Light emitting diode assembly with low thermal resistance

• US 6,501,103 B1
• Filed: 10/23/2001
• Issued: 12/31/2002
• Est. Priority Date: 10/23/2001
• Status: Expired due to Term

• Current Assignee: Lite-On Technology Corporation
• Original Assignee: Lite-On Electronics Company Limited (Lite-On Technology Corporation)
• Inventors: Lee, Po-Hsien, Jory, Tom, Hsing Chen, Chen-Lun
• Primary Examiner(s): Flynn, Nathan J.
• Assistant Examiner(s): GREENE, PERSHELLE L
• Application Number:
  US09/983,133
• Time in Patent Office: 434 Days
• Field of Search: 257/678, 257/712, 257/734, 257/773, 257/774, 257/718, 257/719, 257/741, 257/750, 257/762, 257/787, 257/706, 257/707, 257/713, 257/717, 257/720, 257/432, 257/433, 257/434, 257/80, 257/675, 257/81, 257/82, 257/83, 257/85, 257/290, 257/291, 257/99, 257/100, 257/676, 362/800, 362/547, 362/294, 362/373
• US Class Current: 257/100
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10553 Component over metal, i.e. metal plate in between bottom of component and surface of PCB
• CPC Class Codes: H05K 2201/1056 Metal over component, i.e. metal plate over component mounted on or embedded in PCB
• CPC Class Codes: H05K 3/0061 onto a metallic substrate, e.g. a heat sink heat sinks for electric apparatus H05K7/20
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence

Abstract

A light emitting diode assembly with low thermal resistance comprises an LED, a circuit board and a heat-dissipating substrate. The LED has a die mounted on a heat-dissipating plate and pads connected to a printed circuit board. The LED is mounted on a circuit board and a heat-dissipating substrate, whereby the thermal resistance of the LED assembly can be advantageously reduced to enhance the performance of the LED assembly.

Claims

1. A light emitting diode assembly with low thermal resistance, comprising:

a light emitting diode having a heat-dissipating plate having a central recess formed therein, a die positioned in contact with said heat dissipating plate within said recess, a printed circuit board positioned atop said heat dissipating plate and having a central aperture formed therein and circumscribing said die, and a protective encapsulation formed atop the die;

a heat-dissipating structure connected to the heat-dissipating plate; and

a circuit board connected to the heat-dissipating substrate, said circuit board having a central opening formed therein and circumscribing said heat dissipating plate.

2. The light emitting diode assembly with low thermal resistance as in claim 1, wherein the printed circuit board is connected to the circuit board and the heat-dissipating substrate through a plurality of pins, at least one copper trace or a connector.

3. The light emitting diode assembly with low thermal resistance as in claim 1, wherein the printed circuit board and the circuit board include either of a group including a rigid circuit board, flexible circuit board, metal frame, and a circuit trace on a metal plate.

4. The light emitting diode assembly with low thermal resistance as in claim 2, wherein each of the circuit board and the heat-dissipating structure has a plurality of via holes through which the pins of the printed circuit board pass.

5. A light emitting diode assembly with low thermal resistance, comprising:

a light emitting diode having a heat-dissipating plate having a central recess formed therein, a die positioned in contact with said heat dissipating plate within said recess, a printed circuit board positioned atop said heat-dissipating plate and having a central opening formed therein and circumscribing said die, and a protective encapsulation formed atop the die;

a heat-dissipating substrate connected to the heat-dissipating plate; and

a circuit board positioned atop the printed circuit board and having a central opening circumscribing said protective encapsulation.

6. The light emitting diode assembly with low thermal resistance as in claim 5, wherein the printed circuit board is connected to the circuit board and the heat-dissipating substrate through a plurality of pins, at least one copper trace or a connector.

7. The light emitting diode assembly with low thermal resistance as in claim 5, wherein the printed circuit board and the circuit board include either of a group including a rigid circuit board, flexible circuit board, metal frame, and a circuit trace on a metal plate.