Apparatus for detecting defects in patterned substrates
First Claim
1. An apparatus for detecting defects in a patterned substrate, comprising:
- a mechanical stage for positioning a charged-particle-beam optical column relative to a patterned substrate;
the charged-particle-beam optical column having a field of view (FOV) greater than approximately 100 microns with a substantially uniform resolution over the FOV, the charged-particle-beam optical column being operable to acquire a plurality of images of a region of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while the mechanical stage maintains the charged-particle-beam optical column fixed relative to the patterned substrate, each image being that of a subarea of the region and acquired at a sub-FOV; and
at least one processor operable to compare the acquired images to a reference to identify defects in the patterned substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
Defects in a patterned substrate are detected by positioning a charged-particle-beam optical column relative to a patterned substrate, the charged-particle imaging system having a field of view (FOV) with a substantially uniform resolution over the FOV; operating the charged-particle-beam optical column to acquire images over multiple subareas of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while maintaining the charged-particle-beam optical column fixed relative to the patterned substrate; and comparing the acquired images to a reference to identify defects in the patterned substrate. The use of a large-FOV imaging system with substantially uniform resolution over the FOV allows acquisition of images over a wide area of the patterned substrate without requiring mechanical stage moves, thereby reducing the time overhead associated with mechanical stage moves. Multiple columns can be ganged together to further improve throughput.
-
Citations
21 Claims
-
1. An apparatus for detecting defects in a patterned substrate, comprising:
-
a mechanical stage for positioning a charged-particle-beam optical column relative to a patterned substrate;
the charged-particle-beam optical column having a field of view (FOV) greater than approximately 100 microns with a substantially uniform resolution over the FOV, the charged-particle-beam optical column being operable to acquire a plurality of images of a region of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while the mechanical stage maintains the charged-particle-beam optical column fixed relative to the patterned substrate, each image being that of a subarea of the region and acquired at a sub-FOV; and
at least one processor operable to compare the acquired images to a reference to identify defects in the patterned substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
a second charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV, the second charged-particle-beam optical column being operable to acquire further images over multiple subareas of a region of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while the mechanical stage maintains the second charged-particle-beam optical column fixed relative to the patterned substrate; and
at least one processor operable to compare the further acquired images to a reference to identify defects in the patterned substrate.
-
-
20. An apparatus for detecting defects in a patterned substrate, comprising:
-
a mechanical stage for positioning a charged-particle-beam optical column relative to a patterned substrate;
the charged-particle-beam optical column having a field of view (FOV) greater than approximately 100 microns with a substantially uniform resolution over the FOV, the charged-particle-beam optical column being operable to acquire an image of substantially all of the FOV by scanning a charged-particle beam over the patterned substrate while the mechanical stage maintains the charged-particle-beam optical column fixed relative to the patterned substrate; and
at least one processor operable to compare the acquired images to a reference to identify defects in the patterned substrate.
-
-
21. An apparatus for detecting defects in a patterned substrate, comprising:
-
a mechanical stage for positioning at least one charged-particle-beam optical column relative to a patterned substrate;
a first charged-particle-beam optical column having a field of view (FOV) with a substantially uniform resolution over the FOV, the first charged-particle-beam optical column being operable to acquire images over multiple subareas of a region of the patterned substrate lying within the FOV by scanning a charged-particle beam over the patterned substrate while the mechanical stage maintains the first charged-particle-beam optical column fixed relative to the patterned substrate;
at least one first processor operable to compare the acquired images to a reference to identify defects in the patterned substrate;
a second charged-particle-beam optical column having a FOV with a substantially uniform resolution over the FOV, the second charged-particle-beam optical column being operable to acquire further images over multiple subareas of a region of the patterned substrate lying within the FOV by scanning a charged-particle over the patterned substrate while the mechanical stage maintains the second charged-particle-beam optical column fixed relative to the patterned substrate; and
at least one second processor operable to compare the further acquired images to a reference to identify defects in the patterned substrate.
-
Specification