High mobility FETS using A1203 as a gate oxide
First Claim
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1. A method of forming a high-k dielectric material comprising the steps of:
- (a) placing a substrate in a first chamber;
(b) forming an interfacial dielectric layer on an upper surface of said substrate at a temperature of about 300°
C. or above;
(c) transferring said substrate from said first chamber to a second chamber in a controlled gaseous ambient or vacuum, while maintaining said substrate at a temperature of about 300°
C. or above; and
(d) forming a high-k dielectric material having a dielectric constant of 4.0 or more atop said interfacial dielectric layer.
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Abstract
A method of forming a high-k dielectric material which exhibits a substantially lower amount of trap charge within a gate stack region is provided. The method maintains high-temperatures (250° C. or above) such that the substrate wafer is not cooled during the various processing steps. Such a method leads to the formation of a high-k dielectric material which does not exhibit a hysteric behavior in a capacitance-voltage curve as well as an increased mobility on FETs using conventional CMOS processing.
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Citations
38 Claims
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1. A method of forming a high-k dielectric material comprising the steps of:
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(a) placing a substrate in a first chamber;
(b) forming an interfacial dielectric layer on an upper surface of said substrate at a temperature of about 300°
C. or above;
(c) transferring said substrate from said first chamber to a second chamber in a controlled gaseous ambient or vacuum, while maintaining said substrate at a temperature of about 300°
C. or above; and
(d) forming a high-k dielectric material having a dielectric constant of 4.0 or more atop said interfacial dielectric layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A method of forming a high-k dielectric material comprising the steps of:
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(a) placing a substrate having a surface layer terminated with hydrogen in a first chamber;
(b) forming an interfacial dielectric layer on an upper surface of said substrate at a temperature of about 300°
C. or above;
(c) transferring said substrate from said first chamber to a second chamber in a controlled gaseous ambient, while maintaining said substrate at a temperature of about 300°
C. or above; and
(d) forming a high-k dielectric material having a dielectric constant of 4.0 or more atop said interfacial dielectric layer, wherein said high-k dielectric is a metal oxide. - View Dependent Claims (35, 36, 37)
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38. A method of forming a capacitor comprising the steps of:
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(a) forming a first plate electrode on a surface of a substrate within a first reactor chamber;
(b) forming an interfacial dielectric layer on an upper surface of said first plate electrode at a temperature of about 300°
C. or above;
(c) transferring said substrate from said first chamber to a second chamber in a controlled gaseous ambient or vacuum, while maintaining said substrate at a temperature of about 300°
C. or above;
(d) forming a high-k dielectric material having a dielectric constant of 4.0 or more atop said interfacial dielectric layer, and (e) forming a second plate electrode on a surface of said high-k dielectric.
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Specification