×

Integrated circuit package separators

  • US 6,508,154 B1
  • Filed: 10/12/2000
  • Issued: 01/21/2003
  • Est. Priority Date: 10/20/1998
  • Status: Expired due to Fees
First Claim
Patent Images

1. An integrated circuit package separator for separating integrated circuit packages from a board comprising a plurality of integrated circuit components bonded thereto, the components extending outwardly from the board, the board having a plurality of holes extending within it, the separator comprising:

  • a base having a plurality of pins extending upwardly therefrom;

    a support over the base and having an upper planar surface, the support having a plurality of holes extending there through and a pair of opposing ends, the pins extending through the holes and upwardly beyond the upper planar surface of the support;

    the support and pins being configured such that the pins extend into the holes in the board when the board is placed over the support upper planar surface;

    a pair of actuators beneath the support and configured to vertically displace the support and lift the support off the pins, the actuators comprising a first actuator proximate one of said opposing ends and a second actuator proximate the other of said opposing ends;

    a panel over the support;

    a plurality of blocks over the panel, the blocks having upper surfaces and being configured to support the board while leaving the integrated circuit chip components extending between the block upper surfaces and the panel; and

    a cutting mechanism configured to cut the board while the board is over the panel and to thereby separate the integrated circuit packages from one another.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×