Polymer thick film heating element on a glass substrate

• US 6,512,203 B2
• Filed: 09/14/2001
• Issued: 01/28/2003
• Est. Priority Date: 05/06/1999
• Status: Expired due to Fees

• Current Assignee: Polymore Circuit Technologies Incorporated
• Original Assignee: Polymore Circuit Technologies Incorporated
• Inventors: Kimmet, Mark A., Jones, Barrie M.
• Primary Examiner(s): Bennett, Henry
• Assistant Examiner(s): Patel, Vinod D
• Application Number:
  US09/952,344
• Publication Number:
  US 20020011477A1
• Time in Patent Office: 501 Days
• Field of Search: 219/219, 219/543, 219/522, 219/203, 338/307, 338/309, 521/71
• US Class Current: 219/219
• CPC Class Codes: H05B 2203/013 Heaters using resistive films or coatings
• CPC Class Codes: H05B 2203/017 Manufacturing methods or apparatus for heaters
• CPC Class Codes: H05B 2203/02 Heaters using heating elements having a positive temperature coefficient
• CPC Class Codes: H05B 3/146 Conductive polymers, e.g. polyethylene, thermoplastics
• CPC Class Codes: H05B 3/84 Heating arrangements specially adapted for transparent or reflecting areas, e.g. for demisting or de-icing windows, mirrors or vehicle windshields
• CPC Class Codes: H05B 3/845 specially adapted for reflecting surfaces, e.g. bathroom - or rearview mirrors

Abstract

Apparatus and methods for attaching a heating element to a glass substrate. The heating element is formed of a plurality of conductive polymer thick film inks screen printed on the substrate. The heating element includes a resistive strip or resistor, conductive strips or conductors, and terminal portions, which form part of an electrical circuit. Electrical power applied to the terminal portions causes current to flow through the resistive strip, which generates heat through resistive heating. The heat is transferred to the substrate. The method of applying the heating element to the substrate includes, in one embodiment, screen printing polymer thick film materials onto a surface of a glass substrate to form the circuit conductors and resistive elements and surface mounting other components of the circuit on the substrate.

Claims

1. An apparatus for electrically heating a substrate, said apparatus comprising:

a substrate having a surface, said substrate being a glass material;

a first conductor adhered to said surface;

a second conductor adhered to said surface;

a resistive film adhered to said surface, said resistive film in electrical contact with said first conductor, said resistive film in electrical contact with said second conductor;

a temperature sensor attached to said substrate; and

a controller in electrical communication with said temperature sensor, said first conductor, and said second conductor, said controller having a circuit formed on said substrate.

2. The apparatus of claim 1 wherein said resistive film is formed from a polymer thick film ink having a specified conductivity, said resistive film being applied to said surface.

3. The apparatus of claim 1 wherein said first conductor is formed from a first conductive polymer thick film ink and said second conductor is formed from a second conductive polymer thick film ink.

4. The apparatus of claim 1 further comprising a dielectric in contact with said resistive film, said first conductor, and said second conductor.

5. The apparatus of claim 1 further comprising a backing sheet in contact with said resistive film, said first conductor, and said second conductor, whereby said backing sheet protects said resistive film, said first conductor, and said second conductor from an external environment.

6. The apparatus of claim 1 wherein said substrate is a mirror, and said surface has a reflective coating.

7. The apparatus of claim 1 wherein said controller is encapsulated in a potting compound.

8. The apparatus of claim 1 wherein said temperature sensor is a thermistor, said temperature sensor in contact with a pair of thickflm conductors adhered to said surface, and said controller includes a semiconductor switch.

9. The apparatus of claim 1 wherein said resistive film includes a plurality of strips, each of said plurality of strips extending from said first conductor to said second conductor, each of said plurality of strips in a spaced apart configuration.

10. The apparatus of claim 1 wherein said first conductor and said second conductor each having a first width at a first end and a second width at a second end, said second width being wider than said first width, each said first end having an electrical connection for energizing said resistive film.

11. An apparatus for heating a substrate, said apparatus comprising:

a substrate having a surface, said substrate being a glass material;

a first conductor adhered to said surface, said first conductor being formed from a first conductive polymer thick film ink;

a second conductor adhered to said surface, said second conductor being formed from a second conductive polymer thick film ink;

a resistive film in contact with said surface, said resistive film being formed from a first polymer thick film carbon ink having a specified conductivity, said resistive film in electrical contact with said first conductor, said resistive film in electrical contact with said second conductor, said resistive film including a plurality of strips, each of said plurality of strips extending from said first conductor to said second conductor, each of said plurality of strips in a spaced apart configuration; and

a temperature sensor attached to said substrate, said temperature sensor being a thermistor.

12. The apparatus of claim 11 further comprising a coating in contact with said resistive film, said coating in contact with said first conductor and said second conductor.

13. The apparatus of claim 11 further including a controller in electrical communication with said temperature sensor, said first conductor, and said second conductor, said controller having a circuit formed on said substrate.

14. The apparatus of claim 13 wherein said controller includes

at least one resistor in contact with said surface, said at least one resistor formed from a second polymer thick film carbon ink having a specified conductivity;

at least one interconnecting conductor in contact with said surface, said at least one interconnecting conductor formed from said conductive polymer thick film ink; and

at least one semiconductor mounted on said substrate.

15. An apparatus for heating a substrate, said apparatus comprising:

a substrate having a surface, said substrate being a glass material;

a means for heating said substrate;

a means for sensing a temperature of said substrate;

a means for controlling said means for heating; and

a means for connecting said means for controlling to an electrical power supply.

16. The apparatus of claim 15 wherein said means for controlling being mounted on said substrate.

17. A method of heating a substrate with a resistance heater printed on the substrate, said method comprising the steps of:

(a) applying a conductive polymer thick film ink to a first selected portion of a surface of a glass substrate wherein said first selected portion includes two areas that are electrically insulated from each other;

(b) applying a resistive polymer thick film ink to a second selected portion of said surface, wherein said resistive polymer thick film ink is in contact with each of said two areas;

(c) applying a first voltage to a controller mounted on said glass substrate;

(d) measuring a temperature of said glass substrate with a surface mounted sensor; and

(e) controlling said first voltage to produce a second voltage applied to said resistive polymer thick film ink and to maintain a selected temperature.

18. The method of claim 17 further comprising a step of applying a dielectric over selected portions of said conductive ink and said resistive ink.

19. The method of claim 17 further comprising a step of applying a backing sheet over said glass substrate, said conductive polymer thick film ink, and said resistive polymer thick film ink.

20. The method of claim 17 further comprising a step of applying a plurality of electrical connection pads to selected portions of said surface, said plurality of electrical connection pads being formed of solder paste, and a step of mounting at least one component to said substrate, and a step of re-flow soldering said at least one component to said plurality of electrical connection pads.