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Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the same

  • US 6,507,097 B1
  • Filed: 11/29/2001
  • Issued: 01/14/2003
  • Est. Priority Date: 11/29/2001
  • Status: Expired due to Term
First Claim
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1. A hermetic package for a pyroelectric-sensitive electronic device, comprising:

  • a device substrate having;

    an active region containing an electrically conductive pattern that constitutes at least a portion of said device, and a bonding region surrounding said active region;

    a non-porous mounting substrate having a bonding region thereon; and

    a nonmetallic hermetic sealing adhesive, located between said bonding region of said device substrate and said bonding region of said mounting substrate, that cures at a temperature substantially below a pyroelectric sensitive temperature of said device, said active region proximate a void between said device substrate and said mounting substrate.

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