Wafer scale image sensor package fabrication method
First Claim
1. A method comprising:
- forming a window support layer on a first surface of an image sensor substrate comprising a first image sensor, said window support layer covering an active area of said first image sensor; and
pressing a first surface of a window sheet into said window support layer such that a first window of said window sheet is above said active area.
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Accused Products
Abstract
To form an image sensor package, a series of shallow cuts are made in an interior surface of a window sheet having a plurality of windows. A window support layer is formed on an upper surface of a wafer having a plurality of image sensors. The interior surface of the window sheet is pressed into the window support layer such that the windows are above active areas of the image sensors. The shallow cuts in combination with the window support layer define cavities above bond pads of the image sensors. The window sheet is cut from an exterior surface directly opposite of the cavities above the bond pads to singulating the windows from one another. The wafer is then singulated to form a plurality of image sensor packages.
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Citations
32 Claims
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1. A method comprising:
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forming a window support layer on a first surface of an image sensor substrate comprising a first image sensor, said window support layer covering an active area of said first image sensor; and
pressing a first surface of a window sheet into said window support layer such that a first window of said window sheet is above said active area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method comprising:
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entirely coating a first surface comprising an active area and a bond pad of an image sensor with a bonding material to form a window support layer;
supporting a window above said active area with said window support layer; and
setting up said window support layer. - View Dependent Claims (20, 21, 22, 23, 24, 25)
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26. A method comprising:
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forming a window support layer on a first surface of an image sensor substrate comprising a first image sensor and a second image sensor, said window support layer covering an active area of said first image sensor and an active area of said second image sensor;
defining a first window and a second window of a window sheet by a first cut in a first surface of said window sheet;
pressing said first surface of said window sheet into said window support layer such that said first window is above said active area of said first image sensor and said second window is above said active area of said second image sensor, wherein said window support layer and said first cut define a cavity above a bond pad of said first image sensor and above a bond pad of said second image sensor;
setting up said window support layer; and
cutting from a second surface of said window sheet to said cavity to singulate said first window from said second window. - View Dependent Claims (27, 28, 29, 30, 31, 32)
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Specification