Power module

• US 6,509,629 B2
• Filed: 01/16/2001
• Issued: 01/21/2003
• Est. Priority Date: 08/24/2000
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Yoshimatsu, Naoki, Yoshida, Takanobu
• Primary Examiner(s): ECKERT II, GEORGE C
• Application Number:
  US09/759,252
• Publication Number:
  US 20020024120A1
• Time in Patent Office: 735 Days
• Field of Search: 257/659, 257/660, 257/686, 257/690, 257/691, 257/698, 257/704, 257/706, 257/723, 257/724, 257/730, 257/731
• US Class Current: 257/660
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/0102 Calcium [Ca]
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 9/0022 : of components mounted on printed circuit boards [PCB] shields integrated within component packages H01L23/552; shields integrated within PCB H05K1/0218

Abstract

A control substrate is covered by an electromagnetic shielding member connected to a conductive base plate on which a power insulating substrate is placed. A conductive connecting member through which the electromagnetic shielding member and the conductive base plate are electrically connected to each other is inserted into a case. The control substrate and the electromagnetic shielding member are supported by the conductive connecting member.

Claims

1. A power module comprising:

a cylindrical case having an open edge at one end,

a conductive base plate having an outer peripheral edge fixed to the open edge of the cylindrical case;

an insulating substrate having a front face including a circuit pattern and a rear face connected to an upper face of the conductive base plate;

a switching semiconductor device mounted on the circuit pattern of the insulating substrate;

a control substrate having a front face and a rear face, the control substrate being disposed in the cylindrical case so that the rear face of the control substrate is opposite and spaced from the power insulating substrate by a gap;

a control component for controlling the switching semiconductor device, the control component being mounted on the control substrate;

a shielding member shielding the control substrate from electromagnetic waves, the shielding member being electrically connected to the conductive base plate; and

a rigid conductive connecting member electrically connecting the conductive base plate to the shielding member and supporting the control substrate and the shielding member.

2. The power module according to claim 1, wherein the front and rear faces of the control substrate are covered by the shielding member.

3. The power module according to claim 1, wherein the control component is mounted on both the front and rear faces of the control substrate.

4. The power module according to claim 1, wherein the conductive connecting member is in the cylindrical case.

5. The power module according to claim 1, wherein the control component is mounted on the front face of the control substrate, and the shielding member has a plate shape and is integral with the rear face of the control substrate.