Hall effect sensor assembly with cavities for integrated capacitors

• US 6,501,270 B1
• Filed: 05/15/2000
• Issued: 12/31/2002
• Est. Priority Date: 05/15/2000
• Status: Expired due to Fees

• Current Assignee: Siemens VDO Automotive Corporation (Siemens AG)
• Original Assignee: Siemens VDO Automotive Corporation (Siemens AG)
• Inventors: Opie, John
• Primary Examiner(s): Lefkowitz, Edward
• Assistant Examiner(s): Aurora, Reena
• Application Number:
  US09/570,717
• Time in Patent Office: 960 Days
• Field of Search: 324/251, 324/252, 324/207.2, 174/52.2, 327/510, 327/511, 338/32.H
• US Class Current: 324/251
• CPC Class Codes: G01R 33/07 Hall effect devices
• CPC Class Codes: H10N 52/80 Constructional details

Abstract

A Hall effect sensor and capacitor assembly includes leadless chip type capacitors employed as EMI shielding/ESD protection and bypass capacitors. In a first embodiment, a molded carrier structure provides a housing for mounting a Hall cell element as well as one or more EMI shielding or bypass capacitors. The carrier housing facilitates interconnection of the Hall cell and the chip capacitor. Additionally, this structure simplifies the manufacturing process for connection of the smaller leadless chip capacitor components. In an alternate embodiment, an insulated, molded encapsulation is applied and surrounds the chip capacitors and the connections to the Hall effect sensor leads.

Claims

1. A hall element and capacitor assembly for holding a hall element with a hall cell and electrical leads, comprising:

a carrier housing mounting the hall cell and having at least one cavity separate from the hall cell and within which one or more leads of the Hall element are located; and

a leadless chip capacitor having a defined height located within said cavity connected to one of said leads of the hall element; and

wherein the cavity is defined by solid walls having a greater height then the capacitor.

2. The Hall element and capacitor assembly of claim 1, further comprising a second chip capacitor located within said cavity which is connected to another one of said leads.

3. The Hall element and capacitor assembly of claim 1, further comprising at least one Hall element support extending from said carrier housing adjacent to a body of the Hall element.

4. The Hall element and capacitor assembly of claim 1, further comprising an insulative material in said cavity adjacent to the chip capacitor.

5. The Hall element and capacitor assembly of claim 4, wherein the insulative material is epoxy.

6. The Hall element and capacitor assembly of claim 1, further comprising at least two Hall element supports extending from said carrier housing adjacent to a body of the Hall element.

7. A hall element and capacitor assembly comprising:

a hall element having a plurality of leads extending from a body of the hall element;

a leadless chip capacitor having a defined height electrically connected to at least one lead of the hall element; and

a body of insulative material surrounding said leadless chip capacitor, having a greater height then the leadless chip capacitor and at least one lead of the hall element and separating the body of the hall element from said chip capacitor.

8. The Hall element and capacitor assembly of claim 7, wherein the insulative material is comprised of epoxy.

9. The Hall element and capacitor assembly of claim 7 comprising at least two chip capacitors connected between the leads of the Hall element.

10. A method of manufacturing a hall element and capacitor assembly comprising:

providing a carrier housing having at least one cavity having a fixed height;

installing a hall element having a hall cell and electrical leads, wherein the hall cell is separated from the at least one cavity;

inserting one or more leads of the hall element into the cavity; and

inserting a leadless chip capacitor having a shorter height than the cavity into said cavity and connecting the capacitor to one of said leads of the hall element.

11. The method of manufacturing a Hall element and capacitor assembly of claim 10, further comprising a step of inserting a second chip capacitor into said cavity and connecting said second chip capacitor to said leads.

12. The method of manufacturing a Hall element and capacitor assembly of claim 10, wherein said step of providing a carrier housing comprises a step of providing a carrier housing having at least one Hall element support extending from said carrier housing adjacent to a body of the Hall element.

13. The method of manufacturing a Hall element and capacitor assembly of claim 10, further comprising a step of inserting an insulative material in said cavity adjacent to the chip capacitor.

14. The method of manufacturing a Hall element and capacitor assembly of claim 13, wherein the insulative material is epoxy.

15. The method of manufacturing a Hall element and capacitor assembly of claim 10, wherein the carrier comprises at least two Hall element supports extending from said carrier housing adjacent to a body of the Hall element.

16. A method of manufacturing a Hall element and capacitor assembly comprising:

providing a Hall element having a plurality of leads extending from a body of the Hall element;

connecting a leadless chip capacitor having a defined height to at least of the hall element; and

surrounding said leadless chip capacitor and at least one lead of the Hall element with a body of insulative material, the material having a height greater than the height of the capacitor and separating the body of the hall element by the body of the insulative material.

17. The method of manufacturing a Hall element and capacitor assembly of claim 16, wherein the insulative material is comprised of epoxy.

18. The method of manufacturing a Hall element and capacitor assembly of claim 16, comprising a step of connecting at least two chip capacitors between the leads of the Hall element.