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Power semiconductor module

  • US 6,507,108 B1
  • Filed: 09/07/2000
  • Issued: 01/14/2003
  • Est. Priority Date: 09/08/1999
  • Status: Expired due to Fees
First Claim
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1. A power semiconductor module having a baseplate on which at least one substrate is arranged which is fitted with power semiconductor chips and is pressed via pressure elements against the baseplate, wherein the pressure elements have elastic and conductive contact cords which are arranged between contact rails and the substrates.

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