Passive semiconductor device mounted as daughter chip on active semiconductor device
First Claim
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1. An integrated circuit device, comprising:
- a first substrate formed of a semiconductor substrate and having an active element formed on the side of one main surface;
a second substrate having a passive element formed on the side of a first main surface and arranged such that a second main surface opposite to the first main surface faces the main surface of the first substrate; and
an electrode extending through the second substrate from the first main surface to the second main surface so as to electrically connect the passive element to the active element.
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Abstract
The present invention provides an integrated circuit, comprising a semiconductor substrate, an active element formed on the side of one main surface of the semiconductor substrate, an insulating region formed on the side of the main surface of the semiconductor substrate by burying an insulating material in a groove having a depth of at least 20 μm, and a passive element formed directly or indirectly on the insulating region. It is desirable for the passive element to be an inductor.
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Citations
12 Claims
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1. An integrated circuit device, comprising:
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a first substrate formed of a semiconductor substrate and having an active element formed on the side of one main surface;
a second substrate having a passive element formed on the side of a first main surface and arranged such that a second main surface opposite to the first main surface faces the main surface of the first substrate; and
an electrode extending through the second substrate from the first main surface to the second main surface so as to electrically connect the passive element to the active element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A circuit board, comprising:
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an insulating layer;
a conductive connecting portion comprising a conductive material prepared by solidifying a conductive past having magnetic properties and extending through the insulating layer; and
a conductive pattern formed on at least one main surface of the insulating layer and connected to the conductive connecting portion. - View Dependent Claims (12)
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Specification