Method for printing of transistor arrays on plastic substrates

• US 6,506,438 B2
• Filed: 12/14/1999
• Issued: 01/14/2003
• Est. Priority Date: 12/15/1998
• Status: Expired due to Fees

• Current Assignee: E Ink Holdings Incorporated
• Original Assignee: E Ink Holdings Incorporated
• Inventors: Duthaler, Gregg M., Kazlas, Peter T., Drzaic, Paul
• Primary Examiner(s): Talbot, Brian K.
• Application Number:
  US09/460,090
• Publication Number:
  US 20020053320A1
• Time in Patent Office: 1,127 Days
• Field of Search: 118/249, 118/259, 118/261, 118/304, 427/96, 427/58, 427/146, 427/359, 427/365, 427/369
• US Class Current: 427/58
• CPC Class Codes: B41J 3/4076 printing on rewritable, bistable "electronic paper" by a focused electric or magnetic field
• CPC Class Codes: G02F 1/1334 based on polymer dispersed liquid crystals, e.g. microencapsulated liquid crystals
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/1362 Active matrix addressed cells G02F1/134336, G02F1/134363 take precedence

Abstract

Electronic devices such as transistors and diodes are manufactured by ink-jet printing using a transfer member. These electronic devices are used in addressing an electronic display.

Claims

1. A method of manufacturing an electronic device comprising the steps of:

a) providing an ink-jet printing system comprising a print head and a transfer member;

b) providing a substrate having a first side;

c) dispensing a plurality of ink drops from the print head to a surface of the transfer member forming an ink pattern corresponding to at least a first component of the electronic device, the plurality of ink drops comprising at least one of a conductive material, and a semiconductive material; and

d) transferring the ink pattern from the transfer member to the first side of the substrate, thereby forming the first component of the electronic device.

e) dispensing a second plurality of ink drops from the print head to the surface of the transfer member forming a second ink pattern corresponding to at least a second component of the electronic device, the second plurality of ink drops comprising at least one of the conductive material, an insulating material and the semiconductive material; and

f) transferring the second ink pattern from the transfer member to the first side of the substrate, thereby forming the second component of the electronic device in contact with the first component.

2. The method of claim 1 wherein the ink-jet printing system further comprises an applicator for applying a release material to the transfer member.

3. The method of claim 1 wherein step b) comprises providing the substrate on a conveyor belt.

4. The method of claim 1 wherein step b) comprises providing a plurality substrates as a batch.

5. The method of claim 1 wherein the substrate is provided between the transfer member and a pressure applying member.

6. The method of claim 1 wherein the plurality of ink drops further comprises an insulating material.

7. The method of claim 1 wherein the plurality of ink drops form an ink pattern corresponding to at least a component of a transistor.

8. The method of claim 1 further comprising the step of applying a release material to a surface of the transfer member and step c) comprises dispensing the plurality of ink drops adjacent the release material.

9. The method of claim 1 further comprising rotating the transfer member between steps c) and d).

10. The method of claim 1 wherein step c) comprises dispensing a plurality of ink drops by applying a voltage signal to the print head.

11. The method of claim 9 further comprising providing a controller for controlling an application of the voltage signal.

12. The method of claim 1 wherein step b) comprises providing a flexible substrate.

13. The method of claim 1 wherein the plurality of ink drops comprises at least one of an organic conductive material and an organic semiconductive material.

14. The method of claim 1 wherein the plurality of ink drops comprises at least one of a colloidal inorganic conductive material and a colloidal inorganic semiconductive material.

15. The method of claim 1 wherein the plurality of ink drops comprises at least one of a conductive material and a semiconductive material, forming an ink pattern comprising at least one of a source electrode, a drain electrode, a semiconductor layer, and a gate electrode.

16. The method of claim 1 further comprising the step of planarizing the electronic device.

17. The method of claim 1 wherein the plurality of ink drops form an ink pattern corresponding to the electronic device and an electronic display media adjacent the electronic device.

18. The method of claim 1 further comprising providing an electronic display media and assembling the electronic device with the electronic display media.

19. The method of claim 18 wherein the electronic display media comprises a plurality of microcapsules, each capsule including a plurality of particles dispersed in a fluid.

20. The method of claim 18 wherein the electronic display media comprises a plurality of microcapsules, each capsule includes a bichromal sphere dispersed in a fluid.

21. The method of claim 1 wherein step c) comprises dispensing a plurality of ink drops forming the ink pattern having a width of less than about 50 microns.

22. The method of claim 1 wherein step d) comprises transferring the ink pattern to an object provided on the substrate and registering the placement of the ink pattern relative to the object.

23. The method of claim 22 wherein the object comprises one of a registration mark, a conductive pattern, and another electronic device.

24. The method of claim 1 wherein the plurality of ink drops form an ink pattern corresponding to at least a component of a diode.