Fabrication method for integrally connected image sensor packages having a window support in contact with the window and active area

• US 6,512,219 B1
• Filed: 01/25/2000
• Issued: 01/28/2003
• Est. Priority Date: 01/25/2000
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven, Arellano, Tony, Hollaway, Roy Dale
• Primary Examiner(s): Allen, Stephone B.
• Assistant Examiner(s): Glass, Christopher W.
• Application Number:
  US09/491,112
• Time in Patent Office: 1,099 Days
• Field of Search: 250/239, 250/208.1, 257/432, 257/433, 257/434, 438/22, 438/48, 438/116
• US Class Current: 250/208.1
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A drop is applied to an active area of an image sensor. A window is pressed into the drop to form a window support. The window support is then cured, or otherwise set-up, to form an image sensor package. During use, radiation is directed at the image sensor package. This radiation passes through the window, passes through the window support, and strikes the active area, which responds to the radiation. The window and the window support are transparent to the radiation.

Claims

1. A method comprising:

applying a drop to an active area of an image sensor, wherein an image sensor substrate comprises image sensors integrally connected together, said image sensors comprising said image sensor;

pressing a window into said drop to form a window support; and

singulating said image sensor substrate subsequent to said pressing.

2. The method of claim 1 wherein said drop has an apex near a center of said drop, said window initially contacting said apex during said pressing.

3. The method of claim 2 wherein said pressing comprises squeezing said drop with said window in a first direction towards said active area.

4. The method of claim 3 wherein said drop is squeezed outwards from said apex.

5. The method of claim 4 wherein said drop has a volume sufficient to have said window support entirely cover said active area.

6. The method of claim 1 further comprising forming windows from a single sheet, said windows including said window.

7. The method of claim 1 further comprising setting-up said window support.

8. The method of claim 7 wherein said setting-up said window support further comprises curing said window support.

9. The method of claim 1 further comprising mechanically locking said window in place with a package body.

10. The method of claim 9 wherein said window has a locking feature comprising a pocket, said package body filling said pocket.

11. A method comprising:

applying a drop to an active area of an image sensor, wherein said image sensor comprises bond pads on a first surface of said image sensor, said bond pads defining a central region of said first surface inwards of said bond pads, said active area being located within said central region; and

pressing a window into said drop to form a window support comprising squeezing said drop with said window in a first direction towards said active area, wherein said drop has a volume sufficient to have said window support entirely cover said active area and insufficient to have said window support extend over any of said bond pads.

12. A method comprising:

attaching a single sheet comprising a first window and a second window to a support;

scoring said single sheet between said first window and said second window with a first cut;

cutting through said single sheet with a second cut in said first cut to singulate said first window from said second window;

removing said first window from said support;

applying a drop to an active area of an image sensor; and

pressing said first window into said drop to form a window support.

13. The method of claim 12 wherein said single sheet comprises borosilicate glass.

14. The method of claim 12 wherein said support is a sticky tape.

15. The method of claim 12 wherein said drop has an apex near a center of said drop, said first window initially contacting said apex during said pressing.

16. The method of claim 15 wherein said pressing comprises squeezing said drop outwards from said apex.