first radial channels are connected to the second radial channels at either their inside ends or their outside ends so as to flow a cooling fluid from the first (or second) radial channels to the second (or first) radial channels.

Claims

1. A cooling disk unit for cooling a wafer chucking device by exchanging heat with a cooling fluid passing therethrough, said cooling disk unit comprising:

a first heat conducting disk having a plurality of first radial channels which are connected to one another at both first inside ends and first outside ends, wherein heat is exchanged between said first heat conducting disk and said cooling fluid flowing inward in said first radial channels; and

a second heat conducting disk concentrically disposed on either a top or a bottom of said first heat conducting disk and having a plurality of second radial channels connected to one another at both second inside ends and second outside ends and connected to said first radial channels at either one of said second inside ends or said second outside ends,

wherein heat is exchanged between said second heat conducting disk and said cooling fluid flowing outward in said second radial channels,

wherein said first and second radial channels have equal diameters relative to each other, and

wherein said first and second radial channels are connected in a serial manner and the cooling fluid flowing in a one direction through either one of said first and second radial channels is constrained to flow in an opposite direction through said other one of said first and second radial channels.

2. A cooling disk unit as claimed in claim 1, wherein said first heat conducting disk comprises a first circular plate member, a plurality of first sectorial shaped members arranged in a circle at regular intervals on said first circular plate member, wherein said regular intervals correspond to said equal diameter of said first and second radial channels;

and

said second heat conducting disk comprising a second circular plate member, a plurality of second sectorial shaped members arranged in a circle at regular intervals on said second circular plate member.

4. A cooling disk unit as claimed in claim 1, wherein said first heat conducting disk and said second heat conducting disk is made of copper, copper alloy, aluminum, or aluminum alloy.

5. A cooling disk unit as claimed in claim 1, wherein said cooling disk further comprises a metallic casing for containing both said first heat conducting disk and said second heat conducting disk.

3. A cooling disk for cooling a wafer chucking device by exchanging heat with a cooling fluid passing therethrough, said cooling disk unit comprising:

a first heat conducting disk having a plurality of first radial channels which are connected to one another at both first inside ends and first outside ends, wherein heat is exchanged between said first heat conducting disk and said cooling fluid flowing inward in said first radial channels; and

a second heat conducting disk concentrically disposed on either a top or a bottom of said first heat conducting disk and having a plurality of second radial channels which are connected to one another at both second inside ends and second outside ends and to said first radial channels at either one of said second inside ends or said second outside ends, wherein heat is exchanged between said second heat conducting disk and said cooling fluid flowing outward in said radial channels,

wherein said first and second radial channels have equal diameters relative to each other,

wherein said first heat conducting disk further has a first outside channel for connecting said first radial channels to one another at said first outside ends; and

said second heat conducting disk having a second outside channel for connecting said second radial channels to one another at said second outside ends.

6. A cooling disk unit for cooling a wafer chucking device by exchanging heat with a cooling fluid passing therethrough, said cooling disk unit comprising:

a first heat conducting disk having a plurality of first radial channels which are connected to one another at both first inside ends and first outside ends, wherein heat is exchanged between said first heat conducting disk and said cooling fluid flowing inward in said first radial channels; and

a second heat conducting disk concentrically disposed on either a top or a bottom of said first heat conducting disk and having a plurality of second radial channels which are connected to one another at both second inside ends and second outside ends and to said first radial channels at either one of said second inside ends or said second outside ends, wherein heat is exchanged between said second heat conducting disk and said cooling fluid flowing outward in said second radial channels,

wherein said first and second radial channels have equal diameters relative to each other,

wherein said cooling disk further comprises a metallic casing for containing both said first heat conducting disk and said second heat conducting disk, and

wherein said metallic casing is made of a metal or an alloy harder than copper.

7. A wafer chucking device comprising:

a wafer chucking unit for chucking a semiconductor wafer thereon; and

a cooling disk unit disposed under said wafer chucking unit for cooling said semiconductor wafer through said wafer chucking unit by passing a cooling fluid therethrough, wherein;

a first heat conducting disk having a plurality of first radial channels which are connected to one another at both first inside ends and first outside ends, wherein heat is exchanged between said first heat conducting disk and said cooling fluid flowing inward in said first radial channels; and

a second heat conducting disk concentrically disposed on either a top or a bottom of said first heat conducting disk and having a plurality of second radial channels connected to one another at both second inside ends and second outside ends and connected to said first radial channels at either one of said second inside ends or said second outside ends,

wherein heat is exchanged between said second heat conducting disk and said cooling fluid flowing outward in said second radial channels,

wherein said first and second radial channels have equal diameters relative to each other, and

wherein said first and second radial channels are connected in a serial manner and the cooling fluid flowing in a one direction through either one of said first and second radial channels is directed to flowing in an opposite direction through said other one of said first and second radial channels.