Method of locating and placing eye point features of a semiconductor die on a substrate

• US 6,506,614 B1
• Filed: 01/29/2002
• Issued: 01/14/2003
• Est. Priority Date: 01/29/2002
• Status: Expired due to Fees

• Current Assignee: TYCO TECHNOLOGY RESOURCES, INC.
• Original Assignee: Tyco Electronics Corporation (TE Connectivity Limited)
• Inventors: Strassmann, Allan Wallace
• Primary Examiner(s): Niebling, John F.
• Assistant Examiner(s): Stevenson, Andre C
• Application Number:
  US10/059,712
• Time in Patent Office: 350 Days
• Field of Search: 438/14, 438/7, 438/10, 356/623, 205/83, 250/201.5
• US Class Current: 438/7
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: H05K 13/046 Surface mounting surface mounted components H05K3/341
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing

Abstract

A pick and place machine having both a pick preview look down vision system and a horizontal vision system is employed to sense the top surface of the component before picking it up with the pick preview vision system. After pick up the horizontal vision system is employed while transporting the component to a placement position on a substrate to determine the centroid and zero rotational axis of the component and an offset correction to a desired active feature on the component. The centroid of the desired active feature on the component may then be placed on an exact predetermined point on the substrate in a minimum of time and error.

Claims

1. A method of placing a component on a substrate so that an eye point feature of the component exactly coincides with a predetermined target or placement feature on a substrate, comprising the steps of:

sensing the component before pick up with a look down vision system,

storing a pixel image of the component in a processing means,

determining the centroid of the outer perimeter of the component to be picked up and the centroid of one or more eye point features to be placed on the substrate,

picking up the component at or near the centroid of the component and transporting it to or near a placement position,

while transporting the component, determining the centroid of the outer perimeter of the component with a horizontal vision system and its orthogonal or zero rotational position,

while transporting the component, determining any offset correction in the X and Y axes to place a predetermined eye point on a predetermined X and Y placement target position on the substrate, and

placing said eye point of the feature of the component on said predetermined location on said substrate.

2. The method as set forth in claim 1 wherein said component is placed on said substrate at zero degrees of rotation as seen by the horizontal vision system.

3. The method as set forth in claim 1 wherein determining any offset comprises determining the centroid of more than one eye point,

determining the rotational position of the features of the component, and

the step of transporting further includes correcting the rotational position of the component so that all eye points coincide with predetermined placement positions on said substrate.

4. A method for placing a component at a predetermined placement position on a substrate or carrier, comprising the steps of:

sensing the position of the outer perimeter edges of an active feature of the component before picking up the component with a look down vision system,

picking up the component from a supply source with a pick and place pick up tool and a pick up head of a pick and place machine,

raising the component into a horizontal vision system and transporting the component to an approximate place position over a substrate or carrier,

calculating the offset distance of the delta X and delta Y position of the active feature of the component from its perimeter edges,

determining the position of the perimeter edges of the component relative to the placement system, and

placing the axis of the active feature of the component on a predetermined X and Y position of the substrate or carrier.

5. A method of placing a desired feature of a component at an exact predetermined placement location on a substrate or carrier, comprising the steps of:

sensing both the outer perimeter edges and the desired feature of the component prior to pick up with a look down vision system,

picking up the component by engaging the top of the component with a vacuum pick up tool,

raising the component into a horizontal vision system,

moving the component to an approximate placement position over said substrate while determining the centroid of the component to be placed and determining an X and Y correction position for the centroid of the component and then placing the eye point of the feature on the component on a predetermined location of said substrate.