Planar optical devices and methods for their manufacture

• US 6,506,289 B2
• Filed: 07/10/2001
• Issued: 01/14/2003
• Est. Priority Date: 08/07/2000
• Status: Expired due to Term

• Current Assignee: Demaray LLC
• Original Assignee: Symmorphix, Inc. (Demaray LLC)
• Inventors: Stadtler, Douglas P., Zhang, Hongmei, Pethe, Rajiv, Demaray, Richard E., Wang, Kai-An, Mullapudi, Ravi B.
• Primary Examiner(s): VERSTEEG, STEVEN H
• Application Number:
  US09/903,050
• Publication Number:
  US 20020033330A1
• Time in Patent Office: 553 Days
• Field of Search: 204/192.12, 204/192.15, 204/192.22, 204/192.23, 204/192.26, 204/192.27, 204/192.28
• US Class Current: 204/192.26
• CPC Class Codes: C23C 14/345 using substrate bias
• CPC Class Codes: C23C 14/35 by application of a magnetic field, e.g. magnetron sputtering C23C14/3457 takes precedence
• CPC Class Codes: G02B 2006/12097 Ridge, rib or the like
• CPC Class Codes: G02B 2006/12147 Coupler
• CPC Class Codes: G02B 2006/1215 Splitter
• CPC Class Codes: G02B 6/132 by deposition of thin films
• CPC Class Codes: G02B 6/136 by etching
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

Physical vapor deposition processes provide optical materials with controlled and uniform refractive index that meet the requirements for active and passive planar optical devices. All processes use radio frequency (RF) sputtering with a wide area target, larger in area than the substrate on which material is deposited, and uniform plasma conditions which provide uniform target erosion. In addition, a second RF frequency can be applied to the sputtering target and RF power can be applied to the substrate producing substrate bias. Multiple approaches for controlling refractive index are provided. The present RF sputtering methods for material deposition and refractive index control are combined with processes commonly used in semiconductor fabrication to produce planar optical devices such surface ridge devices, buried ridge devices and buried trench devices. A method for forming composite wide area targets from multiple tiles is also provided.

Claims

1. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition, whereby a material layer is formed on the substrate,

wherein the uniform plasma condition is created by applying a time-averaged uniform magnetic field,

wherein the uniform magnetic field is applied by moving a magnet positioned proximate to the target across the target in a plane parallel to the plane of the target; and

wherein moving a magnet across the target is moving a magnet in a first direction, the magnet extending beyond the target, in a second direction perpendicular to the first direction.

2. The method of claim 1 wherein the area of the planar target is at least 1.5 times greater than the area of the substrate.

3. The method of claim 1 further comprising applying radio frequency power to the substrate.

4. The method of claim 1 wherein the target comprises refractory oxides.

5. The method of claim 4 wherein the target comprises oxides of silicon.

6. The method of claim 5 wherein the target comprises silicon monoxide.

7. The method of claim 4 wherein the target further comprises compounds of rare earths.

8. The method of claim 1 wherein the gas comprises an inert gas.

9. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition, whereby a material layer is formed on the substrate;

wherein the area of the planar target is at least 1.5 times greater than the area of the substrate; and

wherein the material layer deposited on the substrate has a thickness nonuniformity of less than 5 percent.

10. The method of claim 9 wherein the material layer deposited on the substrate has a nonuniformity in an optical property that is smaller than a nonuniformity in thickness.

11. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition, whereby a material layer is formed on the substrate,

wherein the uniform plasma condition is created without use of a magnet and further comprising applying radio frequency power to the substrate.

12. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition, whereby a material layer is formed on the substrate; and

applying radio frequency power at a second frequency to the target wherein the second frequency is lower than the first frequency.

13. The method of claim 12 further comprising applying radio frequency power to the substrate.

14. The method of claim 12 wherein a sum of a first power level of the first frequency and a second power level of the second frequency is constant during deposition;

and

wherein the refractive index of the material layer is higher as the second power level of the second frequency is increased.

15. A method of making a layered structure used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition;

depositing a first material layer with the substrate held at a first temperature; and

depositing a second material layer with the substrate held at a second temperature,

wherein the refractive index of the first material layer is greater than the refractive index of the second material layer if the first temperature is greater than the second temperature, and

wherein the refractive index of the second material layer is greater than the refractive index of the first material layer if the second temperature is greater than the first temperature.

16. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition;

depositing a first layer with the radio frequency power of the first frequency set at a first power level; and

depositing a second layer with the radio frequency power of the first frequency set at a second power level,

wherein the refractive index of the first layer is greater than the refractive index of the second layer if the first power level is greater than the second power level, and

wherein the refractive index of the second layer is greater than the refractive index of the first layer if the second power level is greater than the first power level.

17. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition, whereby a material layer is formed on the substrate

wherein the material layer is deposited with the substrate controllably held at a temperature and the refractive index of the material layer is increased with increased temperature.

18. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition, whereby a material layer is formed on the substrate,

wherein the refractive index of the material layer is increased when the radio frequency power of the first frequency is increased.

19. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition, whereby a material layer is formed on the substrate,

wherein the target includes silicon monoxide.

20. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition, whereby a material layer is formed on the substrate,

wherein the gas further comprises a reactive gas whereby the refractive index of the material layer is modified compared with the refractive index of a material layer formed in the absence of the reactive gas.

21. The method of claim 20 wherein the reactive gas is a reducing gas and wherein the refractive index of the material layer is greater than the refractive index of a material layer formed in the absence of the reducing gas.

22. The method of claim 20 wherein the reactive gas is an oxidizing gas and wherein the refractive index of the material layer is smaller than the refractive index of a material layer formed in the absence of the oxidizing gas.

23. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition, whereby a material layer is formed on the substrate,

wherein the target comprises a plurality of tiles.

24. The method of claim 23 wherein the tiles comprise an alloy material.

25. A method of making a planar optical device, the method comprising:

depositing a first layer of cladding material having a first refractive index on a substrate by physical vapor deposition to form a first structure, wherein radio frequency power is applied to a planar source of cladding material positioned opposite the substrate, the source having an area greater than the area of the substrate, the power applied in the presence of a gas and under a condition wherein a central portion of the source overlying the substrate is exposed to a uniform plasma condition; and

depositing a layer of core material on the cladding material to form a second structure, the core material having a second refractive index greater than the first refractive index, the core material deposited by physical vapor deposition, wherein radio frequency power is applied to a planar source of core material positioned opposite the first structure, the source of core material having an area greater than the area of the first structure, the power applied in the presence of a gas and under a condition wherein a central portion of the source of core material overlying the first structure is exposed to a uniform plasma condition.

26. The method of claim 25 further comprising:

depositing a second layer of cladding material on the layer of core material by physical vapor deposition wherein radio frequency power is applied to the planar source of cladding material positioned opposite the second structure under a condition wherein a central portion of the source overlying the second structure is exposed to a uniform plasma condition; and

etching regions of the second layer of the cladding material and a portion of the thickness of the layer of core material to produce a ridge structure in the second layer of cladding material and in a portion of the layer of core material.

27. The method of claim 25 further comprising;

etching regions of the layer of core material to produce a ridge structure in the layer of core material, forming a third structure; and

depositing a second layer of cladding material over the ridge structure by physical vapor deposition wherein

radio frequency power is applied to the planar source of cladding material positioned opposite the third structure, under a condition wherein the central portion of the source of cladding material overlying the third structure is exposed to a uniform plasma condition, and

radio frequency power is applied to the third structure.

28. The method of claim 27 wherein depositing the first layer of cladding material further comprises applying radio frequency power to the substrate.

29. The method of claim 28 wherein depositing the layer of core material further comprises applying radio frequency power to the second structure.

30. A method of making a planar optical device, the method comprising:

depositing a first layer of cladding material having a first refractive index on a substrate by physical vapor deposition, wherein radio frequency power is applied to a planar source of cladding material positioned opposite the substrate, the source having an area greater than the area of the substrate, the power applied in the presence of a gas and under a condition wherein a central portion of the source overlying the substrate is exposed to a uniform plasma condition;

forming a trench in the first layer of cladding material to form a first structure;

depositing a layer of core material on the cladding material completely filling the trench, the core material having a second refractive index greater than the first refractive index, the core material deposited by physical vapor deposition, wherein radio frequency power is applied to the first structure and radio frequency power is applied to a planar source of core material positioned opposite the first structure, the source of core material having an area greater than the area of the substrate, the power applied in the presence of a gas and under a condition wherein a central portion of the source of core material overlying the first structure is exposed to a uniform plasma condition;

removing core material overlying the first layer of cladding material exposing the cladding material except in the area of the trench to provide a cladding layer with filled trench; and

depositing a layer of cladding material on the cladding layer with filled trench by physical vapor deposition wherein radio frequency power is applied to the planar source of cladding material positioned opposite the cladding material with filled trench.

31. The method of claim 30 wherein depositing a first layer of cladding material further comprises applying radio frequency power to the substrate, and wherein depositing a layer of cladding material on the cladding layer with filled trench further comprises applying radio frequency power to the cladding layer with filled trench.

32. A method of making a material layer used in forming planar optical devices, the method comprising:

positioning a substrate opposite a planar target, the target having an area larger than the area of the substrate; and

applying radio frequency power at a first frequency to the target in the presence of a gas, under a condition wherein a central portion of the target overlying the substrate is exposed to a uniform plasma condition, whereby a material layer is formed on the substrate,

wherein the uniform plasma condition is created by applying a time-averaged uniform magnetic field,

wherein the uniform magnetic field is applied by moving a magnet positioned proximate to the target across the target in a plane parallel to the plane of the target; and

wherein moving a magnet across the target is moving a magnet in a first direction, the magnet extending in a second direction perpendicular to the first direction.