Method and apparatus for use in assembling electronic devices

• US 6,505,665 B1
• Filed: 09/17/1998
• Issued: 01/14/2003
• Est. Priority Date: 09/17/1998
• Status: Expired due to Fees

• Current Assignee: Intermedics Incorporated (Boston Scientific Corporation)
• Original Assignee: Intermedics Incorporated (Boston Scientific Corporation)
• Inventors: Pham, Cuong Van, Ulmer, Kenneth R.
• Primary Examiner(s): TURNER, ARCHENE A
• Application Number:
  US09/154,810
• Time in Patent Office: 1,580 Days
• Field of Search: 156/382, 156/538, 156/539, 156/556, 156/559, 156/560, 156/578
• US Class Current: 156/556
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/83191 wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 24/27 Manufacturing methods
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: Y10T 156/1744 Means bringing discrete articles into assembled relationship

Abstract

A first fixture holds a plurality of circuit components backside up in a substantially coplanar relationship. An adhesive applying device, such as screen printer, applies adhesive to the backside of each circuit component. A second fixture is aligned with and placed on the first fixture. The fixtures are then flipped so that the circuit components are supported in a right side up position by the second fixture. A device such as a pick and place machine, may then be used to transfer the circuit components from the second fixture to a substrate.

Claims

1. An apparatus for use in assembling an electronic device comprising:

a fixture having a substantially regular surface, the substantially regular surface having a plurality of recesses therein, each of the plurality of recesses adapted to accept a circuit component backside up therein such that the backside of the circuit component forms a portion of the substantially regular surface; and

a device adapted to apply adhesive comprising a screen printer having a screen located over the fixture, the screen carrying a template having a plurality of holes therein, each hole located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole.

2. The apparatus as set forth in claim 1, wherein the backside of each circuit component is offset by no more than approximately 0.127 mm (0.005 inches) from the substantially regular surface of the fixture.

3. The apparatus, as set forth in claim 1, wherein the recesses are no more than 0.0127 mm (0.0005 inches) larger than the component to be received therein any linear direction in the plane of the regular surface.

5. The apparatus, as set forth in claim 1, wherein the fixture is anodized aluminum.

6. The apparatus, as set forth in claim 1, wherein the fixture is conductive plastic.

4. An apparatus for use in assembling an electronic device comprising:

a fixture having a substantially regular first surface and a second surface, the first surface comprising a plurality of holders, each of the plurality of holders adapted to accept a circuit component backside up therein such that the backside of the circuit components are in a substantially coplanar relationship with the first surface; and

a device adapted to apply adhesive comprising a screen printer having a screen located over the fixture, the screen carrying a template having a plurality of holes therein, each hole located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole.

7. The apparatus, as set forth in claim 4, wherein each of the plurality of holders has a respective hole which extends through the second surface, each hole supplying a vacuum to the respective holder for holding the respective circuit component in the holder.

8. An apparatus for use in assembling an electronic device comprising:

a first fixture having a substantially regular first surface, the first surface comprising a plurality of first recesses therein arranged in a given pattern, each of the plurality of recesses adapted to accept a circuit component backside up therein such that the backside of the circuit components are in a substantially coplanar relationship;

a second fixture having a second surface, the second surface comprising a plurality of second recesses therein arranged in a mirror image of the given pattern, the second surface of the second fixture adapted to mate with the first surface, wherein each of the plurality of second recesses is adapted to accept one of the respective circuit components right side up therein; and

a device adapted to apply adhesive comprising a screen printer having a screen located over the first fixture, the screen carrying a template having a plurality of holes therein, each hole located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole.

9. The apparatus, as set forth in claim 8, wherein each of the plurality of first recesses has a respective hole which extends through the first fixture, each hole supplying a vacuum to the respective first recess for holding the respective circuit component within the first recess.

10. The apparatus, as set forth in claim 8, wherein each of the second recesses comprises a shoulder to support the respective circuit component.

11. The apparatus, as set forth in claim 10, wherein each respective shoulder extends completely about a periphery of the respective second recess.

12. The apparatus, as set forth in claim 10, wherein each respective shoulder extends partially about a periphery of the respective second recess.

13. The apparatus, as set forth in claim 8, wherein each of the second recesses comprises a plurality of pins disposed within the respective recess to support the respective circuit component.

14. The apparatus, as set forth in claim 13, wherein the plurality of pins in each respective second recess extend upwardly from a bottom of the respective second recess and terminate adjacent a top of the respective second recess.

28. The apparatus of claim 8, wherein the backside of each circuit component is offset by no more than approximately 0.127 mm (0.005 inches) from the first surface.

29. The apparatus of claim 8, wherein the recesses are no more than approximately 0.0127 mm (0.005 inches) larger than the component to be received therein in any linear direction in the plane of the regular surface.

30. The apparatus of claim 8, further comprising:

the plurality of first recesses adapted to accept a circuit component backside up therein such that the backside of each circuit component is in a substantially coplanar relationship with the first surface.

31. The apparatus of claim 8, wherein one or both of the first and second fixtures are anodized aluminum.

32. The apparatus of claim 8, wherein one or both of the first and second fixtures are conductive plastic.

15. An apparatus for use in assembling an electronic device comprising:

a fixture having a substantially regular first surface and a second surface;

a plurality of recesses extending from the first surface, each of the plurality of recesses adapted to accept a circuit component backside up therein such that the backside of each circuit component is in a substantially coplanar relationship with the first surface; and

a device adapted to apply adhesive to the backside of each of the circuit components in the fixture, the device comprising a screen printer having a screen located over the fixture, the screen carrying a template having a plurality of holes therein, each hole located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole.

16. The apparatus of claim 15, wherein each of the plurality of recesses has a respective hole which extends through the second surface, each hole adapted to supply a vacuum to the respective recess for holding the respective circuit component within the recess.

17. An apparatus for use in assembling an electronic device comprising:

means for holding a plurality of circuit components backside up such that the backside of the circuit components are in a substantially coplanar relationship;

means for applying adhesive to the backside of each of the circuit components while in the holding means wherein the adhesive is applied using a device comprising a screen printer having a screen located over the means for holding, the screen carrying a template having a plurality of holes therein, each hole located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole; and

means for receiving each of the circuit components from the holding means and supporting the circuit components in a right side up position.

18. A method of assembling an electronic device, the method comprising:

holding a plurality of circuit components backside up in a first fixture having a substantially regular surface such that the backside of the circuit components are in a substantially coplanar relationship;

applying adhesive to the backside of each circuit component;

supporting the circuit components in a right side up position after the adhesive has been applied;

moving the circuit components to a circuit board; and

securing the circuit components to the circuit board with the adhesive, wherein the adhesive is applied using a device, the device comprising a screen printer having a screen located over the fixture, the screen carrying a template having a plurality of holes therein, each hole located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole.

19. The method of claim 18, wherein holding a plurality of circuit components backside up comprises offsetting the backside of each circuit component by no more than approximately 0.127 mm (0.005 inches) from the substantially regular surface.

20. The method of claim 18, wherein holding a plurality of circuit components backside up comprises placing each of the plurality of circuit components in a respective first recess of a plurality of first recesses which extend from the substantially regular surface of the first fixture.

21. The method of claim 20, wherein holding a plurality of circuit components backside up further comprises holding the circuit components in the respective first recess using a vacuum.

22. The method of claim 19, wherein applying adhesive to the backside of each circuit component comprises:

positioning a screen of a screen printer over the backsides of the circuit components, the screen carrying a template having a plurality of holes therein, each hole located over a respective one of the circuit components; and

applying adhesive onto the backside of each circuit component through each respective hole.

23. An apparatus for use in assembling an electronic device comprising:

a first fixture having a substantially regular first surface, the first fixture comprising a plurality of first holders depending from the first surface, the first holders arranged in a given pattern, each of the plurality of first holders adapted to hold a circuit component backside up therein such that the backside of the circuit components are in a substantially coplanar relationship;

a second fixture having a second surface, the second surface comprising a plurality of second holders arranged in a mirror image of the given pattern, the second surface adapted to mate with the first surface, wherein each of the plurality of second holders is adapted to accept one of the respective circuit components right side up therein; and

a device adapted to apply adhesive comprising a screen printer having a screen located over the first fixture, the screen carrying a template having a plurality of holes therein, each hole located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole.

24. The apparatus, as set forth in claim 23, wherein each of the plurality of first holders comprises means for holding the respective circuit component within the first holder.

25. The apparatus, as set forth in claim 23, wherein each of the first holders comprises a first recess depending from the first surface of the first fixture, and wherein each of the second holders comprises a second recess depending from the second surface of the second fixture.

26. The apparatus, as set forth in claim 25, wherein the first recesses are no more than approximately 0.0127 mm (0.0005) larger than the component to be received therein in any linear direction in the plane of the first surface.

27. The apparatus, as set forth in claim 25, wherein the backside of each circuit component is offset by no more than approximately 0.127 mm (0.005 inches) from the first surface.

33. The apparatus, as set forth in claim 24, wherein means for holding comprises a vacuum, wherein each of the plurality of first holders has a respective hole which extends through the first fixture, each hole supplying a vacuum to the respective first holder for holding the respective circuit component in the first holder.

34. The apparatus, as set forth in claim 23, wherein each of the second holders comprises a shoulder to support the respective circuit component.

35. The apparatus, as set forth in claim 34, wherein each respective shoulder extends completely about a periphery of the respective second holder.

36. The apparatus, as set forth in claim 34, wherein each respective shoulder extends partially about a periphery of the respective second holder.

37. The apparatus, as set forth in claim 23, wherein each of the second holders comprises a plurality of pins depending from a bottom of the respective second holder adapted to support the respective circuit component.

38. A method of assembling an electronic device, the method comprising:

holding a plurality of circuit components backside up in a first fixture, the first fixture comprising a substantially regular first surface having a plurality of first holders therein arranged in a given pattern, each of the plurality of first holders adapted to accept a circuit component backside up therein such that the backsides of the circuit components are substantially coplanar;

applying adhesive to the backside of each circuit component, wherein the adhesive is applied using a device comprising a screen printer having a screen located over the first fixture, the screen carrying a template having a plurality of holes therein, each hole located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole;

mating a second surface of a second fixture with the first surface, the second surface comprising a plurality of complementary second holders therein arranged in a mirror image of the given pattern, the second holders aligned with the complementary first holders, the second holders adapted to receive the respective circuit components right side up therein;

transferring the circuit components from the first fixture to the second fixture by inverting the mated first and second fixtures such that the second fixture is below the first fixture;

supporting the circuit components in a right side up position within the respective second holders;

unmating the first fixture from the second fixture;

moving the circuit components to one or more circuit boards; and

securing the circuit components to the one or more circuit boards with the adhesive.

39. The method according to claim 38, wherein supporting the circuit components in a right side up position within the second holders comprises supporting at least a portion of the periphery of the respective circuit component on a shoulder disposed within the respective second holder.

40. The method according to claim 38, wherein supporting the circuit components in a right side up position within the second holders comprises supporting the backside of the respective circuit component on a plurality of pins depending from a bottom of the respective second holder.

41. The method according to claim 38, wherein each of the plurality of first holders are adapted such that the backsides of the circuit components forms a portion of the first surface.

42. The method according to claim 41, wherein using a silkscreen process to apply adhesive to the backside of each circuit component comprises:

positioning a screen of a screen printer over the fixture, the screen having a plurality of holes therein;

locating each hole over a respective one of the circuit components; and

applying adhesive onto the backside of each circuit component through each respective hole.

45. The method according to claim 42, wherein each of the plurality of recesses adapted to accept a circuit component backside up therein such that the backsides of the circuit components are substantially coplanar with the substantially regular surface.

43. A method of assembling an electronic device, the method comprising:

holding a plurality of circuit components backside up in a first fixture, the first fixture comprising a substantially regular first surface having a plurality of recesses therein arranged in a given pattern, each of the plurality of recesses adapted to accept a circuit component backside up therein such that the backsides of the circuit component are substantially coplanar;

applying adhesive to the backside of each circuit component, wherein the adhesive is applied using a device comprising a screen printer having a screen located over the first fixture, the screen carrying a template having a plurality of holes therein, each hole located over a respective one of the circuit components to facilitate application of adhesive onto the backside of each circuit component through each respective hole;

mating a second surface of a second fixture with the first surface, the second surface comprising a plurality of complementary second recesses therein arranged in a mirror image of the given pattern, the second recesses aligned with the complementary first recesses, the second recesses adapted to receive the respective circuit components right side up therein;

transferring the circuit components from the first fixture to the second fixture by inverting the mated first and second fixtures such that the second fixture is below the first fixture;

supporting the circuit components in a right side up position within the second recesses;

unmating the first fixture from the second fixture;

moving the circuit components to one or more circuit boards; and

securing the circuit components to the one or more circuit boards with the adhesive.

44. The method according to claim 43, wherein supporting the circuit components in a right side up position within the second recesses comprises supporting at least a portion of the periphery of the respective circuit component on a shoulder disposed within the respective second recess.

46. The method according to claim 46, wherein using a silkscreen process to apply adhesive to the backside of each circuit component comprises:

positioning a screen of a screen printer over the fixture, the screen having a plurality of holes therein;

locating each hole over a respective one of the circuit components; and

applying adhesive onto the backside of each circuit component through each respective hole.