Arrangement of a multiphase converter

• US 6,501,653 B1
• Filed: 07/03/2001
• Issued: 12/31/2002
• Est. Priority Date: 10/07/1998
• Status: Expired due to Fees

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Landsgestell, Juergen, Eisenhardt, Martin
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/807,157
• Time in Patent Office: 546 Days
• Field of Search: 361/688-690, 361/698, 361/699, 361/702-704, 361/707, 361/719, 361/720, 174/15.1, 174/16.1, 174/16.3, 165/80.2, 165/80.3, 165/80.4, 165/80.5, 165/104.33, 165/185
• US Class Current: 361/699
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

The components of a multiphase converter, which contains semiconductor power components and a capacitor on a support containing cooling devices, are arranged in an optimally compact configuration, in which the support containing the cooling device is configured as a hollow body, the capacitor is or the capacitors are insertable in its interior in as tightly and precisely fitted fashion as possible, and the semiconductor power components are arranged on its outer side, where the height of the hollow body corresponds substantially to the height of the necessary capacitor. For a three-phase converter, the hollow body may be in the shape of a hexagon on the outer side, so that an overall shape approximating a cylinder is created, and a cylindrical cover protects everything and makes a compact component available, and for a two-phase converter, a parallelepipedal volume is optimally utilized.

Claims

1. An arrangement of a multiphase converter, comprising:

at least one semiconductor power component;

at least one capacitor arrangement, the at least one capacitor arrangement including a capacitor; and

a support for mounting at least the at least one semiconductor power component, the support including at least one cooling device;

wherein;

the support is configured as a hollow body defining an interior of the support;

the at least one capacitor arrangement is insertable in a tight and precise fitted fashion in the interior of the support;

the at least one semiconductor power component is arranged on an outer side of the support; and

the hollow body includes at least one of a parallelepipedal cover and a cylindrical cover, each cover occludingly surrounding the hollow body serving as the support, the at least one semiconductor component, the at least one capacitor arrangement and at least one electrical board being mounted in and on the support, except for at least one connecting contact.

2. The arrangement of claim 1, wherein the hollow body is configured so that it includes, on the outer side of the support, at least one of a substantially cylindrical and a parallelepipedal configuration, and includes, on an inner side of the support, at least one of a cylindrical configuration and an adapted configuration that is adapted to an external shape of the at least one capacitor arrangement.

3. The arrangement of claim 1, wherein the hollow body includes, on the outer side of the support, at least one surface for mounting the at least one semiconductor power component and for providing a thermally conductive contact with the hollow body, the hollow body being coolable.

4. The arrangement of claim 1, wherein the hollow body includes a flat outer surface arrangement.

5. The arrangement of claim 1, wherein the hollow body is substantially of a length in an axial direction corresponding to another length of the at least one capacitor arrangement.

6. The arrangement of claim 1, wherein at least one electrical board is supportable by the hollow body.

7. The arrangement of claim 6, wherein at least one electrical control board is mounted on at least one end face of the hollow body of the support.

8. The arrangement of claim 1, wherein the hollow body includes at least one cooling duct, at least one of a coolant and a liquid coolant being movable through the at least one cooling duct.

9. The arrangement of claim 8, wherein at one end face of the hollow body is included a support part that includes the at least one cooling duct by which at least one cooling duct provided in a wall of the support is connectable to one another for imparting a cup-like shape to the hollow body.

10. The arrangement of claim 1, wherein the arrangement is included in at least one of a motor vehicle, an electric vehicle, a hybrid vehicle and a starter-generator drive system.

11. The arrangement of claim 1 wherein the capacitor is a high-power electrolytic capacitor.

12. The arrangement of claim 4, wherein the flat outer surface arrangement includes six flat outer surfaces for use with a three-phase converter.

13. An arrangement of a multiphase converter, comprising:

at least one semiconductor power component;

at least one capacitor arrangement, the at least one capacitor arrangement including a capacitor; and

a support for mounting at least the at least one semiconductor power component, the support including at least one cooling device;

wherein;

the support is configured as a hollow body defining an interior of the support;

the at least one capacitor arrangement is insertable in a tight and precise fitted fashion in the interior of the support;

the at least one semiconductor power component is arranged on an outer side of the support;

at least one electrical board is supportable by the hollow body; and

at least one electrical activation board for the at least one semiconductor power component is mounted on an outer side of the at least one semiconductor power component and at least one electrical connecting line of the at least one semiconductor component.