Substrate support having bonded sections and method
First Claim
Patent Images
1. A support capable of supporting a substrate in a chamber, the support comprising:
- a plurality of sections that are joined to one another or to the chamber, at least one of the sections comprising a surface adapted to receive a substrate, and first and second bonds between the sections or between a section and the chamber, the first bond comprising a first bonding material and the second bond comprising a second bonding material.
1 Assignment
0 Petitions
Accused Products
Abstract
A substrate support 55 comprises first, second and third sections 88, 90, 92 connected to one another by first and second bonds 106, 108, one of the sections comprises a surface 75 adapted to receive a substrate 25. The first bond 106 comprises a first bonding material and the second bond 108 comprises a second bonding material. In one version, the first bonding material is capable of bonding surfaces when heated to a first temperature and the second bonding material is capable of bonding surfaces when heated to a second temperature.
57 Citations
22 Claims
-
1. A support capable of supporting a substrate in a chamber, the support comprising:
-
a plurality of sections that are joined to one another or to the chamber, at least one of the sections comprising a surface adapted to receive a substrate, and first and second bonds between the sections or between a section and the chamber, the first bond comprising a first bonding material and the second bond comprising a second bonding material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A substrate processing apparatus comprising:
-
is a chamber having a substrate support comprising a plurality of sections, at least one of the sections comprising a surface adapted to receive a substrate, and these sections being joined to one another or to the chamber by first and second bonds, wherein the first bond comprises a first bonding material and the second bond comprises a second bonding material;
a gas distributor;
a gas energizer; and
a gas exhaust, whereby a substrate received on the support may be processed by gas introduced through the gas distributor, energized by the gas energizer, and exhausted by the gas exhaust. - View Dependent Claims (14)
-
-
15. A substrate support comprising:
-
a first, second, and third section, the first section comprising a surface adapted to receive a substrate;
a first bond between the first and second sections and a second bond between the second and third sections, wherein the first bond comprises a first bonding material capable of forming a bond when heated to a first temperature and the second bond comprises a second bonding material capable of forming a bond when heated to a second temperature. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22)
-
Specification