Assembly of opto-electronic module with improved heat sink

• US 6,508,595 B1
• Filed: 05/11/2000
• Issued: 01/21/2003
• Est. Priority Date: 05/11/2000
• Status: Expired due to Term

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Chan, Benson, Sherman, John H., Tetreault, Real, Johnson, Glen Walden, Freitag, Ladd William, Letourneau, Martial, Guindon, Francois, Fortier, Paul Francis, Galli, Gary T.
• Primary Examiner(s): Lee, John D.
• Assistant Examiner(s): STAHL, MICHAEL J
• Application Number:
  US09/569,029
• Time in Patent Office: 985 Days
• Field of Search: 385/88, 385/89, 385/92-94, 361/697, 361/703-706, 361/709, 361/710, 361/712, 361/714, 361/717-719, 361/722, 257/718-719, 257/721, 257/722, 165/80, 165/3, D13/179
• US Class Current: 385/92
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/421 the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
• CPC Class Codes: G02B 6/4245 Mounting of the opto-electronic elements
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: G02B 6/4253 by embedding housing components in an adhesive or a polymer material G02B6/4212 takes precedence
• CPC Class Codes: G02B 6/4255 Moulded or casted packages
• CPC Class Codes: G02B 6/4269 with heat sinks or radiation fins
• CPC Class Codes: G02B 6/4277 Protection against electromagnetic interference [EMI], e.g. shielding means shielding of electric apparatus H05K9/00, of instruments G12B17/00
• CPC Class Codes: G02B 6/4281 the printed circuit boards being flexible in general H05K1/147
• CPC Class Codes: G02B 6/4283 with electrical insulation means
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H01L 2224/32057 in side view
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/83385 Shape, e.g. interlocking features
• CPC Class Codes: H01L 23/3733 having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures H01L23/3732, H01L23/3737 take precedence
• CPC Class Codes: H01L 23/3737 Organic materials with or without a thermoconductive filler
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/3011 Impedance

Abstract

A heat sink for a transceiver optoelectronic module including dual direct heat paths and structure which encloses a number of chips having a central web which electrically isolates transmitter and receiver chips from each other. A retainer for an optical coupler having a port into which epoxy is poured. An overmolded base for an optoelectronic module having epoxy flow controller members built thereon. Assembly methods for an optoelectronic module including gap setting and variation of a TAB bonding process.

Claims

1. A heat sink for an electronic module including an optical coupler and a plurality of chips, each of which is located in a mount, wherein two such mounts lie in a common plane and a third mount lies in a substantially perpendicular plane to the common plane, said heat sink comprising first and second metallic surfaces which are substantially parallel to the common plane, said first and second metallic surfaces overlying the area occupied by the first and second chips, and a third metallic surface which is substantially parallel to the perpendicular plane and which overlies the area occupied by other chips.

2. The heat sink of claim 1 wherein each of the metallic surfaces is separated from a respective mount by a gap.

3. The heat sink of claim 2 wherein each gap is filled with thermal epoxy.

4. The heat sink of claim 2 wherein there are heat exchanging pin fins in proximity to the third metallic surface.

5. The heat sink of claim 4 wherein the first and second chips optically communicate respectively with first and second optical couplers which extend perpendicular from such chips and their mounts, which optical couplers are inserted in a retainer, wherein the heat sink has a cover portion which extends over the retainer.

6. The heat sink of claim 5 which is shaped so that it encloses all of the chips while physically and electrically separating the first and second chips from each other.

7. The heat sink of claim 6 wherein there is a space between the first and second mounts in the common plane and wherein the heat sink has a central metallic web which extends in the space.

8. The heat sink of claim 7 wherein the retainer is secured in a base which overlies a circuit card, and wherein the central metallic web is grounded to the circuit card.

9. The heat sink of claim 8 wherein the central metallic web has a leg which extends into a well in the base to effect the grounding.

10. The heat sink of claim 8 wherein the mount for the third chip comprises the base, and where both the top of the base and a bottom surface of the heat sink have pads for controlling the gap between the base and the heat sink.

11. The heat sink of claim 3 wherein the first and second metallic surfaces have steps, and wherein the surface of the chip mounts which oppose such surfaces have similar steps, thereby creating a stepped gap in which the epoxy resides.