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High density packaging for multi-disk systems

  • US 6,510,050 B1
  • Filed: 11/21/2000
  • Issued: 01/21/2003
  • Est. Priority Date: 11/21/2000
  • Status: Active Grant
First Claim
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1. A substrate for packaging a system. comprising:

  • first one or more sections of the substrate configured to hold a two-dimensional array of disk drives;

    a second section of the substrate configured to hold circuitry for accessing said two-dimensional physical array of disk drives, wherein said circuitry comprises one or more processors; and

    a first plurality of ribs positioned in the direction of a first axis of the substrate, wherein the first plurality of ribs separate said first one or more sections from each other and from said second section.

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