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Passive semiconductor device mounted as daughter chip on active semiconductor device

  • US 6,504,227 B1
  • Filed: 06/29/2000
  • Issued: 01/07/2003
  • Est. Priority Date: 06/30/1999
  • Status: Expired due to Fees
First Claim
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1. An integrated circuit device, comprising:

  • a first substrate formed of a semiconductor substrate and having an active element formed on the side of one main surface;

    a second substrate having a passive element formed on the side of a first main surface and arranged such that a second main surface opposite to the first main surface faces the main surface of the first substrate; and

    an electrode extending through the second substrate from the first main surface to the second main surface so as to electrically connect the passive element to the active element.

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