Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the same

• US 6,507,097 B1
• Filed: 11/29/2001
• Issued: 01/14/2003
• Est. Priority Date: 11/29/2001
• Status: Expired due to Term

• Current Assignee: Clarisay, Inc., Callahan Cellular LLC (Intellectual Ventures LLC)
• Original Assignee: Clarisay, Inc.
• Inventors: Goetz, Martin P., Jones, Christopher E., Hatcher, Merrill A.
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): NGUYEN, THINH T
• Application Number:
  US09/997,860
• Time in Patent Office: 411 Days
• Field of Search: 257/415, 257/678, 438/110, 438/51, 357/72, 310/313.R, 29/253.5
• US Class Current: 257/678
• CPC Class Codes: H03H 9/1092 the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

Abstract

A hermetic package for a pyroelectric-sensitive electronic device and methods of manufacturing one or more of such packages. In one embodiment, the package includes: (1) a device substrate having: (1a) an active region containing an electrically conductive pattern that constitutes at least a portion of the device and (1b) a bonding region surrounding the active region, (2) a non-porous mounting substrate having a bonding region thereon and (3) a nonmetallic hermetic sealing adhesive, located between the bonding region of the device substrate and the bonding region of the mounting substrate, that cures at a temperature substantially below a pyroelectric sensitive temperature of the device, the active region proximate a void between the device substrate and the mounting substrate.

Claims

1. A hermetic package for a pyroelectric-sensitive electronic device, comprising:

a device substrate having;

an active region containing an electrically conductive pattern that constitutes at least a portion of said device, and

a bonding region surrounding said active region;

a non-porous mounting substrate having a bonding region thereon; and

a nonmetallic hermetic sealing adhesive, located between said bonding region of said device substrate and said bonding region of said mounting substrate, that cures at a temperature substantially below a pyroelectric sensitive temperature of said device, said active region proximate a void between said device substrate and said mounting substrate.

2. The package as recited in claim 1 wherein said active region is sunken into said device substrate relative to said bonding region thereof to accommodate at least a portion of said void.

3. The package as recited in claim 1 wherein a central region of said mounting substrate is sunken into said mounting substrate relative to said bonding region thereof to accommodate at least a portion of said void.

4. The package as recited in claim 1 wherein said adhesive has a cure temperature of at most 150°

Fahrenheit.

5. The package as recited in claim 1 wherein said device substrate comprises at least one selected from the group consisting of:

bismuth germanium oxide,

gallium arsenide,

lithium borate,

lithium niobate,

lithium tantalate,

langasite,

lead zirconium tantalate, and

quartz.

6. The package as recited in claim 1 wherein said mounting substrate comprises at least one selected from the group consisting of:

ceramic,

glass, and

silicon.

7. The package as recited in claim 1 wherein said adhesive comprises one selected from the group consisting of:

acrylate,

epoxy, and

benzocyclobutene.

8. The package as recited in claim 7 wherein said one is coated with a coating selected from the group consisting of:

silicon nitride,

silicon carbide,

silicon oxide,

aluminum nitride, and

aluminum oxide.

9. The package as recited in claim 1 wherein said device is selected from the group consisting of:

a surface acoustic wave device,

a micro-electromechanical system device,

a mirror device, and

a piezoelectric device.

10. The package as recited in claim 1 wherein said device substrate and said mounting substrate have coextensive footprints.

11. A method of manufacturing a hermetic package for a pyroelectric-sensitive electronic device, comprising:

forming a device substrate having;

an active region containing an electrically conductive pattern that constitutes at least a portion of said device, and

a bonding region surrounding said active region;

forming a non-porous mounting substrate having a bonding region thereon;

introducing a nonmetallic hermetic sealing adhesive between said bonding region of said device substrate and said bonding region of said mounting substrate; and

curing said sealing adhesive at a temperature substantially below a pyroelectric sensitive temperature of said device, said active region proximate a void between said device substrate and said mounting substrate.

12. The method as recited in claim 11 wherein said forming said device substrate comprises sinking said active region into said device substrate relative to said bonding region thereof to accommodate at least a portion of said void.

13. The method as recited in claim 11 wherein said forming said mounting substrate comprises sinking a central region of said mounting substrate into said mounting substrate relative to said bonding region thereof to accommodate at least a portion of said void.

14. The method as recited in claim 11 wherein said introducing further comprises introducing an adhesive having a cure temperature of at most 150°

Fahrenheit.

15. The method as recited in claim 11 wherein said forming said device substrate comprises forming a device substrate comprising at least one selected from the group consisting of:

bismuth germanium oxide,

gallium arsenide,

lithium borate,

lithium niobate,

lithium tantalate,

langasite,

lead zirconium tantalate, and

quartz.

16. The method as recited in claim 11 wherein said forming said non-porous mounting substrate comprises forming a mounting substrate comprising at least one selected from the group consisting of:

ceramic,

glass, and

silicon.

17. The method as recited in claim 11 wherein said introducing said adhesive comprises introducing an adhesive comprising one selected from the group consisting of:

acrylate,

epoxy, and

benzocyclobutene.

18. The method as recited in claim 17 wherein said one is coated with a coating selected from the group consisting of:

silicon nitride,

silicon carbide,

silicon oxide,

aluminum nitride, and

aluminum oxide.

19. The method as recited in claim 11 wherein said device is selected from the group consisting of:

a surface acoustic wave device,

a micro-electromechanical system device,

a mirror device, and

a piezoelectric device.

20. The method as recited in claim 11 wherein said device substrate and said mounting substrate have coextensive footprints.

21. A method of manufacturing a hermetic package for a plurality of surface acoustic wave (SAW) devices, comprising:

arranging said plurality of SAW devices on a device substrate wafer such that active regions thereof are surrounded by bonding regions;

forming a non-porous mounting substrate having bonding regions thereon that correspond to said bonding regions of said device substrate wafer;

introducing a nonmetallic hermetic sealing adhesive between said bonding regions of said device substrate wafer and said bonding regions of said mounting substrate; and

curing said sealing adhesive at a temperature substantially below a pyroelectric sensitive temperature of said SAW devices, said active regions thereof proximate voids between said device substrate wafer and said mounting substrate.