Energy conditioning circuit assembly

• US 6,509,807 B1
• Filed: 04/28/2000
• Issued: 01/21/2003
• Est. Priority Date: 04/08/1997
• Status: Expired due to Fees

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, David J., Muccioli, James P., Musil, Kenneth W., Anthony, Anthony A., Anthony, William M.
• Primary Examiner(s): Pascal, Robert
• Assistant Examiner(s): GLENN, KIMBERLY E
• Application Number:
  US09/561,283
• Time in Patent Office: 998 Days
• Field of Search: 333/182, 333/185, 333/12, 361/58, 361/113, 361/118
• US Class Current: 333/12
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01R 13/719 : specially adapted for high frequency, e.g. with filters
• CPC Class Codes: H03H 1/0007 : of radio frequency interference filters
• CPC Class Codes: H04B 1/70751 : using partial detection H04B1/70758 takes precedence
• CPC Class Codes: H04B 1/70752 : Partial correlation
• CPC Class Codes: H04B 1/70775 : Multi-dwell schemes, i.e. multiple accumulation times
• CPC Class Codes: H04B 1/7093 : Matched filter type
• CPC Class Codes: H05K 1/0237 : High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/162 : incorporating printed capacitors
• CPC Class Codes: H05K 1/18 : Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 : associated with surface mounted components
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

The present invention is a component carrier consisting of a plate of insulating material having a plurality of apertures for accepting the leads of a thru-hole differential and common mode filter. Another embodiment consists of a surface mount component carrier comprised of a disk of insulating material having a plurality of apertures. The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently, embedded within electronic connectors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an energy conditioning circuit assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters. The various embodiments of component carriers provide increased physical support and protection to differential and common mode filters and substantially improve the electrical characteristics of the filters due to the increased shielding provided by the carriers. Embodiments of the carrier energy conditioning circuit assembly include integrated circuit construction for a differential and common mode filter coupled to the power bus of an integrated circuit.

Claims

1. An energy conditioning circuit assembly comprising:

a conductive substrate coupled to an energized electrical circuit, said electric circuit comprising a source of power and at least one load associated therewith;

wherein said conductive substrate comprises at least one layer having conductive ground area, a power conductive path, and a return conductive path; and

a layered architecture attached to said conductive substrate comprising at least a first and second differential electrode band and at least one common ground conductive band;

wherein said conductive ground area is electrically connected to said at least one common ground conductive band, said power conductive path and said return conductive path are electrically connected between said first and second differential electrode bands, respectively, with said power conductive path and said return conductive path are electrically isolated from one another and from said common ground conductive band; and

means for simultaneously receiving and conditioning energy propagating to said load in a differentially balanced manner.

2. The energy conditioning circuit assembly of claim 1, wherein said return conductive path and said power conductive path are concentric traces.

3. An electrical conditioning circuit assembly for an integrated circuit comprising:

a substrate carrier mounted within said integrated circuit, wherein said substrate carrier comprises at least one substrate layer having a ground plane, a power conductive path and a return conductive path for servicing at least one internal load of said integrated circuit;

wherein said power conductive path, said return conductive path, and said ground plane are positioned on said at least one substrate layer such that said power conductive path, said return conductive path, and said ground plane are all electrically isolated from one another; and

at least one differential and common mode filter having at least a first and second differential electrode band and at least one common ground conductive band;

wherein said at least one common ground conductive band is electrically connected to said ground plane;

wherein said first and second differential electrode bands are electrically connected to said power conductive path and said return conductive path with both of said paths electrically isolated from one another and from said common ground conductive band.