Hermetic package for pyroelectric-sensitive electronic device and method of manufacturing the same
First Claim
1. A hermetic package for a pyroelectric-sensitive electronic device, comprising:
- a device substrate having;
an active region containing an electrically conductive pattern that constitutes at least a portion of said device, and a bonding region surrounding said active region;
a non-porous mounting substrate having a bonding region thereon; and
a nonmetallic hermetic sealing adhesive, located between said bonding region of said device substrate and said bonding region of said mounting substrate, that cures at a temperature substantially below a pyroelectric sensitive temperature of said device, said active region proximate a void between said device substrate and said mounting substrate.
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Abstract
A hermetic package for a pyroelectric-sensitive electronic device and methods of manufacturing one or more of such packages. In one embodiment, the package includes: (1) a device substrate having: (1a) an active region containing an electrically conductive pattern that constitutes at least a portion of the device and (1b) a bonding region surrounding the active region, (2) a non-porous mounting substrate having a bonding region thereon and (3) a nonmetallic hermetic sealing adhesive, located between the bonding region of the device substrate and the bonding region of the mounting substrate, that cures at a temperature substantially below a pyroelectric sensitive temperature of the device, the active region proximate a void between the device substrate and the mounting substrate.
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Citations
21 Claims
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1. A hermetic package for a pyroelectric-sensitive electronic device, comprising:
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a device substrate having;
an active region containing an electrically conductive pattern that constitutes at least a portion of said device, and a bonding region surrounding said active region;
a non-porous mounting substrate having a bonding region thereon; and
a nonmetallic hermetic sealing adhesive, located between said bonding region of said device substrate and said bonding region of said mounting substrate, that cures at a temperature substantially below a pyroelectric sensitive temperature of said device, said active region proximate a void between said device substrate and said mounting substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
bismuth germanium oxide, gallium arsenide, lithium borate, lithium niobate, lithium tantalate, langasite, lead zirconium tantalate, and quartz.
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6. The package as recited in claim 1 wherein said mounting substrate comprises at least one selected from the group consisting of:
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ceramic, glass, and silicon.
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7. The package as recited in claim 1 wherein said adhesive comprises one selected from the group consisting of:
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acrylate, epoxy, and benzocyclobutene.
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8. The package as recited in claim 7 wherein said one is coated with a coating selected from the group consisting of:
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silicon nitride, silicon carbide, silicon oxide, aluminum nitride, and aluminum oxide.
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9. The package as recited in claim 1 wherein said device is selected from the group consisting of:
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a surface acoustic wave device, a micro-electromechanical system device, a mirror device, and a piezoelectric device.
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10. The package as recited in claim 1 wherein said device substrate and said mounting substrate have coextensive footprints.
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11. A method of manufacturing a hermetic package for a pyroelectric-sensitive electronic device, comprising:
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forming a device substrate having;
an active region containing an electrically conductive pattern that constitutes at least a portion of said device, and a bonding region surrounding said active region;
forming a non-porous mounting substrate having a bonding region thereon;
introducing a nonmetallic hermetic sealing adhesive between said bonding region of said device substrate and said bonding region of said mounting substrate; and
curing said sealing adhesive at a temperature substantially below a pyroelectric sensitive temperature of said device, said active region proximate a void between said device substrate and said mounting substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
bismuth germanium oxide, gallium arsenide, lithium borate, lithium niobate, lithium tantalate, langasite, lead zirconium tantalate, and quartz.
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16. The method as recited in claim 11 wherein said forming said non-porous mounting substrate comprises forming a mounting substrate comprising at least one selected from the group consisting of:
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ceramic, glass, and silicon.
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17. The method as recited in claim 11 wherein said introducing said adhesive comprises introducing an adhesive comprising one selected from the group consisting of:
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acrylate, epoxy, and benzocyclobutene.
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18. The method as recited in claim 17 wherein said one is coated with a coating selected from the group consisting of:
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silicon nitride, silicon carbide, silicon oxide, aluminum nitride, and aluminum oxide.
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19. The method as recited in claim 11 wherein said device is selected from the group consisting of:
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a surface acoustic wave device, a micro-electromechanical system device, a mirror device, and a piezoelectric device.
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20. The method as recited in claim 11 wherein said device substrate and said mounting substrate have coextensive footprints.
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21. A method of manufacturing a hermetic package for a plurality of surface acoustic wave (SAW) devices, comprising:
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arranging said plurality of SAW devices on a device substrate wafer such that active regions thereof are surrounded by bonding regions;
forming a non-porous mounting substrate having bonding regions thereon that correspond to said bonding regions of said device substrate wafer;
introducing a nonmetallic hermetic sealing adhesive between said bonding regions of said device substrate wafer and said bonding regions of said mounting substrate; and
curing said sealing adhesive at a temperature substantially below a pyroelectric sensitive temperature of said SAW devices, said active regions thereof proximate voids between said device substrate wafer and said mounting substrate.
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Specification