Process for depositing at least one thin layer based on silicon nitride or oxynitride on a transparent substrate
First Claim
1. A process for depositing a layer on a transparent glass substrate, comprising:
- in an essentially inert atmosphere or hydrogen-containing atmosphere that does not contain oxygen and which contains at least one silicon precursor and at least one nitrogen precursor that is an amine at a molar ratio of nitrogen precursor to silicon precursor ranging from 5 to 30, conducting gas-phase pyrolysis at a temperature ranging from 550-760°
C., thereby depositing a silicon/nitrogen containing coating onto a ribbon of float glass.
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Abstract
The invention relates to a coated glass substrate, covered with at least one thin layer based on silicon nitride or silicon oxynitride. The thin layer contains the elements Si, O, N, C in the following atomic percentages:
The invention also relates to the process for obtaining the coated glass substrate using a gas-phase pyrolysis technique, and to its applications.
120 Citations
5 Claims
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1. A process for depositing a layer on a transparent glass substrate, comprising:
in an essentially inert atmosphere or hydrogen-containing atmosphere that does not contain oxygen and which contains at least one silicon precursor and at least one nitrogen precursor that is an amine at a molar ratio of nitrogen precursor to silicon precursor ranging from 5 to 30, conducting gas-phase pyrolysis at a temperature ranging from 550-760°
C., thereby depositing a silicon/nitrogen containing coating onto a ribbon of float glass.- View Dependent Claims (2, 3, 4, 5)
Specification