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Miniaturized thermal cycler

  • US 6,509,186 B1
  • Filed: 05/01/2001
  • Issued: 01/21/2003
  • Est. Priority Date: 02/16/2001
  • Status: Expired due to Fees
First Claim
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1. A multi-chamber thermal cycler system, comprising:

  • a multi-chamber thermal cycler chip;

    a layer of a material having high thermal conductivity as well as a high level of softness, said layer being uniquely located between the thermal cycler chip and a heat sink, whereby good thermal contact and conductance between the chip and the heat sink are provided;

    a controller board, having opposing sides, that includes electrically conductive lines and tracks and electric connectors;

    means for connecting and disconnecting bond-pads on the chip to the controller board; and

    a control system for multi-channel independent parallel protocol control, including;

    electronic circuits for multi-channel analogue and digital signals communication between the controller board and a processor having programmed multiple channel parallel proportional-integral-derivative control.

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