Power semiconductor module
First Claim
1. A power semiconductor module having a baseplate on which at least one substrate is arranged which is fitted with power semiconductor chips and is pressed via pressure elements against the baseplate, wherein the pressure elements have elastic and conductive contact cords which are arranged between contact rails and the substrates.
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Accused Products
Abstract
The invention relates to a power semiconductor module (10) having a baseplate (1) on which at least one substrate (13) is arranged which is fitted with power semiconductor chips (11, 12) and can be pressed via pressure elements and contact cords (17) against the baseplate (1). The baseplate (1) has centering elements on which a frame (3) which defines fields (7) and is in the form of a grid is provided, with corresponding substrates (13) with power semiconductor chips being arranged in at least some of the fields (7), which substrates (13) can be made contact with via contact rails (15).
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Citations
10 Claims
- 1. A power semiconductor module having a baseplate on which at least one substrate is arranged which is fitted with power semiconductor chips and is pressed via pressure elements against the baseplate, wherein the pressure elements have elastic and conductive contact cords which are arranged between contact rails and the substrates.
Specification