Power semiconductor module

• US 6,507,108 B1
• Filed: 09/07/2000
• Issued: 01/14/2003
• Est. Priority Date: 09/08/1999
• Status: Expired due to Fees

• Current Assignee: IXYS Semiconductor GmbH (Littelfuse Incorporated)
• Original Assignee: IXYS Semiconductor GmbH (Littelfuse Incorporated)
• Inventors: Leukel, Bernt, Lindemann, Andreas
• Primary Examiner(s): Ho, Hoai
• Assistant Examiner(s): TRAN, MAI HUONG C
• Application Number:
  US09/656,780
• Time in Patent Office: 859 Days
• Field of Search: 257/500, 257/675, 257/685, 257/718, 257/719, 257/723, 257/778, 257/786, 257/787, 257/789
• US Class Current: 257/724
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/30107 Inductance

Abstract

The invention relates to a power semiconductor module (10) having a baseplate (1) on which at least one substrate (13) is arranged which is fitted with power semiconductor chips (11, 12) and can be pressed via pressure elements and contact cords (17) against the baseplate (1). The baseplate (1) has centering elements on which a frame (3) which defines fields (7) and is in the form of a grid is provided, with corresponding substrates (13) with power semiconductor chips being arranged in at least some of the fields (7), which substrates (13) can be made contact with via contact rails (15).

Claims

1. A power semiconductor module having a baseplate on which at least one substrate is arranged which is fitted with power semiconductor chips and is pressed via pressure elements against the baseplate, wherein the pressure elements have elastic and conductive contact cords which are arranged between contact rails and the substrates.

2. The power semiconductor module as claimed in claim 1, wherein the contact cords have an elastic core and an electrically conductive sheath.

3. The power semiconductor module as claimed in claim 1, wherein the contact rails are provided, on a surface which makes contact with the contact cords, with a profile which is matched to them.

4. The power semiconductor module as recited in claim 1 wherein a frame which defines fields can be fixed by means of centering elements on the baseplate, with at least some of the fields accommodating corresponding substrates which are fitted with power semiconductor chips.

5. The power semiconductor module as recited in claim 4 wherein opposing rails with recesses for the pressure elements which are formed as contact rails are provided on mutually opposite sides of the frame, and wherein the opposing rails are arranged on the centering elements.

6. The power semiconductor module as recited in claim 4 wherein the centering elements are threaded bolts.

7. The power semiconductor module as recited in claim 4 wherein the frame is in the form of a grid, and wherein the grid has guides, which are formed integrally with it, for auxiliary contacts, with the auxiliary contacts producing electrical connections for at least one printed circuit board which is fitted on the contact rails.

8. The power semiconductor module as recited in claim 5 wherein pressure clips are provided on the opposing rails, which pressure clips hold down the contact rails and which are guided by centering elements.

9. The power semiconductor module as recited in claim 4 wherein the frame is in the form of a grid and is provided with raised sides.

10. The power semiconductor module as recited in claim 1 wherein the contact rails have devices, such as threaded holes, for connection of external electrical connections of the power semiconductor module which carry load current and for making large-area contact with at least one printed circuit board, which is fitted with components of a power section.