Switch integral in a semiconductor element

• US 6,504,467 B1
• Filed: 07/27/2000
• Issued: 01/07/2003
• Est. Priority Date: 07/31/1999
• Status: Expired due to Fees

• Current Assignee: Mannesmann VDO AG (Continental AG)
• Original Assignee: Mannesmann VDO AG (Continental AG)
• Inventors: Berberich, Reinhold, Bay, Wolfgang
• Primary Examiner(s): Vortman, Anatoly
• Application Number:
  US09/626,903
• Time in Patent Office: 894 Days
• Field of Search: 337/297, 337/382, 337/393, 337/401, 337/414, 337/416, 337/158, 337/159, 337/123, 337/139, 337/140, 337/157
• US Class Current: 337/139
• CPC Class Codes: H01H 2085/0283 Structural association with a semiconductor device
• CPC Class Codes: H01H 37/761 with a fusible element forming part of the switched circuit H01H37/767 takes precedence
• CPC Class Codes: H01H 85/0039 Means for influencing the rupture process of the fusible element
• CPC Class Codes: H01H 85/0043 Boiling of a material associated with the fusible element, e.g. surrounding fluid
• CPC Class Codes: H01H 85/0073 Expansion or rupture of the insulating support for the fusible element
• CPC Class Codes: H01H 85/041 characterised by the type
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

In a semiconductor element, in particular for switching an electrical connection, a substance which expands to a great extent when heated is arranged on the element in such a way that if the element is overheated, the electrical leads of the element are disconnected by the expanding substance or are interrupted by the melting of a conductive material with a low melting point which forms the leads.

Claims

1. A semiconductor element, in particular for switching an electrical connection, wherein a substance (5, 32) which swells-up when heated is arranged on the element (1, 20, 30) such that if the element (1, 20, 30) is overheated, electrical leads (3, 34) of the element are disconnected by the expanding substance (5, 32), wherein said substance expands explosively (5) when a predetermined limit temperature is exceeded, and wherein the substance is arranged such that the leads (3) are disconnected due to the explosion.

2. A semiconductor element, in particular for switching an electrical connection, wherein a substance (5, 32) which swells-up when heated is arranged on the element (1, 20, 30) such that if the element (1, 20, 30) is overheated, electrical leads (3, 34) of the element are disconnected by the expanding substance (5, 32), wherein the substance is arranged between the semiconductor element (30) and a further part (33) such that the further part (33) and the semiconductor element (30) are driven apart by the expanding substance (32), and wherein the leads (34) provided on the semiconductor element (30) are routed such that they are torn off by the further part (33) that moves away.

3. The semiconductor element as claimed in claim 2, wherein the semiconductor element is coated with a layer (32) of the substance, wherein said layer is covered by the further part (33), and wherein the leads (34) provided on the element run through the layer (32) and are fixedly connected to the further part (33).