Photocoupler device, method for fabricating the same, and lead frame for photocoupler device

• US 6,507,035 B1
• Filed: 01/13/2000
• Issued: 01/14/2003
• Est. Priority Date: 01/13/1999
• Status: Expired due to Fees

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Hasegawa, Yasushi, Takakura, Hideya, Kusuda, Kazuo
• Primary Examiner(s): Le, Que T.
• Assistant Examiner(s): Luu, Thanh X.
• Application Number:
  US09/482,278
• Time in Patent Office: 1,097 Days
• Field of Search: 250/551, 250/239, 257/80-84, 257/434, 257/666-677, 257/692-697, 438/111, 438/112, 438/24-26
• US Class Current: 250/551
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/167 the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers

Abstract

A photocoupler device includes a light emitting element; a monitor photodetector and an output photodetector for receiving light from the light emitting element; a primary side lead frame for mounting the light emitting element and the monitor photodetector; and a secondary side lead frame for mounting the output photodetector, wherein the light emitting element and the output photodetector are placed so as to face each other.

Claims

1. A photocoupler device, comprising:

a light emitting element;

a monitor photodetector and an output photodetector for receiving light from the light emitting element;

a primary side lead frame for mounting at least the light emitting element and the monitor photodetector; and

a secondary side lead frame for mounting at least the output photodetector,

wherein the light emitting element and the output photodetector are placed so as to face each other,

the primary side lead frame includes a plurality of mounting portions provided in planes above and below the plane of the primary side lead frame, and

the secondary side lead frame includes a plurality of mounting portions provided in planes above and below the plane of the secondary side lead frame.

2. A photocoupler device according to claim 1, wherein the monitor photodetector on the primary side lead frame and the output photodetector on the secondary side lead frame are provided on a same plane, and are positioned so as to face the light emitting element on the primary side lead frame.

3. A photocoupler device according to claim 1, wherein the monitor photodetector and the light emitting element on the primary side lead frame are provided on a same plane, and are positioned so as to face the output photodetector on the secondary side lead frame.

4. A photocoupler device according to claim 1, wherein the monitor photodetector and the light emitting element of the primary side lead frame are positioned at different levels, and face the output photodetector on the secondary side lead frame.

5. A photocoupler device according to claim 1, wherein the light emitting element, the monitor photodetector, and the output photodetector are covered with a light-transmissive resin through a first transfer molding process, and then, are further covered with a light-shielding resin through a second transfer molding process.

6. A photocoupler device according to claim 1, wherein the light emitting element and the monitor photodetector, or the light emitting element and the output photodetector are covered with a single transparent resin layer.

7. A photocoupler device according to claim 1, wherein at least one of the light emitting element, the monitor photodetector, and the output photodetector is precoated with a transparent resin layer.

8. A method for fabricating a photocoupler device including a light emitting element, and a monitor photodetector and an output photodetector for receiving light from the light emitting element, comprising steps of:

providing a plurality of mounting portions on a first lead frame, said mounting portions being on planes above and below the plane of the first lead frame;

providing a plurality of mounting portions on a second lead frame, said mounting portions being on planes above and below the plane of the second lead frame;

mounting the light emitting element on the first lead frame;

mounting the output photodetector and the monitor photodetector on the second lead frame; and

combining the first lead frame and the second lead frame so that the light emitting element and the monitor photodetector are provided on a primary side, and the output photodetector is provided on a secondary side,

wherein none of the mounting portions of the first and second lead frames, provided on the plane above the planes of their respective lead frames, overlap each other, and

none of the mounting portions of the first and second lead frames, provided on the plane below the planes of their respective lead frames, overlap each other.

9. A lead frame for a photocoupler device, comprising:

a primary side lead frame and a secondary side lead frame, wherein the primary side lead frame and the secondary side lead frame are combined together, and have a common reference plane,

wherein the primary and secondary side lead frames each have a plurality of turned-up mounting portions extending upward with respect to the reference plane; and

a plurality of turned-down mounting portions extending downward with respect to the reference plane; and

wherein said mounting portions of said primary side lead frame are provided in planes above and below the common reference plane of the primary side lead frame; and

wherein said mounting portions of said secondary side lead frame are provided in planes above and below the common reference plane of the secondary side lead frame; and

one of the turned-up mounting portions does not extend over any other turned-up mounting portion, and one of the turned-down mounting portions does not extend below any other turned-down mounting portion.

10. A lead frame for a photocoupler device according to claim 9, wherein

element-pairs of a light emitting element and a monitor output element, and output elements are provided one after another on each of the primary and secondary side lead frames; and

the primary and secondary side lead frames are assembled so that one of the element-pairs provided on the primary side lead frame faces corresponding one of the output elements provided on the secondary side lead frame, and one of the element-pairs provided on the secondary side lead frame faces corresponding one of the output elements provided on the primary side lead frame.

11. A photocoupler device, comprising:

a light emitting element;

a monitor output element;

an output element; and

a primary side lead frame and a secondary side lead frame having a common reference plane,

wherein the primary and secondary side lead frames each have a plurality of element mounting portions for alternately mounting the light emitting element, the monitor output element, and the output element, wherein some of the plurality of element mounting portions extend upward and others extend downward with respect to the reference plane, and wherein one of the element mounting portions extending upward does not extend over any other element mounting portion extending upward, and one of the element mounting portions extending downward does not extend below any other element mounting portion extending downward, and

the primary and secondary side lead frames are assembled so that one of pairs of the light emitting element and the monitor output element provided on the primary side lead frame faces corresponding one of the output elements provided on the secondary side lead frame, and one of pairs of the light emitting element and the monitor output element provided on the secondary side lead frame faces corresponding one of the output elements provided on the primary side lead frame.