Integrated circuit package separators
First Claim
1. An integrated circuit package separator for separating integrated circuit packages from a board comprising a plurality of integrated circuit components bonded thereto, the components extending outwardly from the board, the board having a plurality of holes extending within it, the separator comprising:
- a base having a plurality of pins extending upwardly therefrom;
a support over the base and having an upper planar surface, the support having a plurality of holes extending there through and a pair of opposing ends, the pins extending through the holes and upwardly beyond the upper planar surface of the support;
the support and pins being configured such that the pins extend into the holes in the board when the board is placed over the support upper planar surface;
a pair of actuators beneath the support and configured to vertically displace the support and lift the support off the pins, the actuators comprising a first actuator proximate one of said opposing ends and a second actuator proximate the other of said opposing ends;
a panel over the support;
a plurality of blocks over the panel, the blocks having upper surfaces and being configured to support the board while leaving the integrated circuit chip components extending between the block upper surfaces and the panel; and
a cutting mechanism configured to cut the board while the board is over the panel and to thereby separate the integrated circuit packages from one another.
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Accused Products
Abstract
A base having a plurality of pins extending upwardly therefrom is provided. A support is provided over the base. The support has an upper surface and a plurality of holes extending therethrough. The pins extend through the holes and upwardly beyond the upper surface of the support. An actuator is provided beneath the support. A board having a plurality of integrated circuits bonded thereto is provided. The integrated circuits form a repeating pattern of integrated circuit packages across the board, and the board has a plurality of holes extending through it. The board is placed over the support upper surface with the pins extending into the holes in the board. While the board is over the support upper surface, it is cut to separate the integrated circuit packages from one another.
28 Citations
21 Claims
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1. An integrated circuit package separator for separating integrated circuit packages from a board comprising a plurality of integrated circuit components bonded thereto, the components extending outwardly from the board, the board having a plurality of holes extending within it, the separator comprising:
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a base having a plurality of pins extending upwardly therefrom;
a support over the base and having an upper planar surface, the support having a plurality of holes extending there through and a pair of opposing ends, the pins extending through the holes and upwardly beyond the upper planar surface of the support;
the support and pins being configured such that the pins extend into the holes in the board when the board is placed over the support upper planar surface;
a pair of actuators beneath the support and configured to vertically displace the support and lift the support off the pins, the actuators comprising a first actuator proximate one of said opposing ends and a second actuator proximate the other of said opposing ends;
a panel over the support;
a plurality of blocks over the panel, the blocks having upper surfaces and being configured to support the board while leaving the integrated circuit chip components extending between the block upper surfaces and the panel; and
a cutting mechanism configured to cut the board while the board is over the panel and to thereby separate the integrated circuit packages from one another. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification